📌 Product Overview
The XL-0401UWC is a high-precision, ultra-compact surface-mount LED designed for applications demanding miniaturization and reliability. With its diminutive 1.05x0.35x0.5mm footprint, this component is ideal for integration into densely populated circuit boards. Its primary focus is on providing consistent optical performance in harsh environments, making it suitable for backlighting, indicators, and status displays in automotive, industrial, and consumer electronics.
🎯 Typical Applications
- Automotive electronics: Backlight keypads, indicator lights
- Industrial products: Instrument panels, control equipment
- Consumer electronics: Mobile devices, computer peripherals
- Communication devices: Router status LEDs, TV box indicators
- General lighting: LED backlight units for small displays
🔬 Key Technical Specifications
- Luminous Intensity (Iv): 500 - 1300 mcd @ IF=20mA
- Color Temperature (TC): 12000K @ IF=20mA
- Chromaticity Coordinates (CIE 1931): X=0.3132, Y=0.3490 @ IF=20mA
- Color Rendering Index (Ra): 72 @ IF=20mA
- Forward Voltage (VF): 2.6 - 3.3V @ IF=20mA
- Viewing Angle (2Ø1/2): 120°
- Reverse Current (IR): ≤1 µA @ VR=5V
⚠️ Absolute Maximum Ratings & Process Limits
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Max Power Dissipation | PD | 70 | mW |
| Max Continuous Forward Current | IF | 20 | mA |
| Max Peak Forward Current | IFP | 80 | mA |
| Max Reverse Voltage | VR | 5 | V |
| Antistatic Ability (ESD) | 2000 | V | |
| Operating Temperature | TOPR | -40 to +85 | °C |
| Storage Temperature | TSTR | -40 to +85 | °C |
| Lead Soldering Temp/Time | TSOL | 260°C ≤ 6s |
📏 Package, Dimensions & Assembly Notes
The XL-0401UWC utilizes a standard SMD package with outline dimensions of 1.05x0.35x0.5mm. It is compliant with EIA standard packaging and is specifically designed for SMT automated production processes. The component is suitable for standard reflow soldering, with a recommended profile peak temperature not exceeding 260°C for a duration of ≤6 seconds. Its Moisture Sensitivity Level (MSL) is 3, requiring standard baking and handling procedures before assembly.
🚀 Sourcing & Supply Considerations
- Brightness & Voltage Binning: Available in graded bins (E4-F2 for brightness, M18-8-M19-5 for voltage) to ensure consistency.
- Color Zones: Multiple color zones (A2-A6) are available to match specific application requirements.
- Compliance: RoHS compliant, suitable for automotive and industrial applications requiring high reliability.
- Supply Chain: Authenticity verification is recommended; contact XINGLIGHT for direct sourcing and volume quotations.
❓ FAQ
Q: What is the recommended soldering profile for the XL-0401UWC?
A: The LED is suitable for standard reflow soldering. The peak temperature should not exceed 260°C, and the time above liquidus (TAL) should be ≤6 seconds. For lead-free processes, the peak temperature must be limited to 235°C.
Q: What are the brightness options available for the XL-0401UWC?
A: Luminous intensity is graded from E4 (500-550 mcd) to F2 (1150-1300 mcd), allowing for precise selection based on application needs. All bins have a brightness tolerance of ±10%.
Q: Can this LED be used in high-temperature automotive environments?
A: Yes, the XL-0401UWC has an operating temperature range of -40°C to +85°C, making it suitable for automotive applications. Its robust design also includes high-temperature storage and humidity testing compliance.
Q: How is the color consistency controlled for this model?
A: Color is managed through chromaticity coordinate bins (A2-A6) with an XY coordinate error of ±0.01, ensuring visual consistency across production batches.
Q: What is the Moisture Sensitivity Level, and how should it be handled?
A: The MSL is 3. Components must be stored in dry packs and baked according to JEDEC standard J-STD-033 before reflow soldering to prevent popcorning or damage.
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