Specifications
| Type | Description |
|---|---|
| Part Number | EL_HIR204C-H0 |
| Manufacturer | EVERLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 3.0mm through-hole infrared LED, water clear transparent plastic package, 2.54mm lead spacing |
| Chip Material | GaAlAs |
| Lens Color | Water clear |
| Peak Wavelength | 850 nm |
| Lead Spacing | 2.54 mm |
| Continuous Forward Current | 100 mA |
| Peak Forward Current | 1.0 A |
| Reverse Voltage | 5 V |
| Operating Temperature | -40 to +85 °C |
| Storage Temperature | -40 to +85 °C |
| Soldering Temperature | 260 °C, soldering time <=5 seconds |
| Power Dissipation | 150 mW at or below 25°C free air temperature |
| Radiant Intensity at 20 mA | Min 11 mW/sr, Typ 20 mW/sr, IF=20 mA, Ta=25°C |
| Radiant Intensity at 100 mA Pulse | Typ 40 mW/sr, IF=100 mA, pulse width <=100 us, duty <=1%, Ta=25°C |
| Peak Wavelength at 20 mA | Typ 850 nm, IF=20 mA, Ta=25°C |
| Spectral Bandwidth | Typ 45 nm, IF=20 mA, Ta=25°C |
| Forward Voltage at 20 mA | Typ 1.45 V, Max 1.65 V, IF=20 mA, Ta=25°C |
| Forward Voltage at 100 mA Pulse | Typ 1.80 V, Max 2.40 V, IF=100 mA, pulse width <=100 us, duty <=1%, Ta=25°C |
| Reverse Current | Max 10 uA, VR=5 V, Ta=25°C |
| View Angle | Typ 40 deg, 2θ1/2, IF=20 mA, Ta=25°C |
| Radiant Intensity Rank N | Min 11.0 mW/sr, Max 17.6 mW/sr, IF=20 mA |
| Radiant Intensity Rank P | Min 15.0 mW/sr, Max 24.0 mW/sr, IF=20 mA |
| Radiant Intensity Rank Q | Min 21.0 mW/sr, Max 34.0 mW/sr, IF=20 mA |
| Radiant Intensity Rank R | Min 30 mW/sr, Max 48 mW/sr, IF=20 mA |
| Forward Voltage Measurement Uncertainty | +/-0.1 V |
| Luminous Intensity Measurement Uncertainty | +/-10% |
| Dominant Wavelength Measurement Uncertainty | +/-1.0 nm |
| Hand Soldering Tip Temperature | 300°C max, 30 W max, soldering time 3 sec max, distance 3 mm min from solder joint to epoxy bulb |
| DIP Soldering Preheat Temperature | 100°C max, 60 sec max |
| DIP Soldering Bath Temperature and Time | 260°C max, 5 sec max, distance 3 mm min from solder joint to epoxy bulb |
| Packing Quantity | 200 to 1000 pcs per bag, 5 bags per inner carton, 10 inner cartons per outside carton |
| Datasheet Status | request_only |
Product Overview
EL_HIR204C-H0 is an EVERLIGHT 3mm infrared emitting diode built with GaAlAs chip material. The package is a 3.0 mm through-hole infrared LED with a water clear transparent plastic lens and 2.54 mm lead spacing, supporting PCB mounting where leaded assembly is specified.
The optical output is centered at 850 nm, with typical 45 nm spectral bandwidth at IF=20 mA and Ta=25°C. Radiant intensity is specified as minimum 11 mW/sr and typical 20 mW/sr at 20 mA, with a typical 40 mW/sr value at 100 mA under pulse width <=100 us and duty <=1% conditions. The typical view angle is 40 deg.
Electrical limits include 100 mA continuous forward current, 1.0 A peak forward current for the stated pulse condition, 5 V reverse voltage, and 150 mW power dissipation at or below 25°C free air temperature. Assembly guidance includes 260°C soldering for <=5 seconds, hand soldering at 300°C max for 3 seconds max, and DIP soldering with 100°C max preheat.
Key Features
- GaAlAs chip material for infrared emission
- Water clear transparent 3.0 mm through-hole package
- 850 nm peak wavelength from feature summary
- 2.54 mm lead spacing for PCB mounting
- 100 mA continuous forward current rating
- 1.0 A pulsed peak forward current rating
- Typical 40 deg view angle at 20 mA
- 150 mW power dissipation at 25°C free air
- Operating and storage range -40 to +85°C
- Radiant intensity ranks N, P, Q, and R
Typical Applications
- 850 nm infrared emitter positions
- Through-hole infrared sensing assemblies
- Pulsed infrared emitter circuits
- Optical detection emitter boards
- Water-clear IR LED assemblies
- Lead-mounted infrared source modules
Procurement Notes
When requesting a quote for EL_HIR204C-H0, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What package is used for EL_HIR204C-H0?
EL_HIR204C-H0 uses a 3.0 mm through-hole infrared LED package with a water clear transparent plastic body and 2.54 mm lead spacing.
What is the peak wavelength of this infrared LED?
The peak wavelength is specified as 850 nm. At IF=20 mA and Ta=25°C, the electro-optical characteristics list a typical peak wavelength of 850 nm.
What current ratings apply to EL_HIR204C-H0?
The absolute maximum continuous forward current is 100 mA. Peak forward current is 1.0 A when pulse width is <=100 us and duty cycle is <=1% at Ta=25°C.
What soldering limits are specified for this part?
The absolute maximum soldering temperature is 260°C for <=5 seconds. Hand soldering allows a 300°C max tip temperature for 3 seconds max with the specified distance from solder joint to epoxy bulb.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.