FDB8447L N-Channel PowerTrench MOSFET

ON Semiconductor Power_Management — specifications, applications, sourcing support and RFQ.

FDB8447L N-Channel PowerTrench MOSFET

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
FDB8447L
Manufacturer
ON Semiconductor
Package
TO-263AB
Category
Power Management
Product Type
LDO Regulator

Quick Sourcing Note

FDB8447L from ON Semiconductor is an N-Channel PowerTrench MOSFET in a TO-263AB package for Power_Management designs. Key ratings include 40 V drain-to-source voltage, ±20 V gate-to-source voltage, 50 A package-limited continuous drain current at TC=25°C, and 100 A pulsed drain current. The device has specified on-resistance values down to typ 7.4 mΩ at VGS=10 V and ID=14 A, with gate charge, capacitance, switching, diode recovery, avalanche energy, and thermal resistance data provided for power switching and current-control applications.

Specifications

TypeDescription
Part NumberFDB8447L
ManufacturerON Semiconductor
Product TypeLDO Regulator
CategoryPower Management
Package / CaseTO-263AB
Drain to Source Voltage40 V; maximum rating, TC=25°C
Gate to Source Voltage±20 V; maximum rating, TC=25°C
Continuous Drain Current50 A; package limited, TC=25°C
Continuous Drain Current66 A; silicon limited, TC=25°C, Note 1
Continuous Drain Current15 A; TA=25°C, Note 1a
Pulsed Drain Current100 A; maximum rating
Drain-Source Avalanche Energy153 mJ; starting TJ=25°C, L=1mH, IAS=17.5A, VDD=40V, VGS=10V
Power Dissipation60 W; TC=25°C
Power Dissipation3.1 W; TA=25°C, Note 1a
Operating Junction Temperature Range-55 to +150 °C; maximum rating
Storage Junction Temperature Range-55 to +150 °C; maximum rating
Thermal Resistance Junction to Case2.1 °C/W; RθJC, Note 1
Thermal Resistance Junction to Ambient40 °C/W; RθJA, mounted on 1 in² pad of 2 oz copper, Note 1a
Thermal Resistance Junction to Ambient62.5 °C/W; RθJA, mounted on minimum pad, Note 1b
Drain to Source Breakdown Voltagemin 40 V; ID=250 µA, VGS=0 V
Breakdown Voltage Temperature Coefficienttyp 35 mV/°C; ID=250 µA, referenced to 25°C
Zero Gate Voltage Drain Currentmax 1 µA; VDS=32 V, VGS=0 V
Gate to Source Leakage Currentmax ±100 nA; VGS=±20 V, VDS=0 V
Gate to Source Threshold Voltagemin 1 V, typ 1.9 V, max 3 V; VGS=VDS, ID=250 µA
Gate to Source Threshold Voltage Temperature Coefficienttyp -5 mV/°C; ID=250 µA, referenced to 25°C
Static Drain to Source On Resistancetyp 7.4 mΩ, max 8.5 mΩ; VGS=10 V, ID=14 A
Static Drain to Source On Resistancetyp 8.7 mΩ, max 11.0 mΩ; VGS=4.5 V, ID=11 A
Static Drain to Source On Resistancetyp 10.8 mΩ, max 12.4 mΩ; VGS=10 V, ID=14 A, TJ=125°C
Forward Transconductancetyp 58 S; VDS=5 V, ID=14 A
Input Capacitancetyp 1970 pF, max 2620 pF; VDS=20 V, VGS=0 V, f=1 MHz
Output Capacitancetyp 250 pF, max 335 pF; VDS=20 V, VGS=0 V, f=1 MHz
Reverse Transfer Capacitancetyp 150 pF, max 225 pF; VDS=20 V, VGS=0 V, f=1 MHz
Gate Resistancetyp 1.0 Ω; f=1 MHz
Turn-On Delay Timetyp 11 ns, max 20 ns; VDD=20 V, ID=14 A, VGS=10 V, RGEN=6 Ω
Rise Timetyp 6 ns, max 12 ns; VDD=20 V, ID=14 A, VGS=10 V, RGEN=6 Ω
Turn-Off Delay Timetyp 28 ns, max 45 ns; VDD=20 V, ID=14 A, VGS=10 V, RGEN=6 Ω
Fall Timetyp 4 ns, max 10 ns; VDD=20 V, ID=14 A, VGS=10 V, RGEN=6 Ω
Total Gate Chargetyp 37 nC, max 52 nC; VGS=10 V, VDD=20 V, ID=14 A
Total Gate Chargetyp 20 nC, max 28 nC; VGS=5 V, VDD=20 V, ID=14 A
Gate to Source Gate Chargetyp 6 nC; VDD=20 V, ID=14 A, VGS=10 V
Gate to Drain Miller Chargetyp 7 nC; VDD=20 V, ID=14 A, VGS=10 V
Source to Drain Diode Forward Voltagetyp 0.8 V, max 1.2 V; VGS=0 V, IS=14 A, pulse test
Reverse Recovery Timetyp 28 ns, max 42 ns; IF=14 A, di/dt=100 A/µs
Reverse Recovery Chargetyp 24 nC, max 36 nC; IF=14 A, di/dt=100 A/µs
Package MarkingFDB8447L; device marking
Reel Size330 mm; ordering information
Tape Width24 mm; ordering information
Tape and Reel Quantity800 units; ordering information
Datasheet Statusrequest_only

