FDMS8050 N-channel PowerTrench MOSFET

ON Semiconductor Power_Management — specifications, applications, sourcing support and RFQ.

FDMS8050 N-channel PowerTrench MOSFET

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
FDMS8050
Manufacturer
ON Semiconductor
Package
Power 56 / PQFN08J, approx. 5.10 mm x 6.25 mm package outline
Category
Power Management
Product Type
LDO Regulator

Quick Sourcing Note

FDMS8050 from ON Semiconductor is an N-channel PowerTrench MOSFET in the Power_Management category. It is supplied in a Power 56 / PQFN08J package with an approximately 5.10 mm x 6.25 mm outline. Key ratings include 30 V drain-to-source voltage, ±20 V gate-to-source voltage, 200 A continuous drain current at TC=25°C, and 400 A pulsed drain current limited by junction temperature. Electrical characteristics include low static drain-to-source on resistance down to typ 0.5 mΩ at VGS=10 V and ID=55 A, gate charge data for 10 V and 4.5 V drive, and specified switching, capacitance, diode recovery, avalanche, thermal, RoHS, MSL1, and ordering information.

Specifications

TypeDescription
Part NumberFDMS8050
ManufacturerON Semiconductor
Product TypeLDO Regulator
CategoryPower Management
Package / CasePower 56 / PQFN08J, approx. 5.10 mm x 6.25 mm package outline
Drain to Source Voltage30 V; Maximum rating, TA=25°C
Gate to Source Voltage±20 V; Maximum rating; negative VGS rating for low duty cycle pulse occurrence only
Continuous Drain Current200 A; TC=25°C
Continuous Drain Current55 A; TA=25°C, Note 1a
Pulsed Drain Current400 A; Pulse limited by junction temperature, td ≤ 100 µs
Single Pulse Avalanche Energy1536 mJ; Starting TJ=25°C, L=3 mH, IAS=32 A, VDD=30 V, VGS=10 V
Power Dissipation156 W; TC=25°C
Power Dissipation2.7 W; TA=25°C, Note 1a
Operating Junction Temperature Range-55 to +150 °C; Maximum rating
Storage Junction Temperature Range-55 to +150 °C; Maximum rating
Thermal Resistance Junction to Case0.83 °C/W; Guaranteed by design
Thermal Resistance Junction to Ambient45 °C/W; Mounted on 1 in² pad, 2 oz copper, 1.5 x 1.5 in FR-4 board
Drain to Source Breakdown Voltagemin 30 V; ID=750 µA, VGS=0 V
Breakdown Voltage Temperature Coefficienttyp 20 mV/°C; ID=750 µA, referenced to 25°C
Zero Gate Voltage Drain Currentmax 1 µA; VDS=24 V, VGS=0 V
Gate to Source Leakage Currentmax 100 nA; VGS=20 V, VDS=0 V
Gate to Source Threshold Voltagemin 1.0 V, typ 1.8 V, max 3.0 V; VGS=VDS, ID=750 µA
Gate Threshold Voltage Temperature Coefficienttyp -6 mV/°C; ID=750 µA, referenced to 25°C
Static Drain to Source On Resistancetyp 0.5 mΩ, max 0.65 mΩ; VGS=10 V, ID=55 A
Static Drain to Source On Resistancetyp 0.7 mΩ, max 0.9 mΩ; VGS=4.5 V, ID=47 A
Static Drain to Source On Resistancetyp 0.7 mΩ, max 0.9 mΩ; VGS=10 V, ID=55 A, TJ=125°C
Forward Transconductancetyp 333 S; VDS=5 V, ID=55 A
Input Capacitancetyp 16150 pF, max 22610 pF; VDS=15 V, VGS=0 V, f=1 MHz
Output Capacitancetyp 4455 pF, max 6240 pF; VDS=15 V, VGS=0 V, f=1 MHz
Reverse Transfer Capacitancetyp 220 pF, max 310 pF; VDS=15 V, VGS=0 V, f=1 MHz
Gate Resistancetyp 1.0 Ω, max 3.0 Ω; TJ=25°C
Turn-On Delay Timetyp 29 ns, max 47 ns; VDD=15 V, ID=55 A, VGS=10 V, RGEN=6 Ω
Rise Timetyp 22 ns, max 36 ns; VDD=15 V, ID=55 A, VGS=10 V, RGEN=6 Ω
Turn-Off Delay Timetyp 87 ns, max 139 ns; VDD=15 V, ID=55 A, VGS=10 V, RGEN=6 Ω
Fall Timetyp 16 ns, max 28 ns; VDD=15 V, ID=55 A, VGS=10 V, RGEN=6 Ω
Total Gate Chargetyp 204 nC, max 285 nC; VGS=0 V to 10 V, VDD=15 V, ID=55 A
Total Gate Chargetyp 93 nC, max 130 nC; VGS=0 V to 4.5 V, VDD=15 V, ID=55 A
Gate to Source Chargetyp 41 nC; VDD=15 V, ID=55 A
Gate to Drain Miller Chargetyp 18 nC; VDD=15 V, ID=55 A
Source to Drain Diode Forward Voltagetyp 0.64 V, max 1.2 V; VGS=0 V, IS=2.2 A, pulse test
Source to Drain Diode Forward Voltagetyp 0.74 V, max 1.2 V; VGS=0 V, IS=55 A, pulse test
Reverse Recovery Timetyp 77 ns, max 124 ns; IF=55 A, di/dt=100 A/µs
Reverse Recovery Chargetyp 141 nC, max 226 nC; IF=55 A, di/dt=100 A/µs
Package Moisture Sensitivity LevelMSL1; Robust package design feature
Unclamped Inductive Load Test100% UIL tested; Feature statement
RoHS ComplianceRoHS Compliant; Feature statement
Ordering Quantity3000 units; 13 inch reel, 12 mm tape width
Datasheet Statusrequest_only

