Specifications
| Type | Description |
|---|---|
| Part Number | GSIB25XX |
| Manufacturer | STMicroelectronics |
| Product Type | LDO Regulator |
| Category | Power Management |
| Inferred Category | Power_Management |
| Component Type | Other |
| Package Case | GSIB-5S single in-line package; outline dimensions include 30 ±0.3 mm body length, 17.5 ±0.5 mm height, 4.6 ±0.2 mm thickness, 0.7 ±0.1 mm lead thickness |
| Datasheet Manufacturer | Vishay General Semiconductor; datasheet header, while product information lists STMicroelectronics |
| Datasheet Part Numbers | GSIB2520, GSIB2540, GSIB2560, GSIB2580 |
| Circuit Configuration | In-line |
| Package | GSIB-5S |
| GSIB2520 Maximum Repetitive Peak Reverse Voltage | 200 V |
| GSIB2540 Maximum Repetitive Peak Reverse Voltage | 400 V |
| GSIB2560 Maximum Repetitive Peak Reverse Voltage | 600 V |
| GSIB2580 Maximum Repetitive Peak Reverse Voltage | 800 V |
| GSIB2520 Maximum RMS Voltage | 140 V |
| GSIB2540 Maximum RMS Voltage | 280 V |
| GSIB2560 Maximum RMS Voltage | 420 V |
| GSIB2580 Maximum RMS Voltage | 560 V |
| GSIB2520 Maximum DC Blocking Voltage | 200 V |
| GSIB2540 Maximum DC Blocking Voltage | 400 V |
| GSIB2560 Maximum DC Blocking Voltage | 600 V |
| GSIB2580 Maximum DC Blocking Voltage | 800 V |
| Maximum Average Forward Rectified Output Current | 25 A; IF(AV), TC = 98 °C, unit case mounted on aluminum plate heatsink |
| Maximum Average Forward Rectified Output Current Without Heatsink | 3.5 A; IF(AV), TA = 25 °C, units mounted on PCB without heatsink |
| Peak Forward Surge Current | 350 A; IFSM, single sine-wave superimposed on rated load |
| Rating for Fusing | 500 A2s; I2t, t < 8.3 ms |
| Operating Junction Temperature Range | -55 to +150 °C |
| Storage Temperature Range | -55 to +150 °C |
| Maximum Instantaneous Forward Voltage Drop per Diode | 1.00 V; VF at IF = 12.5 A, TA = 25 °C |
| Maximum DC Reverse Current per Diode at 25 °C | 10 µA; IR at rated DC blocking voltage, TA = 25 °C |
| Maximum DC Reverse Current per Diode at 125 °C | 350 µA; IR at rated DC blocking voltage, TA = 125 °C |
| Typical Thermal Resistance Junction to Ambient | 22 °C/W; RθJA, units mounted on PCB without heatsink |
| Typical Thermal Resistance Junction to Case | 1.0 °C/W; RθJC, unit case mounted on aluminum plate heatsink |
| Case Dielectric Strength | 2500 V RMS |
| Solder Dip Temperature | 275 °C max, 10 s; per JESD 22-B106 |
| Mounting Torque | 10 cm-kg max / 8.8 inch-lbs max |
| Recommended Mounting Torque | 5.7 cm-kg / 5 inch-lbs |
| Package Flammability Rating | UL 94 V-0 |
| Ordering Example Unit Weight | 7.0 g; preferred P/N GSIB2560-E3/45 |
| Ordering Example Base Quantity | 20; preferred P/N GSIB2560-E3/45, package code 45, delivery mode tube |
| Datasheet Status | request_only |
Product Overview
Voltage options span 200 V, 400 V, 600 V, and 800 V maximum repetitive peak reverse voltage and matching maximum DC blocking voltage ratings. The corresponding RMS voltage ratings are 140 V, 280 V, 420 V, and 560 V. Current capability is condition-dependent: 25 A average forward rectified output current with the case mounted on an aluminum plate heatsink at TC = 98 °C, or 3.5 A at TA = 25 °C on PCB without a heatsink.
Electrical limits include 350 A peak forward surge current, 500 A2s fusing rating for t < 8.3 ms, 1.00 V maximum instantaneous forward voltage drop per diode at IF = 12.5 A and TA = 25 °C, and reverse current limits of 10 µA at TA = 25 °C or 350 µA at TA = 125 °C. Assembly and mechanical facts include UL 94 V-0 molding compound, 2500 V RMS case dielectric strength, 275 °C maximum solder dip for 10 s, and specified mounting torque limits.
Key Features
- Single-phase bridge rectifier family
- In-line GSIB-5S package configuration
- 200 V to 800 V VRRM device options
- 25 A rectified output with heatsink mounting
- 3.5 A rectified output on PCB without heatsink
- 350 A peak forward surge current rating
- 1.00 V maximum forward drop per diode
- 10 µA reverse current at TA = 25 °C
- 2500 V RMS case dielectric strength
- UL 94 V-0 molding compound
Typical Applications
- Single-phase AC bridge rectification
- Power supply input rectifiers
- DC bus front-end conversion
- PCB-mounted rectifier assemblies
- Heatsink-mounted rectifier assemblies
- High surge current rectifier stages
Procurement Notes
When requesting a quote for GSIB25XX, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.
FAQ
What device family does the supplied datasheet identify?
The supplied manufacturer technical datasheet identifies Vishay General Semiconductor GSIB2520, GSIB2540, GSIB2560, and GSIB2580 devices. The product information provided for the CMS record lists the part as GSIB25XX from STMicroelectronics.
What package and circuit configuration are specified for GSIB25XX?
The extracted facts specify an in-line circuit configuration and a GSIB-5S package. The package outline includes a 30 ±0.3 mm body length, 17.5 ±0.5 mm height, 4.6 ±0.2 mm thickness, and 0.7 ±0.1 mm lead thickness.
What are the main current ratings for this bridge rectifier?
The maximum average forward rectified output current is 25 A when the case is mounted on an aluminum plate heatsink at TC = 98 °C. Without a heatsink on PCB at TA = 25 °C, the specified rating is 3.5 A.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 26, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.