📌 Product Overview
The XL-HD2525UGC-A4 from XINGLIGHT is a high-performance surface-mount device (SMD) LED 📦. Housed in a compact 2.5mm x 2.5mm x 1.85mm package with a transparent colloid, this component is engineered to deliver high luminous flux while maintaining efficient thermal dissipation. It utilizes InGaN chip technology to generate a dominant green wavelength (Typ. 525nm), suitable for precision lighting tasks.
💡 Design focus centers on its robust power handling capabilities. With a maximum forward current of 1000mA and typical luminous flux reaching 225 lm at 700mA, this LED is optimized for applications requiring intense, localized illumination in constrained spaces. It is fully ROHS compliant and designed for long operational life with low light attenuation.
🔦 Typical Applications
Based on its high optical output and compact footprint, the XL-HD2525UGC-A4 is ideally suited for the following scenarios:
- Mobile Camera Flash: Designed for strobe functions in smartphones and mobile devices where high-intensity pulses are critical.
- Digital Video (DV) Lighting: Integration into portable lighting equipment for digital videography.
- Signal & Symbol Lighting: High-visibility indicators and status lights in industrial or consumer electronics.
- Decorative & Entertainment Lighting: Usage in ambient lighting systems requiring vibrant green hues.
- Exterior/Interior Illumination: General purpose lighting in automotive or architectural applications where space is limited.
⚡ Key Technical Specifications
The table below outlines the optoelectronic characteristics at a test temperature of 25°C.
| Parameter | Symbol | Test Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Luminous Flux | Φ | IF = 700mA | 160 | - | 225 | lm |
| Forward Voltage | VF | IF = 700mA | 2.6 | - | 3.4 | V |
| Peak Wavelength | λp | IF = 700mA | - | 525 | - | nm |
| Main Wavelength | λd | IF = 700mA | 515 | 525 | 530 | nm |
| Half-Intensity Angle | 2θ1/2 | IF = 700mA | - | 120 | - | Deg |
| Reverse Current | IR | VR = 5V | - | - | 5 | uA |
| Junction Temp | TJ | - | - | - | 125 | ℃ |
💡 Note: Binning codes are available for Brightness (K9, L1, L2), Voltage (N13-2 to N13-5), and Wavelength (HG02 to HG04) to ensure batch consistency.
⚠️ Absolute Maximum Ratings & Process Limits
Exceeding these ratings may cause permanent damage to the device. Stress testing limits are defined at Ta=25°C.
| Parameter | Symbol | Value | Unit | Notes |
|---|---|---|---|---|
| Power Dissipation | PD | 3000 | mW | - |
| Forward Current | IF | 1000 | mA | - |
| ESD Tolerance | ESD | 3000 | V | Human Body Model |
| Operating Temp | Topr | -40 to +105 | ℃ | - |
| Storage Temp | Tstg | -40 to +85 | ℃ | - |
| Soldering Temp | Tsol | 260 | ℃ | ≤ 6 Seconds |
🔒 Critical Warning: The Peak Forward Current (1000mA) is strictly for pulse conditions (Pulse width ≤ 0.1ms, Duty ≤ 1/10). Continuous operation must be derated based on thermal environment.
📦 Package, Dimensions & Assembly Notes
- Package Type: 2525 SMD (2.5mm x 2.5mm footprint).
- Dimensions: Length 2.5mm, Width 2.5mm, Height 1.85mm.
- Tolerance: ±0.25mm unless noted.
Soldering Guidelines:
- Hand Soldering: Use an iron < 30W. Tip temp ≤ 300℃. Time ≤ 3s per lead.
- Reflow Soldering: Recommended max temp: 240±5℃ for 6 seconds. Do not exceed 2 reflow cycles.
- Moisture Sensitivity: MSL Level 3. Ensure proper baking before reflow if exposed to ambient humidity.
- Mechanical Stress: Avoid applying pressure to the lens during heating to prevent cracking.
🚢 Sourcing & Supply Considerations
- Supply Chain: Verify authenticity through XINGLIGHT authorized channels to avoid counterfeit components with inconsistent binning.
- Binning Management: For mass production, specify bin codes (Brightness/Voltage) to ensure uniform color and power consumption across the final product assembly.
- MSL Handling: Since the component is rated MSL 3, confirm that your supplier provides vacuum-sealed packaging if the storage time prior to soldering is unknown.
❓ Frequently Asked Questions
Q: What is the maximum forward current for continuous operation? A: While the Absolute Maximum Rating lists 1000mA, this is typically intended for pulsed operation (flash). For continuous operation, thermal management must be considered, but the datasheet tests stability at 700mA. Always design with a safety margin relative to the Junction Temperature (Tj max 125°C).
Q: Can this LED be used for outdoor applications? A: The XL-HD2525UGC-A4 has an operating temperature range of -40°C to +105°C, which suits it for many outdoor environments. However, the "Transparent colloid" lens should be protected from direct UV exposure and physical impact, and appropriate IP-rated housing should be used.
Q: What does MSL Level 3 mean for my assembly line? A: Moisture Sensitivity Level 3 means the component can be exposed to a floor life of 168 hours (one week) at <30°C/60% RH before baking. If the vacuum seal is broken and not used within this window, the components must be baked at specific conditions (usually 125°C for 24-48 hours depending on thickness) to prevent "popcorning" damage during reflow soldering.
Q: How do I select the correct bin code for my design? A: You should select based on your optical and power budget. For example, 'L2' bins offer the highest brightness (200-225 lm), while 'N13-2' voltage bins (2.6-2.8V) will consume less power than 'N13-5' (3.2-3.4V). Tighter binning reduces variation in your final product's brightness and battery life.
Q: Is the ROHS compliance standard for all regions? A: The datasheet states it meets ROHS requirements. Generally, this refers to the European Union directive, but it often aligns with global hazardous substance restrictions. For specific regional compliance (e.g., China RoHS), verify with the factory directly.
Q: What precautions are needed for manual rework? A: Manual soldering is discouraged except for repair. If necessary, use a soldering iron under 30W, keep the temperature below 300°C, and limit contact time to under 3 seconds. Do not apply mechanical stress to the LED body while the epoxy is heated.
