Specifications
| Type | Description |
|---|---|
| Part Number | DRV8804 |
| Manufacturer | Texas Instruments |
| Product Type | LDO Regulator |
| Category | Power Management |
| Package Case | SOIC (20) 12.80mm x 7.50mm body, HTSSOP (16) 5.00mm x 4.40mm body, SOT-23-THN (16) 4.20mm x 2.00mm body |
| Number of Output Channels | 4; Protected low-side driver outputs |
| Output Switch Type | N-channel MOSFET low-side switches; Four integrated MOSFET outputs |
| Interface Type | Serial interface with SDATIN, SCLK, LATCH, SDATOUT; Supports daisy-chain control of multiple devices |
| Operating Supply Voltage | 8.2 to 60 V; Recommended operating conditions, VM |
| Output Clamp Voltage | 0 to 60 V; Recommended operating conditions, VCLAMP; clamp diode supply only |
| Continuous Output Current | 1.5 A; Single channel on, TA = 25°C, SOIC package; thermal limits observed |
| Continuous Output Current | 0.8 A; Four channels on, TA = 25°C, SOIC package; thermal limits observed |
| Continuous Output Current | 2 A; Single channel on, TA = 25°C, HTSSOP package; thermal limits observed |
| Continuous Output Current | 1 A; Four channels on, TA = 25°C, HTSSOP package; thermal limits observed |
| Continuous Output Current | 1.9 A; Single channel on, TA = 25°C, DYZ package; thermal limits observed |
| Continuous Output Current | 0.9 A; Four channels on, TA = 25°C, DYZ package; thermal limits observed |
| Absolute Maximum Supply Voltage | -0.3 to 65 V; VM, over operating free-air temperature range |
| Absolute Maximum Output Voltage | -0.3 to 65 V; VOUTx, over operating free-air temperature range |
| Absolute Maximum Clamp Voltage | -0.3 to 65 V; VCLAMP, over operating free-air temperature range |
| Digital Input Pin Voltage | -0.5 to 7 V; Absolute maximum rating |
| Digital Output Pin Voltage | -0.5 to 7 V; SDATOUT and nFAULT absolute maximum rating |
| SDATOUT and nFAULT Output Current | 20 mA max; Absolute maximum rating |
| Peak Clamp Diode Current | 2 A max; Absolute maximum rating |
| DC or RMS Clamp Diode Current | 1 A max; Absolute maximum rating |
| Operating Junction Temperature | -40 to 150 °C; Absolute maximum rating, TJ |
| Storage Temperature | -60 to 150 °C; Absolute maximum rating, Tstg |
| ESD Rating HBM | ±3000 V; Human body model per ANSI/ESDA/JEDEC JS-001, all pins |
| ESD Rating CDM | ±1000 V; Charged device model per JEDEC JESD22-C101, all pins |
| VM Operating Supply Current | 1.6 mA typ, 2.1 mA max; VM = 24 V, TA = 25°C |
| VM Undervoltage Lockout Voltage | 8.2 V; VM rising, TA = 25°C |
| Input Low Voltage | 0.6 V min, 0.7 V max; Logic-level Schmitt trigger inputs, TA = 25°C |
| Input High Voltage | 2 V min; Logic-level Schmitt trigger inputs, TA = 25°C |
| Input Hysteresis | 0.45 V typ; Logic-level Schmitt trigger inputs, TA = 25°C |
| Input Low Current | -20 to 20 µA; VIN = 0 V, TA = 25°C |
| Input High Current | 100 µA max; VIN = 3.3 V, TA = 25°C |
| Input Pulldown Resistance | 100 kΩ typ; Logic inputs |
| nFAULT Output Type | Open-drain; Logic low during overtemperature or overcurrent fault |
| nFAULT Output Low Voltage | 0.5 V max; IO = 5 mA, TA = 25°C |
| nFAULT Output High Leakage Current | 1 µA max; VO = 3.3 V, TA = 25°C |
| SDATOUT Output Type | Push-pull; Serial data output |
| SDATOUT Output Low Voltage | 0.5 V max; IO = 5 mA, TA = 25°C |
| SDATOUT Output High Voltage | 6.5 V peak; IO = 100 µA, VM = 11 V to 60 V |
| SDATOUT Output High Voltage | 3.3 V min, 4.5 V typ, 5.6 V max; IO = 100 µA, VM = 11 V to 60 V, steady state |
| SDATOUT Output High Voltage | 2.5 V min; IO = 100 µA, VM = 8.2 V to 11 V, steady state |
| SDATOUT Source Current | 1 mA; VM = 24 V, TA = 25°C |
| SDATOUT Sink Current | 5 mA; VM = 24 V, TA = 25°C |
| FET On Resistance | 0.5 Ω typ; HTSSOP and SOIC packages, VM = 24 V, IO = 700 mA, TJ = 25°C |
| FET On Resistance | 0.75 Ω typ, 0.8 Ω max; HTSSOP and SOIC packages, VM = 24 V, IO = 700 mA, TJ = 85°C |
| FET On Resistance | 0.4 Ω typ; SOT-23-THN package, VM = 24 V, IO = 700 mA, TJ = 25°C |
| FET On Resistance | 0.64 Ω typ; SOT-23-THN package, VM = 24 V, IO = 700 mA, TJ = 85°C |
| FET Off-State Leakage Current | -50 to 50 µA; Low-side FETs, TA = 25°C |
| High-Side Diode Forward Voltage | 1.2 V typ; VM = 24 V, IO = 700 mA, TJ = 25°C |
| High-Side Diode Off-State Leakage Current | -50 to 50 µA; VM = 24 V, TJ = 25°C |
| Output Rise Time | 50 ns typ, 300 ns max; VM = 24 V, IO = 700 mA, resistive load |
| Output Fall Time | 50 ns typ, 300 ns max; VM = 24 V, IO = 700 mA, resistive load |
| Overcurrent Protection Trip Level | 2.3 A min, 3.8 A max; Protection circuits, TA = 25°C |
| Overcurrent Protection Deglitch Time | 3.5 µs typ; Protection circuits, TA = 25°C |
| Overcurrent Protection Retry Time | 1.2 ms typ; Protection circuits, TA = 25°C |
| Thermal Shutdown Temperature | 150 °C min, 160 °C typ, 180 °C max; Die temperature, not production tested |
| Junction-to-Ambient Thermal Resistance | 67.7 °C/W; DW SOIC, 20 pins |
