FQP65N06 N-Channel QFET MOSFET

ON Semiconductor Power_Management — specifications, applications, sourcing support and RFQ.

FQP65N06 N-Channel QFET MOSFET

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
FQP65N06
Manufacturer
ON Semiconductor
Package
TO-220, molded, 3-lead, JEDEC variation AB
Category
Power Management
Product Type
LDO Regulator

Quick Sourcing Note

FQP65N06 from ON Semiconductor is an N-Channel QFET MOSFET in a TO-220 molded 3-lead package, JEDEC variation AB, for Power_Management designs requiring 60 V drain-source capability and high drain current. It is rated for 65 A continuous drain current at TC=25°C, 46.1 A at TC=100°C, and 260 A pulsed drain current. Key parameters include 0.012 Ω typical and 0.016 Ω maximum on-resistance at VGS=10 V and ID=32.5 A, ±25 V gate-source rating, 150 W power dissipation at TC=25°C, and operation across -55 to +175°C.

Specifications

TypeDescription
Part NumberFQP65N06
ManufacturerON Semiconductor
Product TypeLDO Regulator
CategoryPower Management
Package / CaseTO-220, molded, 3-lead, JEDEC variation AB
Drain-Source Voltage60 V; absolute maximum rating, TC=25°C
Continuous Drain Current65 A; TC=25°C
Continuous Drain Current46.1 A; TC=100°C
Pulsed Drain Current260 A; pulse width limited by maximum junction temperature
Gate-Source Voltage±25 V; absolute maximum rating
Single Pulsed Avalanche Energy650 mJ; L=180 µH, IAS=65 A, VDD=25 V, RG=25 Ω, starting TJ=25°C
Avalanche Current65 A; repetitive rating, pulse width limited by maximum junction temperature
Repetitive Avalanche Energy15.0 mJ; repetitive rating, pulse width limited by maximum junction temperature
Peak Diode Recovery dv/dt7.0 V/ns; ISD≤65 A, di/dt≤300 A/µs, VDD≤BVDSS, starting TJ=25°C
Power Dissipation150 W; TC=25°C
Power Dissipation Derating1.00 W/°C; above 25°C
Operating and Storage Temperature Range-55 to +175 °C; absolute maximum rating
Maximum Lead Temperature for Soldering300 °C; 1/8 inch from case for 5 seconds
Thermal Resistance Junction-to-Case1.00 °C/W max; maximum thermal characteristic
Thermal Resistance Junction-to-Ambient62.5 °C/W max; maximum thermal characteristic
Package Packing MethodTube; part number FQP65N06, package TO-220
Package Quantity50 units; part number FQP65N06, tube packing
Drain-Source Breakdown Voltage60 V min; VGS=0 V, ID=250 µA
Breakdown Voltage Temperature Coefficient0.07 V/°C typ; ID=250 µA, referenced to 25°C
Zero Gate Voltage Drain Current1 µA max; VDS=60 V, VGS=0 V
Zero Gate Voltage Drain Current10 µA max; VDS=48 V, TC=150°C
Gate-Body Leakage Current Forward100 nA max; VGS=25 V, VDS=0 V
Gate-Body Leakage Current Reverse-100 nA max; VGS=-25 V, VDS=0 V
Gate Threshold Voltage2.0 V min, 4.0 V max; VDS=VGS, ID=250 µA
Static Drain-Source On-Resistance0.012 Ω typ, 0.016 Ω max; VGS=10 V, ID=32.5 A
Forward Transconductance48 S typ; VDS=25 V, ID=32.5 A
Input Capacitance1850 pF typ, 2410 pF max; VDS=25 V, VGS=0 V, f=1.0 MHz
Output Capacitance700 pF typ, 910 pF max; VDS=25 V, VGS=0 V, f=1.0 MHz
Reverse Transfer Capacitance100 pF typ, 130 pF max; VDS=25 V, VGS=0 V, f=1.0 MHz
Turn-On Delay Time20 ns typ, 50 ns max; VDD=30 V, ID=32.5 A, RG=25 Ω
Turn-On Rise Time160 ns typ, 330 ns max; VDD=30 V, ID=32.5 A, RG=25 Ω
Turn-Off Delay Time90 ns typ, 190 ns max; VDD=30 V, ID=32.5 A, RG=25 Ω
Turn-Off Fall Time105 ns typ, 220 ns max; VDD=30 V, ID=32.5 A, RG=25 Ω; essentially independent of operating temperature
Total Gate Charge48 nC typ, 65 nC max; VDS=48 V, ID=65 A, VGS=10 V
Gate-Source Charge12 nC typ; VDS=48 V, ID=65 A, VGS=10 V
Gate-Drain Charge19.5 nC typ; VDS=48 V, ID=65 A, VGS=10 V; essentially independent of operating temperature
Maximum Continuous Drain-Source Diode Forward Current65 A max; drain-source diode characteristic
Maximum Pulsed Drain-Source Diode Forward Current260 A max; drain-source diode characteristic
Drain-Source Diode Forward Voltage1.5 V max; VGS=0 V, IS=65 A
Reverse Recovery Time62 ns typ; VGS=0 V, IS=65 A, dIF/dt=100 A/µs
Reverse Recovery Charge110 nC typ; VGS=0 V, IS=65 A, dIF/dt=100 A/µs
Maximum Junction Temperature Rating175°C; feature statement
Avalanche Test Coverage100% avalanche tested; feature statement
Datasheet Statusrequest_only

