DRV5011 Digital-Latch Hall Effect Sensor

Texas Instruments Sensor — specifications, applications, sourcing support and RFQ.

DRV5011 Digital-Latch Hall Effect Sensor

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Part Number
DRV5011
Manufacturer
Texas Instruments
Package
DSBGA-4 0.80 mm x 0.80 mm; SOT-23-3 2.92 mm x 1.30 mm; X2SON-4 1.10 mm x 1.40 mm; TO-92-3 4.00 mm x 3.15 mm
Category
Sensor
Product Type
Digital-latch Hall effect sensor

Quick Sourcing Note

DRV5011 from Texas Instruments is a Sensor classified as a digital-latch Hall effect sensor for motors and rotary systems. It is offered in DSBGA-4, SOT-23-3, X2SON-4, and TO-92-3 package options, with package sizes from 0.80 mm x 0.80 mm to 4.00 mm x 3.15 mm. Key parameters include 2.5 to 5.5 V recommended supply operation, 30 kHz sensing bandwidth, ±2 mT typical magnetic sensitivity, and 4 mT typical hysteresis. The push-pull CMOS output sources 5 mA, sinks 20 mA, and drives low with a south pole or high with a north pole.

Specifications

TypeDescription
Part NumberDRV5011
ManufacturerTexas Instruments
Product TypeDigital-latch Hall effect sensor
CategorySensor
Package / CaseDSBGA-4 0.80 mm x 0.80 mm; SOT-23-3 2.92 mm x 1.30 mm; X2SON-4 1.10 mm x 1.40 mm; TO-92-3 4.00 mm x 3.15 mm
Sensor TypeDigital-latch Hall effect sensor; designed for motors and rotary systems
Magnetic Sensitivity±2 mT typical; high magnetic sensitivity
Magnetic Hysteresis4 mT typical; robust hysteresis
Sensing Bandwidth30 kHz; magnetic characteristics
Recommended Supply Voltage2.5 to 5.5 V; recommended operating conditions
Absolute Maximum Power-Supply Voltage-0.3 to 5.5 V; over operating free-air temperature range
Power-Supply Voltage Slew RateUnlimited V/µs; absolute maximum ratings
Recommended Output Voltage0 to VCC V; recommended operating conditions
Absolute Maximum Output Voltage-0.3 to VCC + 0.3 V; over operating free-air temperature range
Recommended Output Current-5 to 20 mA; device-sourced current is negative, device-sunk current is positive
Absolute Maximum Output Current-5 to 30 mA; absolute maximum ratings
Source Current Capability5 mA; push-pull CMOS output
Sink Current Capability20 mA; push-pull CMOS output
Operating Ambient Temperature-40 to 135 °C; SOT-23 DBZ, X2SON DMR, and TO-92 LPG packages
Operating Ambient Temperature-40 to 125 °C; DSBGA YBH package
Operating Junction Temperature140 °C max; recommended operating conditions and absolute maximum ratings
Storage Temperature-65 to 150 °C; absolute maximum ratings
Magnetic Flux DensityUnlimited T; absolute maximum ratings
HBM ESD Rating±6000 V; human-body model per ANSI/ESDA/JEDEC JS-001
CDM ESD Rating±750 V; charged-device model per JEDEC JESD22-C101
Operating Supply Current2.3 mA typical, 3 mA max; VCC = 2.5 V to 5.5 V over operating free-air temperature range
Power-On Time40 µs typical, 70 µs max; VCC = 2.5 V to 5.5 V
Propagation Delay Time13 µs typical, 25 µs max; from change in B to change in OUT, VCC = 2.5 V to 5.5 V
High-Level Output VoltageVCC - 0.35 V min, VCC - 0.1 V typical; IO = -1 mA, VCC = 2.5 V to 5.5 V
Low-Level Output Voltage0.15 V typical, 0.4 V max; IO = 20 mA, VCC = 2.5 V to 5.5 V
Magnetic Threshold Operate Point0.6 mT min, 2 mT typical, 3.8 mT max; VCC = 2.5 V to 5.5 V over operating free-air temperature range
Magnetic Threshold Release Point-3.8 mT min, -2 mT typical, -0.6 mT max; VCC = 2.5 V to 5.5 V over operating free-air temperature range
Magnetic Hysteresis2 mT min, 4 mT typical, 6 mT max; |BOP - BRP|, VCC = 2.5 V to 5.5 V
Output Driver TypePush-pull CMOS output; drives VCC or ground level, no pullup resistor required
Output State with South PoleOutput drives low; south magnetic pole near top of package and BOP threshold exceeded
Output State with North PoleOutput drives high; north pole applied and BRP threshold crossed
Minimum Bypass Capacitor0.01 µF; TI recommends ceramic capacitor from VCC to ground
Junction-to-Ambient Thermal Resistance356 °C/W; DBZ SOT-23 package
Junction-to-Ambient Thermal Resistance159 °C/W; DMR X2SON package
Junction-to-Ambient Thermal Resistance194.1 °C/W; YBH DSBGA package
Junction-to-Ambient Thermal Resistance183.1 °C/W; LPG TO-92 package
Hall Element Location Depth650 µm; SOT-23 side view
Hall Element Location Depth250 µm; X2SON side view
Hall Element Location Depth150 µm; DSBGA side view
Hall Element Location Depth1030 µm; TO-92 side view
Datasheet Statusrequest_only

