FDD8896 N-Channel PowerTrench MOSFET

STMicroelectronics Power_Management — specifications, applications, sourcing support and RFQ.

FDD8896 N-Channel PowerTrench MOSFET

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
FDD8896
Manufacturer
STMicroelectronics
Package
TO-252AA / D-PAK for FDD8896; TO-251AA / I-PAK for FDU8896
Category
Power Management
Product Type
LDO Regulator

Quick Sourcing Note

FDD8896 from STMicroelectronics is an N-Channel PowerTrench MOSFET in the Power_Management category. The FDD8896 package is TO-252AA / D-PAK, with the related FDU8896 listed for TO-251AA / I-PAK. Datasheet ratings include 30 V drain-to-source voltage, ±20 V gate-to-source voltage, 80 W power dissipation at TC=25°C, and -55 to 175°C operating and storage temperature. Electrical parameters include 0.0057 Ω maximum on-resistance at 35 A and VGS=10 V, 2525 pF typical input capacitance, and 60 nC maximum total gate charge at 10 V. Typical applications include power switching, low-voltage load control, MOSFET output stages, and synchronous power paths.

Specifications

TypeDescription
Part NumberFDD8896
ManufacturerSTMicroelectronics
Product TypeLDO Regulator
CategoryPower Management
Package / CaseTO-252AA / D-PAK for FDD8896; TO-251AA / I-PAK for FDU8896
Drain to Source Voltage30 V; maximum rating, TC=25°C
Gate to Source Voltage±20 V; maximum rating, TC=25°C
Continuous Drain Current94 A; TC=25°C, VGS=10 V; package current limitation is 35 A
Continuous Drain Current85 A; TC=25°C, VGS=4.5 V; package current limitation is 35 A
Continuous Drain Current17 A; Tamb=25°C, VGS=10 V, RθJA=52°C/W
Pulsed Drain CurrentFigure 4; peak current capability curve
Single Pulse Avalanche Energy168 mJ; starting TJ=25°C, L=0.43 mH, IAS=28 A, VDD=27 V, VGS=10 V
Power Dissipation80 W; TC=25°C
Power Dissipation Derating0.53 W/°C; above 25°C
Operating and Storage Temperature-55 to 175 °C; TJ, TSTG
Thermal Resistance Junction to Case1.88 °C/W; TO-252, TO-251
Thermal Resistance Junction to Ambient100 °C/W; TO-252, TO-251
Thermal Resistance Junction to Ambient52 °C/W; TO-252, 1 in² copper pad area
Drain to Source Breakdown VoltageMin 30 V; ID=250 µA, VGS=0 V
Zero Gate Voltage Drain CurrentMax 1 µA; VDS=24 V, VGS=0 V
Zero Gate Voltage Drain CurrentMax 250 µA; VDS=24 V, VGS=0 V, TC=150°C
Gate to Source Leakage CurrentMax ±100 nA; VGS=±20 V
Gate to Source Threshold VoltageMin 1.2 V, Max 2.5 V; VGS=VDS, ID=250 µA
Drain to Source On ResistanceTyp 0.0047 Ω, Max 0.0057 Ω; ID=35 A, VGS=10 V
Drain to Source On ResistanceTyp 0.0057 Ω, Max 0.0068 Ω; ID=35 A, VGS=4.5 V
Drain to Source On ResistanceTyp 0.0075 Ω, Max 0.0092 Ω; ID=35 A, VGS=10 V, TJ=175°C
Input CapacitanceTyp 2525 pF; VDS=15 V, VGS=0 V, f=1 MHz
Output CapacitanceTyp 490 pF; VDS=15 V, VGS=0 V, f=1 MHz
Reverse Transfer CapacitanceTyp 300 pF; VDS=15 V, VGS=0 V, f=1 MHz
Gate ResistanceTyp 2.1 Ω; VGS=0.5 V, f=1 MHz
Total Gate Charge at 10 VTyp 46 nC, Max 60 nC; VGS=0 V to 10 V, VDD=15 V, ID=35 A, Ig=1.0 mA
Total Gate Charge at 5 VTyp 24 nC, Max 32 nC; VGS=0 V to 5 V, VDD=15 V, ID=35 A, Ig=1.0 mA
Threshold Gate ChargeTyp 2.3 nC, Max 3.0 nC; VGS=0 V to 1 V, VDD=15 V, ID=35 A, Ig=1.0 mA
Gate to Source Gate ChargeTyp 6.9 nC; VDD=15 V, ID=35 A, Ig=1.0 mA
Gate Charge Threshold to PlateauTyp 4.6 nC; VDD=15 V, ID=35 A, Ig=1.0 mA
Gate to Drain Miller ChargeTyp 9.8 nC; VDD=15 V, ID=35 A, Ig=1.0 mA
Turn-On TimeMax 171 ns; VGS=10 V, VDD=15 V, ID=35 A, RGS=6.2 Ω
Turn-On Delay TimeTyp 9 ns; VGS=10 V, VDD=15 V, ID=35 A, RGS=6.2 Ω
Rise TimeTyp 106 ns; VGS=10 V, VDD=15 V, ID=35 A, RGS=6.2 Ω
Turn-Off Delay TimeTyp 53 ns; VGS=10 V, VDD=15 V, ID=35 A, RGS=6.2 Ω
Fall TimeTyp 41 ns; VGS=10 V, VDD=15 V, ID=35 A, RGS=6.2 Ω
Turn-Off TimeMax 143 ns; VGS=10 V, VDD=15 V, ID=35 A, RGS=6.2 Ω
Source to Drain Diode VoltageMax 1.25 V; ISD=35 A
Source to Drain Diode VoltageMax 1.0 V; ISD=15 A
Reverse Recovery TimeMax 27 ns; ISD=35 A, dISD/dt=100 A/µs
Reverse Recovered ChargeMax 12 nC; ISD=35 A, dISD/dt=100 A/µs
Datasheet Statusrequest_only