Product Overview

The FDB8447L is an ON Semiconductor N-Channel PowerTrench MOSFET supplied in a TO-263AB package. Its maximum ratings include 40 V drain-to-source voltage, ±20 V gate-to-source voltage, 50 A package-limited continuous drain current at TC=25°C, 66 A silicon-limited current at TC=25°C, and 100 A pulsed drain current.

Electrical parameters include a minimum 40 V drain-source breakdown voltage, gate threshold range of 1 V to 3 V, and static drain-source on-resistance of typ 7.4 mΩ and max 8.5 mΩ at VGS=10 V and ID=14 A. At VGS=4.5 V and ID=11 A, on-resistance is typ 8.7 mΩ and max 11.0 mΩ.

Dynamic data covers typ 1970 pF input capacitance, typ 37 nC total gate charge at 10 V gate drive, turn-on delay of typ 11 ns, and fall time of typ 4 ns under the stated test conditions. Thermal data includes 2.1°C/W junction-to-case resistance and junction-to-ambient ratings for both 1 in² copper and minimum-pad mounting conditions.

Key Features

  • 40 V drain-to-source maximum rating
  • ±20 V gate-to-source maximum rating
  • 50 A package-limited continuous drain current
  • 100 A maximum pulsed drain current
  • 153 mJ drain-source avalanche energy rating
  • TO-263AB package with FDB8447L device marking
  • Typ 7.4 mΩ on-resistance at 10 V gate drive
  • Typ 37 nC total gate charge at 10 V
  • Typ 1970 pF input capacitance at 1 MHz
  • 2.1°C/W junction-to-case thermal resistance

Typical Applications

  • Power management switching stages
  • 40 V drain-source bus designs
  • High-current MOSFET switching
  • Pulsed-current power circuits
  • TO-263AB surface-mount assemblies
  • Gate-driven load control
  • Avalanche-rated switching circuits

Procurement Notes

When requesting a quote for FDB8447L, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.

FAQ

What type of device is the FDB8447L?

The FDB8447L is an ON Semiconductor N-Channel PowerTrench MOSFET in the Power_Management category. The extracted package information lists a TO-263AB case and FDB8447L device marking.

What are the main voltage and current ratings?

The maximum drain-to-source voltage is 40 V and the gate-to-source voltage rating is ±20 V. Continuous drain current is listed as 50 A package limited at TC=25°C, 66 A silicon limited at TC=25°C, and 15 A at TA=25°C.

What on-resistance values are specified for FDB8447L?

Static drain-source on-resistance is specified as typ 7.4 mΩ and max 8.5 mΩ at VGS=10 V and ID=14 A. At VGS=4.5 V and ID=11 A, it is typ 8.7 mΩ and max 11.0 mΩ.

What thermal resistance values are given in the datasheet facts?

The extracted thermal data lists 2.1°C/W junction-to-case resistance. Junction-to-ambient resistance is 40°C/W when mounted on a 1 in² pad of 2 oz copper, and 62.5°C/W when mounted on a minimum pad.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 21, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

Request Quote Request Datasheet