| Junction-to-Ambient Thermal Resistance | 39.6 °C/W; PWP HTSSOP, 16 pins |
| Junction-to-Ambient Thermal Resistance | 53.2 °C/W; DYZ SOT-23-THN, 16 pins |
| Junction-to-Case Top Thermal Resistance | 32.9 °C/W; DW SOIC, 20 pins |
| Junction-to-Case Top Thermal Resistance | 24.6 °C/W; PWP HTSSOP, 16 pins |
| Junction-to-Case Top Thermal Resistance | 76.8 °C/W; DYZ SOT-23-THN, 16 pins |
| Clock Cycle Time | 62 ns min; Timing requirements over operating free-air temperature range |
| Clock High Time | 25 ns min; Timing requirements over operating free-air temperature range |
| Clock Low Time | 25 ns min; Timing requirements over operating free-air temperature range |
| SDATIN Setup Time to SCLK | 5 ns min; Timing requirements over operating free-air temperature range |
| SDATIN Hold Time to SCLK | 1 ns min; Timing requirements over operating free-air temperature range |
| SCLK to SDATOUT Delay Time | 50 ns min, 100 ns max; No external pullup resistor, COUT = 100 pF |
| LATCH Pulse Width | 200 ns min; Timing requirements over operating free-air temperature range |
| nENBL to Output Low Enable Time | 60 ns min; Timing requirements over operating free-air temperature range |
| LATCH to Output Change Delay Time | 200 ns max; Timing requirements over operating free-air temperature range |
| RESET Pulse Width | 20 µs min; Timing requirements over operating free-air temperature range |
| Reset Delay Before Clock | 20 µs min; Timing requirements over operating free-air temperature range |
| Start-Up Delay | 55 µs min; VM applied before clock |
| Final SCLK to LATCH Delay | More than 400 ns; Delay between final SCLK rising edge and LATCH rising edge |
| Datasheet Status | request_only |
Product Overview
The DRV8804 is a Texas Instruments quad low-side driver IC in the Power_Management category. Its output stage integrates four protected N-channel MOSFET low-side switches, controlled through a serial interface using SDATIN, SCLK, LATCH, and SDATOUT. The interface supports daisy-chain control of multiple devices for expanded output count.
Recommended operating conditions specify an 8.2 to 60 V VM supply range and a 0 to 60 V VCLAMP range for the clamp diode supply. Continuous output current depends on package and channel count, with ratings including 2 A for a single HTSSOP channel at TA = 25°C and 1 A with four HTSSOP channels on, subject to thermal limits.
The device includes overcurrent protection, thermal shutdown behavior, nFAULT open-drain fault output, Schmitt-trigger logic inputs, and a push-pull SDATOUT output. Package cases include 20-pin SOIC, 16-pin HTSSOP, and 16-pin SOT-23-THN options, supporting assembly choices where body size and thermal resistance are design factors.
Key Features
- Four protected low-side driver output channels
- Integrated N-channel MOSFET low-side switches
- Serial SDATIN, SCLK, LATCH, SDATOUT interface
- Daisy-chain control for multiple DRV8804 devices
- 8.2 to 60 V recommended VM supply range
- 0 to 60 V VCLAMP clamp diode supply
- Open-drain nFAULT output for overtemperature or overcurrent
- Push-pull SDATOUT serial data output
- Typical 0.5 Ω FET resistance in HTSSOP and SOIC
- Overcurrent protection with 3.5 µs typical deglitch time
- Thermal shutdown at 160 °C typical die temperature
- SOIC, HTSSOP, and SOT-23-THN package options
Typical Applications
- Serially controlled low-side switching
- Daisy-chained output expansion
- Multi-channel MOSFET output control
- Fault-monitored power output stages
- Resistive load switching
- Clamp-diode load driving
- Logic-controlled power management outputs
Procurement Notes
When requesting a quote for DRV8804, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.
FAQ
How many output channels does the DRV8804 provide?
The DRV8804 provides four protected low-side driver outputs. The output switches are integrated N-channel MOSFET low-side switches, and the device is described as a quad low-side driver IC.
What supply voltage range is recommended for DRV8804 operation?
The recommended VM operating supply voltage range is 8.2 to 60 V. The VCLAMP clamp diode supply has a recommended operating range of 0 to 60 V and is specified as the clamp diode supply only.
What interface does the DRV8804 use for control?
The DRV8804 uses a serial interface with SDATIN, SCLK, LATCH, and SDATOUT pins. The extracted datasheet facts state that this interface supports daisy-chain control of multiple devices.
What fault indication output is available on the DRV8804?
The nFAULT output is open-drain and goes logic low during an overtemperature or overcurrent fault. Its output low voltage is specified as 0.5 V maximum at IO = 5 mA and TA = 25°C.
Which package options are listed for the DRV8804?
The listed package cases are SOIC (20) with a 12.80 mm x 7.50 mm body, HTSSOP (16) with a 5.00 mm x 4.40 mm body, and SOT-23-THN (16) with a 4.20 mm x 2.00 mm body.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 21, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.