Product Overview

FDD8896 is an STMicroelectronics N-Channel PowerTrench MOSFET for Power_Management use. The datasheet identifies the FDD8896 package as TO-252AA / D-PAK, while FDU8896 is associated with TO-251AA / I-PAK. The device is specified with a 30 V drain-to-source maximum rating and ±20 V gate-to-source maximum rating at TC=25°C.

Current and thermal limits are central to using this MOSFET correctly. Continuous drain current is specified as 94 A at TC=25°C and VGS=10 V, and 85 A at VGS=4.5 V, with a 35 A package current limitation noted for both cases. Ambient operation is listed at 17 A for Tamb=25°C, VGS=10 V, and RθJA=52°C/W. Power dissipation is 80 W at TC=25°C with 0.53 W/°C derating above 25°C.

Electrical characteristics include 0.0047 Ω typical and 0.0057 Ω maximum RDS(on) at ID=35 A and VGS=10 V. Gate charge, capacitance, switching time, and body-diode recovery data support evaluation in power switching, load control, and low-voltage conversion circuits.

Key Features

  • 30 V maximum drain-to-source voltage rating
  • ±20 V maximum gate-to-source voltage rating
  • 94 A continuous drain current at VGS=10 V, TC=25°C
  • 35 A package current limitation noted for case current ratings
  • 0.0057 Ω maximum RDS(on) at 35 A, VGS=10 V
  • 0.0068 Ω maximum RDS(on) at 35 A, VGS=4.5 V
  • 80 W power dissipation at TC=25°C
  • -55 to 175°C operating and storage temperature range
  • 60 nC maximum total gate charge at 10 V
  • 27 ns maximum reverse recovery time at 35 A

Typical Applications

  • Low-voltage power switching
  • Power management load control
  • MOSFET output stages
  • Synchronous power paths
  • High-current switching circuits
  • Avalanche-rated switching designs
  • TO-252 D-PAK assemblies

Procurement Notes

When requesting a quote for FDD8896, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.

FAQ

What type of device is the FDD8896?

The FDD8896 is identified as an N-Channel PowerTrench MOSFET from STMicroelectronics in the Power_Management category. The extracted package information lists TO-252AA / D-PAK for FDD8896.

What are the main voltage ratings for FDD8896?

The datasheet facts list a 30 V maximum drain-to-source voltage rating at TC=25°C and a ±20 V maximum gate-to-source voltage rating at TC=25°C. Drain-to-source breakdown voltage is specified as minimum 30 V at ID=250 µA and VGS=0 V.

What current limits are specified for FDD8896?

Continuous drain current is specified as 94 A at TC=25°C and VGS=10 V, and 85 A at VGS=4.5 V, with a 35 A package current limitation. At Tamb=25°C, VGS=10 V, and RθJA=52°C/W, the listed current is 17 A.

What on-resistance values are listed for FDD8896?

At ID=35 A and VGS=10 V, RDS(on) is 0.0047 Ω typical and 0.0057 Ω maximum. At VGS=4.5 V, it is 0.0057 Ω typical and 0.0068 Ω maximum. At TJ=175°C and VGS=10 V, maximum RDS(on) is 0.0092 Ω.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 21, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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