CSD18563Q5A N-channel Power MOSFET

Texas Instruments Power_Management — specifications, applications, sourcing support and RFQ.

CSD18563Q5A N-channel Power MOSFET

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
CSD18563Q5A
Manufacturer
Texas Instruments
Package
SON 5 mm x 6 mm plastic package; Q5A package, nominal dimensions 4.90 mm x 6.00 mm x 1.00 mm
Category
Power Management
Product Type
LDO Regulator

Quick Sourcing Note

CSD18563Q5A from Texas Instruments is a Power_Management N-channel power MOSFET in a SON 5 mm x 6 mm plastic Q5A package with nominal dimensions of 4.90 mm x 6.00 mm x 1.00 mm. Key ratings include 60 V drain-to-source voltage, ±20 V gate-to-source voltage, 100 A package-limited continuous drain current, and -55 to 150 °C operating junction temperature. Electrical parameters include 6.8 mΩ maximum on-resistance at VGS=10 V and ID=18 A, 20 nC maximum total gate charge at VGS=10 V, and 1.3 °C/W typical junction-to-case thermal resistance. It fits 60 V MOSFET power switching and board-level power management designs.

Specifications

TypeDescription
Part NumberCSD18563Q5A
ManufacturerTexas Instruments
Product TypeLDO Regulator
CategoryPower Management
Package / CaseSON 5 mm x 6 mm plastic package; Q5A package, nominal dimensions 4.90 mm x 6.00 mm x 1.00 mm
Drain-to-Source Voltage60 V; absolute maximum rating, TA=25°C
Gate-to-Source Voltage±20 V; absolute maximum rating, TA=25°C
Continuous Drain Current100 A; package limited
Continuous Drain Current93 A; silicon limited, TC=25°C
Continuous Drain Current15 A; TA=25°C, typical RθJA=40°C/W on 1 in² 2 oz Cu FR4 PCB
Pulsed Drain Current251 A; max RθJC=1.3°C/W, pulse duration ≤100 µs, duty cycle ≤1%
Power Dissipation3.2 W; TA=25°C, typical RθJA=40°C/W on 1 in² 2 oz Cu FR4 PCB
Power Dissipation116 W; TC=25°C
Operating Junction Temperature-55 to 150 °C; absolute maximum rating
Storage Temperature-55 to 150 °C; absolute maximum rating
Single-Pulse Avalanche Energy146 mJ; ID=54 A, L=0.1 mH, RG=25 Ω
Drain-to-Source Breakdown VoltageMin 60 V; VGS=0 V, ID=250 µA, TA=25°C
Drain-to-Source Leakage CurrentMax 1 µA; VGS=0 V, VDS=48 V, TA=25°C
Gate-to-Source Leakage CurrentMax 100 nA; VDS=0 V, VGS=20 V, TA=25°C
Gate-to-Source Threshold VoltageMin 1.7 V, Typ 2.0 V, Max 2.4 V; VDS=VGS, ID=250 µA, TA=25°C
Drain-to-Source On-ResistanceTyp 8.6 mΩ, Max 10.8 mΩ; VGS=4.5 V, ID=18 A, TA=25°C
Drain-to-Source On-ResistanceTyp 5.7 mΩ, Max 6.8 mΩ; VGS=10 V, ID=18 A, TA=25°C
TransconductanceTyp 60 S; VDS=30 V, ID=18 A, TA=25°C
Input CapacitanceTyp 1150 pF, Max 1500 pF; VGS=0 V, VDS=30 V, f=1 MHz, TA=25°C
Output CapacitanceTyp 280 pF, Max 364 pF; VGS=0 V, VDS=30 V, f=1 MHz, TA=25°C
Reverse Transfer CapacitanceTyp 3.9 pF, Max 5.1 pF; VGS=0 V, VDS=30 V, f=1 MHz, TA=25°C
Series Gate ResistanceTyp 1.5 Ω, Max 3.0 Ω; TA=25°C
Total Gate ChargeTyp 7.3 nC, Max 9.5 nC; VGS=4.5 V, VDS=30 V, ID=18 A, TA=25°C
Total Gate ChargeTyp 15 nC, Max 20 nC; VGS=10 V, VDS=30 V, ID=18 A, TA=25°C
Gate-to-Drain ChargeTyp 2.9 nC; VDS=30 V, ID=18 A, TA=25°C
Gate-to-Source ChargeTyp 3.3 nC; VDS=30 V, ID=18 A, TA=25°C
Gate Charge at ThresholdTyp 2.3 nC; TA=25°C
Output ChargeTyp 36 nC; VDS=30 V, VGS=0 V, TA=25°C
Turn-On Delay TimeTyp 3.2 ns; VDS=30 V, VGS=10 V, IDS=18 A, RG=0 Ω, TA=25°C
Rise TimeTyp 6.3 ns; VDS=30 V, VGS=10 V, IDS=18 A, RG=0 Ω, TA=25°C
Turn-Off Delay TimeTyp 11.4 ns; VDS=30 V, VGS=10 V, IDS=18 A, RG=0 Ω, TA=25°C
Fall TimeTyp 1.7 ns; VDS=30 V, VGS=10 V, IDS=18 A, RG=0 Ω, TA=25°C
Diode Forward VoltageTyp 0.8 V, Max 1 V; ISD=18 A, VGS=0 V, TA=25°C
Reverse Recovery ChargeTyp 63 nC; VDS=30 V, IF=18 A, di/dt=300 A/µs, TA=25°C
Reverse Recovery TimeTyp 49 ns; VDS=30 V, IF=18 A, di/dt=300 A/µs, TA=25°C
Junction-to-Case Thermal ResistanceTyp 1.3 °C/W; mounted on 1 in², 2 oz Cu pad on 1.5 in x 1.5 in, 0.06 in thick FR4 PCB
Junction-to-Ambient Thermal ResistanceTyp 50 °C/W; mounted on FR4 with 1 in², 2 oz Cu
Package HeightMin 0.90 mm, Nom 1.00 mm, Max 1.10 mm; Q5A package dimension A
Package Body LengthMin 4.80 mm, Nom 4.90 mm, Max 5.00 mm; Q5A package dimension D1
Package Body WidthMin 5.90 mm, Nom 6.00 mm, Max 6.10 mm; Q5A package dimension E
Package Pin PitchMin 1.17 mm, Nom 1.27 mm, Max 1.37 mm; Q5A package dimension e
Ordering OptionCSD18563Q5A, 13-inch reel, 2500 quantity, tape and reel; SON 5 mm x 6 mm plastic package
Ordering OptionCSD18563Q5AT, 7-inch reel, 250 quantity, tape and reel; SON 5 mm x 6 mm plastic package
Datasheet Statusrequest_only

