📌 Product Overview
The XINGLIGHT XL-2835UWC-02 is a high-efficiency Surface Mount Device (SMD) LED designed for general illumination and backlighting. 💡 It features a compact 2.8mm x 3.5mm footprint with a height of 0.8mm, making it suitable for high-density light arrays and slim profiles.
Target applications range from indoor commercial lighting to flexible light strips. While the component provides a nominal luminous flux of up to 33 lumens, the real design focus lies in managing the 60mA drive current and 200mW power dissipation to ensure long-term reliability in compact spaces.
🚀 Typical Applications
Based on the 6500K color temperature and 120° viewing angle, the XL-2835UWC-02 is optimized for environments requiring clear, cool white light:
- Indoor Illumination: 💡 Ideal for T5/T8 fluorescent tube replacements, rigid light bars, and downlights.
- Commercial Signage: Provides consistent backlighting for advertising light boxes and channel letters.
- LCD Backlighting: Suitable for small to medium panel illumination due to low profile.
- Decorative Lighting: Flexible strip lighting where SMT automation and 120° beam spread are critical.
📊 Key Technical Specifications
These parameters are measured under standard test conditions (Ta=25°C, IF=60mA). Designers must account for variations between bins (J1-J3).
| Parameter | Symbol | Min. | Typ. | Max. | Unit |
|---|---|---|---|---|---|
| Luminous Intensity | Φ | 20 | - | 33 | LM |
| Forward Voltage | VF | 3.0 | - | 3.4 | V |
| Color Temperature | TC | 6000 | 6500 | 7000 | K |
| Viewing Angle | 2θ1/2 | - | 120 | - | Deg |
| Chromaticity (x) | X | - | 0.313 | - | - |
| Chromaticity (y) | Y | - | 0.342 | - | - |
🔒 Absolute Maximum Ratings & Process Limits
Exceeding these ratings permanently damages the LED. ⚠️ Note the strict soldering limits given the MSL 3 classification.
| Parameter | Symbol | Max. Value | Unit | Conditions |
|---|---|---|---|---|
| Max Power Dissipation | PD | 200 | mW | Ta=25°C |
| Max Forward Current | IF | 60 | mA | Continuous |
| Peak Forward Current | IFP | 150 | mA | Pulse ≤0.1ms |
| Max Reverse Voltage | VR | 5 | V | - |
| ESD Ability | ESD | 2000 | V | Human Body Model |
| Soldering Temp | TSOL | 260 | °C | ≤6 Seconds |
📦 Package, Dimensions & Assembly Notes
- Outline Dimensions: The package measures 2.8mm (L) x 3.5mm (W) x 0.8mm (H). This industry-standard footprint allows for easy replacement or upgrade in existing 2835 layouts.
- Colloid: Features a Yellow colloid for a cool white light output.
- Assembly: Designed for SMT automatic production and infrared reflow soldering.
- Reflow Profile: Max temperature 260°C for ≤6 seconds (Lead process).
- MSL Level: Level 3. Floor life is 168 hours; open bags must be baked if not used within this window to prevent moisture-induced cracking.
- Solderability: >95% wetting coverage required on pads.
📈 Sourcing & Supply Considerations
- Grading & Binning: Verify specific bin codes (Brightness J1-J3, Voltage N13-3 to N13-5, CCT UW9-10/UW11-10) to ensure color consistency in your batch.
- Compliance: The product is RoHS compliant, meeting environmental protection standards for global markets.
- Handling: Adhere to ESD precautions (2000V limit) during transportation and assembly.
- Procurement: 👇 Always verify distribution channels to ensure authentic XINGLIGHT components with valid grading data.
❓ FAQ
Q: What is the maximum forward current for continuous operation? A: The absolute maximum continuous forward current is 60mA. Exceeding this will rapidly degrade the LED junction.
Q: Can this LED be used in outdoor lighting fixtures? A: The datasheet specifies indoor and commercial applications (light boxes). While the operating temperature is -40°C to +85°C, it is primarily designed for indoor use. Outdoor use requires IP-rated protection.
Q: What does MSL Level 3 mean for my production line? A: MSL 3 means the components are sensitive to moisture. After opening the vacuum-sealed bag, you must use the components within 168 hours (1 week). If not, you must bake them at specific temperatures to remove moisture before reflow soldering to prevent "popcorning" damage.
Q: How do I select the correct bin for my design? A: You should select bins based on your lumen requirements and voltage budget. For example, Bin J3 (27-33 LM) offers the highest brightness, while Voltage Bin N13-5 (3.2-3.4V) consumes the most power.
Q: What is the typical forward voltage I should design my driver for? A: The forward voltage ranges from 3.0V to 3.4V at 60mA. Your driver design should accommodate the maximum of 3.4V to ensure consistent current regulation across all bins.
Q: Is the XL-2835UWC-02 compatible with lead-free soldering processes? A: The datasheet details a lead process max of 260°C. For lead-free (usually higher temps), consult the specific reflow profile (max 255°C+0/-5°C) outlined in the "Environmental Testing" section to ensure compatibility.