Product Overview

The FQP65N06 is an ON Semiconductor N-Channel QFET MOSFET categorized for Power_Management use. Its ratings include 60 V drain-source voltage, 65 A continuous drain current at TC=25°C, and 46.1 A at TC=100°C, with a 260 A pulsed drain-current limit tied to maximum junction temperature.

Electrical characteristics include 60 V minimum drain-source breakdown voltage at VGS=0 V and ID=250 µA, 2.0 V minimum to 4.0 V maximum gate threshold voltage, and 0.012 Ω typical / 0.016 Ω maximum static drain-source on-resistance at VGS=10 V and ID=32.5 A. Gate charge is specified at 48 nC typical and 65 nC maximum under VDS=48 V, ID=65 A, and VGS=10 V.

The device is supplied in a TO-220 molded, 3-lead JEDEC variation AB package, with tube packing in quantities of 50 units. Thermal limits include 150 W power dissipation at TC=25°C, 1.00 °C/W maximum junction-to-case thermal resistance, 62.5 °C/W maximum junction-to-ambient thermal resistance, and a -55 to +175°C operating and storage range.

Key Features

  • 60 V drain-source voltage rating
  • 65 A continuous drain current at TC=25°C
  • 260 A pulsed drain current capability
  • 0.016 Ω maximum on-resistance at VGS=10 V
  • ±25 V gate-source voltage rating
  • 150 W power dissipation at TC=25°C
  • -55 to +175°C operating and storage range
  • 1.00 °C/W maximum junction-to-case thermal resistance
  • 650 mJ single pulsed avalanche energy
  • 100% avalanche tested device statement

Typical Applications

  • 60 V power switching
  • 65 A load switching
  • TO-220 power designs
  • Avalanche-rated switching circuits
  • Body-diode conduction paths
  • Gate-driven MOSFET stages

Procurement Notes

When requesting a quote for FQP65N06, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.

FAQ

What type of device is the FQP65N06?

The FQP65N06 is an ON Semiconductor N-Channel QFET MOSFET categorized under Power_Management. It is supplied in a TO-220 molded 3-lead package using JEDEC variation AB.

What are the main current ratings for FQP65N06?

The device is rated for 65 A continuous drain current at TC=25°C and 46.1 A at TC=100°C. Its pulsed drain current rating is 260 A, limited by maximum junction temperature.

What on-resistance is specified for this MOSFET?

Static drain-source on-resistance is specified as 0.012 Ω typical and 0.016 Ω maximum when measured at VGS=10 V and ID=32.5 A.

What thermal limits apply to FQP65N06?

Thermal data includes 150 W power dissipation at TC=25°C, 1.00 W/°C derating above 25°C, 1.00 °C/W maximum junction-to-case thermal resistance, and 62.5 °C/W maximum junction-to-ambient thermal resistance.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 21, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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