📌 Product Overview
The XL-HD3535UBC-A2 is a surface-mount device (SMD) LED from XINGLIGHT, featuring a 3.5mm x 3.5mm footprint with a height of 2.2mm. 💡 It utilizes a blue chip with a transparent colloid, configured for high-power light output. This component is specifically engineered to meet the rigorous demands of compact, high-luminance systems where thermal management and optical consistency are critical.
Target applications primarily focus on mobile technologies, specifically camera flash modules and DV illumination. 📈 The design supports high drive currents up to 350mA, making it suitable for pulsed operations requiring intense bursts of light. Engineers evaluating this component should prioritize its thermal dissipation capabilities relative to the PCB layout to ensure stable luminous performance over the product lifecycle.
🚀 Typical Applications
Based on the electrical characteristics and form factor of the XL-HD3535UBC-A2, the following use cases are the most relevant for engineering integration:
- Mobile Camera Flash: Designed for strobe functions in smartphones and tablets, leveraging the 700mA peak pulse capability.
- Digital Video (DV) Lighting: Provides continuous or pulsed illumination for compact video recording devices.
- Signal & Symbol Lights: Utilized in status indicators or dashboard lighting requiring high visibility.
- Decorative Lighting: Suitable for interior and exterior entertainment lighting where consistent blue color rendering is needed.
- General Illumination: Can be implemented in small-scale lighting arrays requiring efficient SMD integration.
⚡ Key Technical Specifications
The following table outlines the optical and electrical performance metrics under standard test conditions (Ta=25°C). These values are essential for BOM matching and driver circuit design.
| Parameter | Symbol | Test Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Luminous Flux | Φ | IF = 350mA | 20 | - | 40 | lm |
| Main Wavelength | λD | IF = 350mA | 455 | 465 | 470 | nm |
| Peak Wavelength | λp | IF = 350mA | - | 465 | - | nm |
| Forward Voltage | VF | IF = 350mA | 2.8 | - | 3.4 | V |
| Half Intensity Angle | 2θ1/2 | IF = 350mA | - | 130 | - | Deg |
| Reverse Current | IR | VR = 5V | - | - | 5 | uA |
| Junction Temp | TJ | - | - | - | 145 | °C |
🔒 Absolute Maximum Ratings & Process Limits
Exceeding these ratings may cause permanent device failure or significant degradation in optical performance. These limits are crucial for reliability testing and stress simulation.
| Parameter | Symbol | Value | Unit | Notes |
|---|---|---|---|---|
| Power Dissipation | PD | 1000 | mW | - |
| Forward Current | IF | 350 | mA | DC Continuous |
| Peak Forward Current | IFP | 700 | mA | Pulse width ≤0.1ms, Duty ≤1/10 |
| ESD Capability | ESD | 3000 | V | Human Body Model (HBM) |
| Operation Temp | Topr | -40 to +105 | °C | - |
| Storage Temp | Tstg | -40 to +85 | °C | - |
| Soldering Temp | Tsol | 260 | °C | ≤6 Seconds |
📦 Package, Dimensions & Assembly Notes
- Package Type: 3535 SMD (3.5mm L x 3.5mm W x 2.2mm H).
- Tolerance: Standard dimensional tolerance is ±0.25mm unless noted.
- Soldering Guidelines:
- Hand Soldering: Not recommended for production. If necessary for repair, use an iron <30W, <300°C for <3 seconds.
- Reflow Soldering: Recommended for mass production. Max 2 reflow cycles allowed.
- ⚠️ Process Warning: Avoid mechanical stress on the LED during the heating phase of soldering to prevent die damage.
🛒 Sourcing & Supply Considerations
- Binning Codes: Verify specific binning codes for Brightness (J1-J4), Voltage (N13-3 to N13-5), and Wavelength (HB03-HB05) prior to mass procurement to ensure color consistency.
- MSL Level: This component is classified as Moisture Sensitivity Level (MSL) 3. Ensure proper baking and dry packing handling before reflow to prevent popcorning.
- Authenticity: Source through XINGLIGHT authorized channels to guarantee adherence to ROHS environmental standards and reliability test criteria.
❓ FAQ
Q: What is the maximum drive current for the XL-HD3535UBC-A2? A: The maximum continuous forward current is 350mA. However, for pulse applications (like a camera flash), it can handle a peak current of 700mA provided the pulse width is ≤0.1ms and the duty cycle is ≤1/10.
Q: What is the typical forward voltage range for this LED? A: At 350mA, the forward voltage ranges from a minimum of 2.8V to a maximum of 3.4V. Designers should select driver components that accommodate this variance, specifically looking at voltage bins N13-3 through N13-5.
Q: Can this LED be used for reflow soldering? A: Yes, reflow soldering is the recommended assembly method. The datasheet specifies a maximum lead soldering temperature of 260°C for ≤6 seconds. Reflow should not be performed more than twice to prevent thermal damage to the encapsulant.
Q: What are the storage and handling requirements? A: The LED has a Moisture Sensitivity Level (MSL) of 3. It should be stored in a dry environment. If the moisture barrier bag is breached and the components are exposed, baking may be required before reflow soldering to prevent internal cracking.
Q: How is the brightness graded for this model? A: Luminous flux is graded into codes J1 through J4 at 350mA.
- J1: 20-23 lm
- J2: 23-27 lm
- J3: 27-33 lm
- J4: 33-39 lm Ensure your supply chain specification matches the required brightness bin for your application.