Product Overview

The FDMS8050 is an ON Semiconductor N-channel PowerTrench MOSFET intended for Power_Management designs requiring a 30 V drain-to-source rated device. The extracted datasheet facts identify a Power 56 / PQFN08J package with an approximately 5.10 mm x 6.25 mm outline, plus a continuous drain-current rating of 200 A at TC=25°C and 55 A at TA=25°C under the stated board condition note.

Electrical parameters include a minimum 30 V drain-to-source breakdown voltage at ID=750 µA and VGS=0 V, a gate-to-source threshold range of 1.0 V minimum, 1.8 V typical, and 3.0 V maximum, and static drain-to-source on resistance values of typ 0.5 mΩ, max 0.65 mΩ at VGS=10 V and ID=55 A. The device is also characterized at VGS=4.5 V and at TJ=125°C.

Dynamic data includes input, output, and reverse-transfer capacitance at VDS=15 V and f=1 MHz; switching times at VDD=15 V, ID=55 A, VGS=10 V, and RGEN=6 Ω; and total gate charge at both 10 V and 4.5 V drive. Assembly and qualification-related facts include MSL1 package moisture sensitivity, RoHS compliance, 100% UIL testing, and 3000-unit ordering quantity on 13 inch reel, 12 mm tape.

Key Features

  • 30 V drain-to-source maximum rating
  • ±20 V gate-to-source maximum rating
  • 200 A continuous drain current at TC=25°C
  • 400 A pulsed drain current, td ≤ 100 µs
  • Typ 0.5 mΩ on resistance at 10 V gate drive
  • Typ 0.7 mΩ on resistance at 4.5 V gate drive
  • 1536 mJ single-pulse avalanche energy rating
  • MSL1 package moisture sensitivity level
  • 100% UIL tested per feature statement
  • RoHS compliant per datasheet feature statement

Typical Applications

  • 30 V power switching
  • High-current MOSFET stages
  • Low-resistance power paths
  • 4.5 V gate-drive circuits
  • 10 V gate-drive circuits
  • Avalanche-rated switching circuits
  • Designs using PQFN08J footprint

Procurement Notes

When requesting a quote for FDMS8050, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.

FAQ

What type of device is the FDMS8050?

The FDMS8050 is an ON Semiconductor N-channel PowerTrench MOSFET in the Power_Management category. The extracted package information lists Power 56 / PQFN08J with an approximately 5.10 mm x 6.25 mm outline.

What are the main voltage and current ratings?

The device has a 30 V drain-to-source maximum rating at TA=25°C, a ±20 V gate-to-source maximum rating, 200 A continuous drain current at TC=25°C, 55 A at TA=25°C under Note 1a, and 400 A pulsed drain current.

What on-resistance values are specified for FDMS8050?

Static drain-to-source on resistance is typ 0.5 mΩ and max 0.65 mΩ at VGS=10 V and ID=55 A. At VGS=4.5 V and ID=47 A, it is typ 0.7 mΩ and max 0.9 mΩ.

What package and assembly facts are available?

The package is listed as Power 56 / PQFN08J, approximately 5.10 mm x 6.25 mm. Extracted assembly-related facts include MSL1 package moisture sensitivity level, RoHS compliance, and ordering quantity of 3000 units on 13 inch reel with 12 mm tape width.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 21, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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