HDC3021 Digital Humidity and Temperature Sensor

Texas Instruments Sensor — specifications, applications, sourcing support and RFQ.

HDC3021 Digital Humidity and Temperature Sensor

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Part Number
HDC3021
Manufacturer
Texas Instruments
Package
WSON (8), 2.50 mm x 2.50 mm x 0.8 mm
Category
Sensors
Product Type
Digital relative humidity and temperature sensor

Quick Sourcing Note

HDC3021 from Texas Instruments is a Sensor component described as a digital relative humidity and temperature sensor in a WSON (8), 2.50 mm x 2.50 mm x 0.8 mm package. It supports 0 to 100 %RH operation in non-condensing conditions and temperature sensing from -40 to 125 °C. Key parameters include ±0.5 %RH typical accuracy at 25°C over 10% to 50% RH, ±0.1 °C typical temperature accuracy across listed ranges, 1.62 to 5.50 V supply operation, I2C-compatible communication up to 1 MHz, four selectable I2C addresses, CRC data protection, an integrated heater, and a removable protective tape option for assembly processes.

Specifications

TypeDescription
Part NumberHDC3021
ManufacturerTexas Instruments
Product TypeDigital relative humidity and temperature sensor
CategorySensors
Package / CaseWSON (8), 2.50 mm x 2.50 mm x 0.8 mm
Relative Humidity Operating Range0 to 100 %RH; Non-condensing
Relative Humidity Accuracy±0.5 %RH typ, ±2.0 %RH max; TA=25°C, 10% to 50% RH
Relative Humidity Accuracy±1.0 %RH typ, ±2.0 %RH max; TA=25°C, 0% to 70% RH
Relative Humidity Accuracy±1.0 %RH typ, ±2.5 %RH max; TA=25°C, 10% to 80% RH
Relative Humidity Accuracy±1.5 %RH typ, ±3.0 %RH max; TA=25°C, 10% to 90% RH
Relative Humidity Accuracy±1.5 %RH typ, ±3.5 %RH max; TA=25°C, 0% to 100% RH
Relative Humidity Repeatability±0.02 %RH typ; Low Power Mode 0, lowest noise
Relative Humidity Repeatability±0.02 %RH typ; Low Power Mode 1
Relative Humidity Repeatability±0.03 %RH typ; Low Power Mode 2
Relative Humidity Repeatability±0.04 %RH typ; Low Power Mode 3, lowest power
Relative Humidity Hysteresis±0.8 %RH typ; 10% to 90% RH
Relative Humidity Response Time4 s typ; 10% to 90% RH step, t63%
Relative Humidity Long-Term Drift0.19 %RH/yr typ
Relative Humidity Supply Sensitivity-10 min, 1.8 typ, 10 max %RH/V; RH accuracy, VDD=1.8 V to 5.5 V
Temperature Sensor Operating Range-40 to 125 °C; Operating free-air temperature
Relative Humidity Sensor Operating Free-Air Temperature-20 to 80 °C; Recommended operating condition
Integrated Heater Operating Free-Air Temperature-40 to 60 °C; For condensation removal
Temperature Accuracy±0.1 °C typ, ±0.2 °C max; 0°C ≤ TA ≤ 50°C
Temperature Accuracy±0.1 °C typ, ±0.3 °C max; -40°C ≤ TA ≤ 100°C
Temperature Accuracy±0.1 °C typ, ±0.4 °C max; -40°C ≤ TA < 125°C
Temperature Repeatability±0.04 °C typ; Low Power Mode 0, lowest noise
Temperature Repeatability±0.05 °C typ; Low Power Mode 1
Temperature Repeatability±0.06 °C typ; Low Power Mode 2
Temperature Repeatability±0.08 °C typ; Low Power Mode 3, lowest power
Temperature Response Time2 s typ; Stirred liquid, 25°C < TA < 75°C, t63% step, Rogers 4350B PCB 1.575 mm thickness
Temperature Long-Term Drift±0.03 °C/yr typ
Temperature Supply Sensitivity-25 min, -5.7 typ, 25 max m°C/V; Temperature accuracy
Supply Voltage1.62 to 5.50 V; Recommended operating condition
Average Current0.4 µA; Low-power operation stated in features
Sleep Current0.4 µA typ; Trigger on demand
Sleep Current0.55 µA typ; Auto measure
Active Current99 µA typ; Device comparison table
Average IDD0.7 µA typ; Trigger on demand, 1 Hz
Average IDD0.9 µA typ; Auto measure, 1 Hz
Measurement Duration12.5 ms typ, 14.1 ms max; Low Power Mode 0, lowest noise
Measurement Duration7.5 ms typ, 8.4 ms max; Low Power Mode 1
Measurement Duration5.0 ms typ, 5.7 ms max; Low Power Mode 2
Measurement Duration3.7 ms typ, 4.2 ms max; Low Power Mode 3, lowest power
I2C Interface SpeedUp to 1 MHz; I2C-compatible interface
I2C Address Count4 selectable addresses; ADDR and ADDR1 pins configure 0x44, 0x45, 0x46, 0x47
I2C Address 0x44 ConfigurationADDR1=GND, ADDR=GND; ADDR and ADDR1 cannot be left floating
I2C Address 0x45 ConfigurationADDR1=GND, ADDR=VDD; ADDR and ADDR1 cannot be left floating
I2C Address 0x46 ConfigurationADDR1=VDD, ADDR=GND; ADDR and ADDR1 cannot be left floating
I2C Address 0x47 ConfigurationADDR1=VDD, ADDR=VDD; ADDR and ADDR1 cannot be left floating
SCL/SDA Low-Level Input Voltage0.3 x VDD max; SCL, SDA pins
SCL/SDA High-Level Input Voltage0.7 x VDD min; SCL, SDA pins
VDD Absolute Maximum Voltage-0.3 to 6.0 V; Applied voltage on VDD pin
SCL Absolute Maximum Voltage-0.3 to 6.0 V; Applied voltage on SCL pin
SDA Absolute Maximum Voltage-0.3 to 6.0 V; Applied voltage on SDA pin
ADDR Absolute Maximum Voltage-0.3 to 6.0 V; Applied voltage on ADDR pin
ADDR1 Absolute Maximum Voltage-0.3 to VDD + 0.3 V; Applied voltage on ADDR1 pin
ALERT Absolute Maximum Voltage-0.3 to VDD + 0.3 V; Applied voltage on ALERT pin
RESET Absolute Maximum Voltage-0.3 to VDD + 0.3 V; Applied voltage on RESET pin
Junction Temperature-55 to 150 °C; Absolute maximum rating
Storage Temperature-65 to 150 °C; Absolute maximum rating
ESD Human Body Model±2000 V; Per ANSI/ESDA/JEDEC JS-001
ESD Charged Device Model±750 V; Per JEDEC JS-002
Junction-to-Ambient Thermal Resistance84.9 °C/W; DEF, DEH, DEJ WSON 8-pin package
Junction-to-Board Thermal Resistance52.0 °C/W; DEF, DEH, DEJ WSON 8-pin package
Junction-to-Board Characterization Parameter51.7 °C/W; DEF, DEH, DEJ WSON 8-pin package
Junction-to-Case Bottom Thermal Resistance30.4 °C/W; DEF, DEH, DEJ WSON 8-pin package
Pin Count8 pins plus thermal pad; WSON package, thermal pad numbered 9
SDA Pin FunctionI2C serial data, open-drain, requires pullup resistor; Pin 1
SCL Pin FunctionI2C serial clock input; Pin 4
ALERT Pin FunctionPush-pull interrupt output; Pin 3; if unused, must be left floating
RESET Pin FunctionActive-low reset input with internal pull-up to VDD; Pin 6; if unused, tie to VDD
HDC3021 Protective OptionFactory-installed removable protective tape; Allows conformal coatings and PCB wash
Integrated HeaterAvailable; Used to dissipate condensation and moisture
Data ProtectionCRC checksum; I2C data protection feature
NIST TraceabilityRelative humidity and temperature; Production setup NIST traceable and verified with ISO/IEC 17025 calibrated equipment
Datasheet Statusrequest_only

