📌 Product Overview
The XL-2835UYC-05FJ is a surface-mount device (SMD) LED from XINGLIGHT, featuring a compact 2.8x3.5x0.8mm footprint designed for automated assembly. 💡 This component utilizes a yellow chip with a water-clear colloid to emit high-intensity light, making it ideal for dense lighting arrays and backlighting. While the nominal specifications suggest standard performance, successful integration requires careful attention to thermal management at its rated 150mA drive current to ensure longevity.
🚀 Typical Applications
Based on its optical characteristics and robust package design, the XL-2835UYC-05FJ is suitable for the following scenarios:
- Indoor Illumination: Fluorescent tube replacements, rigid and flexible light strips, and downlights.
- Commercial Signage: Illuminated advertising words and light boxes where consistent color rendering is critical.
- Backlighting: LCD display backlights requiring uniform luminosity.
- Decorative Lighting: Flexible strip lighting for accent and architectural effects.
📈 Key Technical Specifications
The following table outlines the critical optoelectronic parameters under standard test conditions (Ta=25°C):
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test Conditions |
|---|---|---|---|---|---|---|
| Luminous Intensity | Φ | 13 | 20 | 27 | LM | IF = 150mA |
| Dominant Wavelength | λd | 585 | - | 595 | nm | IF = 150mA |
| Forward Voltage | VF | 1.8 | - | 2.4 | V | IF = 150mA |
| Viewing Angle | 2Ø1/2 | - | 120° | - | deg | IF = 150mA |
| Reverse Current | IR | - | - | ≤5 | μA | VR = 5V |
✨ Designers should pay close attention to the Forward Voltage (VF) range when configuring driver circuits to maintain consistent current across the LED array.
🔒 Absolute Maximum Ratings & Process Limits
Exceeding these parameters may result in permanent device failure. 👇 These limits are crucial for reliability testing and circuit protection design.
| Parameter | Symbol | Max. Value | Unit | Notes |
|---|---|---|---|---|
| Max Power Dissipation | PD | 500 | mW | Dependent on PCB thermal density |
| Max Continuous Forward Current | IF | 150 | mA | @ Ta=25°C |
| Peak Forward Current | IFP | 300 | mA | Pulse width ≤0.1ms, Duty ≤1/10 |
| Max Reverse Voltage | VR | 5 | V | - |
| ESD Ability | ESD | 2000 | V | Human Body Model (HBM) |
| Operating Temperature | TOPR | -40 ~ +85 | °C | - |
⚠️ Warning: The Moisture Sensitivity Level (MSL) is rated at Level 3. Devices must be mounted within 168 hours (1 week) of opening the dry pack or require baking to prevent popcorning during soldering.
📦 Package, Dimensions & Assembly Notes
The XL-2835UYC-05FJ utilizes the industry-standard 2835 package.
- Dimensions: 2.8mm (L) x 3.5mm (W) x 0.8mm (H).
- Soldering: Designed for Infrared Reflow soldering processes. It supports both lead-free (peak 260°C) and leaded profiles.
- Assembly: Compatible with standard SMT pick-and-place machines due to EIA standard packaging compliance.
⚡ Process Note: For the lead-free process, the max temperature is 255°C with a time limit of 5-10 seconds above peak. Ensure the thermal profile does not exceed these limits to avoid damaging the internal wire bonds.
🤝 Sourcing & Supply Considerations
When integrating the XL-2835UYC-05FJ into mass production, consider the following supply chain factors:
- Bin Selection: XINGLIGHT provides specific grading for Brightness (H8-J2), Voltage (N12-7 to N12-9), and Wavelength (HY03-HY06). Verify these bin codes match your BOM consistency requirements.
- Authenticity: Source components through authorized channels to guarantee ROHS compliance and avoid counterfeits that may not meet the 2000V ESD rating.
- Packaging: Units are supplied in EIA standard compliant taping for efficient SMT feeder loading.
❓ FAQ
Q: What is the maximum current I can drive this LED with continuously? A: The Absolute Maximum Rating for continuous forward current is 150mA. Exceeding this without proper heat sinking will likely degrade the lumen maintenance or cause immediate failure.
Q: What does the Moisture Sensitivity Level (MSL) 3 mean for my production line? A: MSL 3 means the components are sensitive to moisture. After opening the vacuum-sealed bag, you have 168 hours (7 days) to solder the components. If not used within this window, they must be baked according to J-STD-033 to remove absorbed moisture before reflow.
Q: Can I use a lead-free soldering profile for this component? A: Yes, the datasheet explicitly supports a lead-free process. The peak temperature should not exceed 255°C, and the time above this peak should be strictly controlled between 5-10 seconds.
Q: How do I select the correct bin for my lighting application? A: You should select based on your requirements for consistency. For uniform color, choose a specific Dominant Wavelength bin (e.g., HY03). For consistent brightness, select a Luminous Intensity bin (e.g., J1).
Q: What is the ESD tolerance for this model? A: The XL-2835UYC-05FJ has an antistatic ability (ESD) rating of 2000V. Ensure your assembly line uses grounded wrist straps and ionizers to handle these components safely.
