📌 Product Overview
The XL-0201UBC is a miniature, high-brightness blue Surface-Mount Device (SMD) LED engineered for extreme space-constrained applications. Its ultra-compact 0201 package (0.65 x 0.35 x 0.4 mm) is specifically designed for modern electronics where miniaturization is critical. The LED is optimized for seamless integration into automated assembly processes, making it ideal for mass production in advanced 3C products, artificial intelligence, and Internet of Things (IoT) devices.
💡 Typical Applications
- Signal Indication: Status and power indicators for compact electronic devices.
- LCD Backlight: Providing localized illumination for small LCD displays.
- 3C Products: Integration into computers, communication equipment, and consumer electronics.
- Artificial Intelligence (AI): Status indicators for AI processing units and edge devices.
- Internet of Things (IoT): Indicator LEDs for smart sensors and connected devices.
- Intelligent Wearables: Miniature status and notification lights in wearable technology.
🔒 Key Technical Specifications
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test Condition |
|---|---|---|---|---|---|---|
| Luminous Intensity | Iv | 120 | / | 240 | mcd | IF=20mA |
| Dominant Wavelength | λd | 460 | / | 475 | nm | IF=20mA |
| Peak Wavelength | λp | / | 465 | / | nm | IF=20mA |
| Forward Voltage | VF | 2.6 | / | 3.2 | V | IF=20mA |
| Viewing Angle | 2Ø1/2 | / | 120° | / | deg | IF=20mA |
| Reverse Current | IR | / | / | ≤1 | μA | VR=5V |
⚡ Absolute Maximum Ratings & Process Limits
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Max Power Dissipation | PD | 70 | mW |
| Max Continuous Forward Current | IF | 20 | mA |
| Peak Forward Current | IFP | 80 | mA |
| Max Reverse Voltage | VR | 5 | V |
| Antistatic Ability (ESD) | ESD | 2000 | V |
| Operating Temperature | TOPR | -40 to +85 | °C |
| Storage Temperature | TSTR | -40 to +85 | °C |
| Lead Soldering Temp/Time | TSOL | 260°C ≤ 6s | / |
📦 Package, Dimensions & Assembly Notes
The XL-0201UBC utilizes a standard 0201 SMD package with dimensions of 0.65 x 0.35 x 0.4 mm. It is compatible with standard EIA tape and reel packaging for automated SMT placement. The device is suitable for standard reflow soldering processes. For lead soldering, the temperature must not exceed 260°C for more than 6 seconds. The Moisture Sensitivity Level (MSL) is 3, requiring standard baking and handling procedures before reflow soldering to prevent popcorning.
🚀 Sourcing & Supply Considerations
- Binning Options: Available in brightness (D3-D6), voltage (N13-2 to N13-5), and wavelength (HB04-HB06) grades for precise application matching.
- Authenticity Verification: Source exclusively from authorized XINGLIGHT distributors to guarantee quality and avoid counterfeit components.
- Production Support: Engage with XINGLIGHT or their partners for sample requests, volume pricing, and technical support for your project's Bill of Materials (BOM).
❓ FAQ
Q: What is the primary advantage of the XL-0201UBC?
A: Its main advantage is its ultra-miniature 0201 package, which enables design in the smallest possible spaces, making it ideal for modern compact and wearable electronics.
Q: What is the Moisture Sensitivity Level (MSL) for this LED?
A: The MSL is 3, which means it requires standard baking and careful handling before the reflow soldering process to prevent internal damage from moisture.
Q: Is this LED RoHS compliant?
A: Yes, the XL-0201UBC is an environmental protection product and meets RoHS requirements.
Q: What are the recommended soldering profiles?
A: The LED is suitable for standard reflow processes. For hand soldering, the temperature must be ≤260°C for ≤6 seconds. Always follow the provided guidelines to avoid thermal damage.
Q: Can this LED be used for backlighting?
A: Yes, it is suitable for LCD backlighting applications, particularly for small displays in consumer electronics.
