XL-1608UWC-04 SMD LED: Sourcing 120° View Angle LEDs for Medical & Auto
📌 Product Overview
The XL-1608UWC-04 is a surface-mount LED from XINGLIGHT, characterized by its ultra-compact 1.6x0.8x0.6mm footprint. Engineered for low power consumption and a wide 120° viewing angle, it emits cool white light with a yellow mist epoxy coating. Its design is optimized for SMT automated production, making it ideal for space-constrained applications across medical devices, automotive electronics, and industrial equipment where reliable, miniature illumination is critical.
🚀 Typical Applications
- Medical Equipment: Endoscopes, oximeters
- Automotive Electronics: Backlight key lights, indicator lights
- Industrial Products: Electronic instrument panels, industrial equipment
- Smart Home: White appliances, nixietube LED displays
- Communication Products: Mobile phone button lamps, routers
🔬 Key Technical Specifications
| Parameter | Symbol | Min | Typ | Max | Unit | Test Conditions |
|---|---|---|---|---|---|---|
| Luminous Intensity | IV | 400 | 630 | 1000 | mcd | IF=20mA |
| Forward Voltage | VF | 2.6 | 2.8 | 3.4 | V | IF=20mA |
| Viewing Angle | 2θ1/2 | - | 120 | - | Deg | IF=20mA |
| Color Temperature | TC | 10000 | - | 33000 | K | IF=20mA |
| Brightness Bins | - | E2 | E6 | E9 | mcd | IF=20mA |
⚠️ Absolute Maximum Ratings & Process Limits
Electrical and thermal parameters that must not be exceeded to prevent permanent damage. The device is rated for a continuous forward current (IF) of 20mA and a peak pulse current (IFP) of 80mA (≤0.1ms, duty ≤1/10). Operating and storage temperature range is -40°C to +85°C. Soldering must be performed at 260°C or less for a maximum of 6 seconds to avoid component failure.
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Max Continuous Forward Current | IF | 20 | mA |
| Max Peak Forward Current | IFP | 80 | mA |
| Operating Temperature | TOPR | -40 ~ +85 | °C |
| Soldering Temp/Time | TSOL | 260°C ≤6s | °C/S |
📦 Package, Dimensions & Assembly Notes
The XL-1608UWC-04 utilizes a standard SMD package with outline dimensions of 1.6mm (L) x 0.8mm (W) x 0.6mm (H). It is compliant with EIA standard packaging and has a Moisture Sensitivity Level (MSL) of 3. Assembly requires adherence to standard SMT processes. For reflow soldering, peak temperatures must not exceed 235°C for lead-free processes or 260°C for leaded processes, with specific ramp-up and cooling rates to ensure reliability.
🔍 Sourcing & Supply Considerations
- Brightness & Voltage Binning: Critical for consistent product performance in mass production. Specify required bins (e.g., E6, M19-1) during procurement.
- Authenticity Verification: Source from authorized XINGLIGHT distributors to guarantee component authenticity and avoid counterfeit risks.
- Supply Chain Support: Engage with suppliers early for sample support and lead-time forecasts, especially for high-volume orders.
❓ FAQ
Q: What is the brightness binning for the XL-1608UWC-04? A: Brightness is graded from E2 (400-450 mcd) to E9 (900-1000 mcd) at IF=20mA, with a brightness error of ±10%.
Q: What are the key voltage grades for this LED? A: Forward Voltage (VF) is graded from M18-8 (2.6-2.7V) to M19-6 (3.3-3.4V) at IF=20mA.
Q: What is the Moisture Sensitivity Level (MSL) for SMT processing? A: The XL-1608UWC-04 has an MSL of 3, requiring standard baking and handling procedures before reflow soldering.
Q: Is this LED suitable for both leaded and lead-free soldering processes? A: Yes, it is suitable for both. The maximum soldering temperature is 260°C for ≤6 seconds, compliant with both leaded and lead-free reflow profiles.