Product Overview

The CSD18563Q5A is a Texas Instruments N-channel power MOSFET for Power_Management designs requiring a 60 V drain-to-source voltage rating. Absolute maximum ratings include ±20 V gate-to-source voltage, 100 A package-limited continuous drain current, 93 A silicon-limited continuous drain current at TC=25°C, and 251 A pulsed drain current under the specified short-pulse condition.

Its conduction and drive parameters include 5.7 mΩ typical and 6.8 mΩ maximum drain-to-source on-resistance at VGS=10 V and ID=18 A, plus 8.6 mΩ typical and 10.8 mΩ maximum at VGS=4.5 V. Gate charge is specified as 15 nC typical and 20 nC maximum at VGS=10 V, and 7.3 nC typical and 9.5 nC maximum at VGS=4.5 V.

The device uses a SON 5 mm x 6 mm plastic Q5A package with nominal 4.90 mm body length, 6.00 mm body width, and 1.00 mm height. Thermal data includes 1.3 °C/W typical junction-to-case resistance and 50 °C/W typical junction-to-ambient resistance on the specified FR4 copper board.

Key Features

  • 60 V drain-to-source absolute maximum rating
  • ±20 V gate-to-source absolute maximum rating
  • 100 A package-limited continuous drain current
  • 251 A pulsed drain current under specified pulse conditions
  • 6.8 mΩ maximum RDS(on) at 10 V gate drive
  • 20 nC maximum total gate charge at 10 V gate drive
  • 3.2 ns typical turn-on delay at 18 A
  • 49 ns typical reverse recovery time at 18 A
  • 1.3 °C/W typical junction-to-case thermal resistance
  • SON 5 mm x 6 mm Q5A plastic package

Typical Applications

  • 60 V MOSFET power stages
  • Board-level power management switching
  • Low-resistance power path switching
  • Gate-driven 18 A switching circuits
  • FR4-mounted power assemblies
  • Designs requiring SON 5 mm x 6 mm packaging

Procurement Notes

When requesting a quote for CSD18563Q5A, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.

FAQ

What type of device is the CSD18563Q5A?

CSD18563Q5A is an N-channel power MOSFET from Texas Instruments in the Power_Management category. It is supplied in a SON 5 mm x 6 mm plastic Q5A package with nominal 4.90 mm x 6.00 mm x 1.00 mm dimensions.

What voltage ratings are specified for CSD18563Q5A?

The drain-to-source voltage absolute maximum rating is 60 V at TA=25°C. The drain-to-source breakdown voltage is specified as minimum 60 V with VGS=0 V, ID=250 µA, and TA=25°C. Gate-to-source voltage is rated at ±20 V.

What on-resistance does CSD18563Q5A provide?

At VGS=10 V and ID=18 A, the drain-to-source on-resistance is 5.7 mΩ typical and 6.8 mΩ maximum. At VGS=4.5 V and ID=18 A, it is 8.6 mΩ typical and 10.8 mΩ maximum.

What package dimensions are listed for the Q5A package?

The Q5A package has a height of 0.90 mm minimum, 1.00 mm nominal, and 1.10 mm maximum. Body length is 4.80 mm to 5.00 mm with 4.90 mm nominal, and body width is 5.90 mm to 6.10 mm with 6.00 mm nominal.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 13, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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