CSD18533KCS N-Channel Power MOSFET

Specifications

Product Overview

CSD18533KCS is a Texas Instruments N-channel power MOSFET listed in the Power_Management category. It uses a TO-220 plastic package, KCS, with 3 pins, and is supplied in tube media with an orderable package quantity of 50. The package option addendum lists the part marking as CSD18533KCS and the operating temperature range as -55 to 175°C.

Electrical limits include 60 V drain-to-source voltage, ±20 V gate-to-source absolute maximum voltage, and -55 to 175°C operating junction and storage temperature ranges. Continuous drain current ratings are 100 A package-limited at TA=25°C, 118 A silicon-limited at TC=25°C, and 84 A silicon-limited at TC=100°C. Pulsed drain current is specified as 294 A for pulse duration ≤100 µs and duty cycle ≤1%.

For conduction and switching analysis, the datasheet specifies 5.0 mΩ typical and 6.3 mΩ maximum on-resistance at VGS=10 V, ID=75 A, TA=25°C, and 6.9 mΩ typical and 9.0 mΩ maximum at VGS=4.5 V. Gate charge is 28 nC typical at VGS=10 V and 14 nC typical at VGS=4.5 V, with switching times specified under VDS=30 V, VGS=10 V, IDS=75 A, and RG=0 Ω.

Key Features

• 60 V drain-to-source voltage rating
• 5.0 mΩ typical RDS(on) at VGS=10 V
• 6.9 mΩ typical RDS(on) at VGS=4.5 V
• 100 A package-limited continuous drain current at TA=25°C
• 294 A pulsed drain current under specified pulse conditions
• 28 nC typical total gate charge at VGS=10 V
• 1.9 V typical gate-to-source threshold voltage
• TO-220 plastic KCS package with 3 pins
• -55 to 175°C operating temperature range
• Max 0.8°C/W junction-to-case thermal resistance

Typical Applications

• Power management switching stages
• Low-voltage DC power paths
• High-current MOSFET switching
• TO-220 through-hole power assemblies
• Gate-drive evaluated power circuits
• Body-diode conduction applications

Procurement Notes

When requesting a quote for CSD18533KCS, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.