Product Overview

The DRV5011 is a Texas Instruments digital-latch Hall effect sensor in the Sensor category. It is designed for motors and rotary systems, using magnetic threshold behavior to latch the output state. A south magnetic pole near the top of the package drives the output low after the BOP threshold is exceeded, while a north pole drives the output high after the BRP threshold is crossed.

Electrical operation is specified from 2.5 to 5.5 V recommended supply voltage, with 2.3 mA typical and 3 mA maximum operating supply current. Magnetic characteristics include 30 kHz sensing bandwidth, 0.6 mT to 3.8 mT operate threshold range, -3.8 mT to -0.6 mT release threshold range, and 2 mT to 6 mT hysteresis range.

The device uses a push-pull CMOS output that drives VCC or ground level without a pullup resistor. Package options include DSBGA-4, SOT-23-3, X2SON-4, and TO-92-3, with Hall element location depths specified for each package. TI recommends a minimum 0.01 µF ceramic bypass capacitor from VCC to ground.

Key Features

  • Digital-latch Hall effect sensor for motors and rotary systems
  • ±2 mT typical magnetic sensitivity
  • 4 mT typical magnetic hysteresis
  • 30 kHz sensing bandwidth
  • 2.5 to 5.5 V recommended supply range
  • Push-pull CMOS output requires no pullup resistor
  • 5 mA source and 20 mA sink capability
  • 40 µs typical power-on time
  • 13 µs typical propagation delay
  • 0.01 µF minimum ceramic bypass capacitor recommended

Typical Applications

  • Motor position sensing
  • Rotary system sensing
  • South pole threshold detection
  • North pole release detection
  • Push-pull CMOS output interfaces
  • Compact Hall sensing assemblies

Procurement Notes

When requesting a quote for DRV5011, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For MCU, processor and logic IC sourcing, package, operating voltage, temperature grade, speed or frequency grade, firmware or mask version, lifecycle status and programming requirements should be checked before approval.

FAQ

What type of sensor is the DRV5011?

The DRV5011 is a Texas Instruments digital-latch Hall effect sensor. The extracted datasheet facts describe it as designed for motors and rotary systems, with magnetic operate and release thresholds controlling the output state.

What supply voltage range is recommended for DRV5011?

The recommended supply voltage range is 2.5 to 5.5 V. Within this range, the operating supply current is specified as 2.3 mA typical and 3 mA maximum over the operating free-air temperature range.

How does the DRV5011 output respond to magnetic poles?

With a south magnetic pole near the top of the package and the BOP threshold exceeded, the output drives low. With a north pole applied and the BRP threshold crossed, the output drives high.

Which package options are listed for DRV5011?

The extracted package options are DSBGA-4 0.80 mm x 0.80 mm, SOT-23-3 2.92 mm x 1.30 mm, X2SON-4 1.10 mm x 1.40 mm, and TO-92-3 4.00 mm x 3.15 mm.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 12, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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