Product Overview

The Texas Instruments HDC3021 is a digital relative humidity and temperature sensor for systems that need combined environmental measurement through an I2C-compatible interface. The device operates from a 1.62 to 5.50 V supply and supports I2C speeds up to 1 MHz, with four selectable addresses: 0x44, 0x45, 0x46, and 0x47 using ADDR and ADDR1 pin configurations.

Humidity measurement covers 0 to 100 %RH in non-condensing conditions, with listed 25°C accuracy grades across multiple RH spans. Temperature sensing covers -40 to 125 °C, while the relative humidity sensor recommended operating free-air temperature is -20 to 80 °C. The integrated heater is specified for -40 to 60 °C operation for condensation removal.

The HDC3021 is supplied in an 8-pin WSON package with a thermal pad numbered 9. Assembly-related features include factory-installed removable protective tape for conformal coatings and PCB wash. Pin functions include open-drain SDA requiring a pullup resistor, SCL clock input, push-pull ALERT output, and active-low RESET with an internal pull-up to VDD.

Key Features

  • 0 to 100 %RH non-condensing humidity range
  • ±0.5 %RH typical accuracy at 25°C
  • -40 to 125 °C temperature sensor range
  • 1.62 to 5.50 V recommended supply
  • I2C-compatible interface supports up to 1 MHz
  • Four selectable addresses from 0x44 to 0x47
  • CRC checksum for I2C data protection
  • Integrated heater for condensation and moisture dissipation
  • Factory removable protective tape for PCB wash
  • 8-pin WSON package plus thermal pad

Typical Applications

  • Relative humidity measurement
  • Temperature measurement
  • I2C environmental sensing
  • Low-current sensor nodes
  • Condensation removal designs
  • Multi-sensor I2C buses
  • PCB wash process assemblies
  • Conformal coating assemblies

Procurement Notes

When requesting a quote for HDC3021, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For memory and storage sourcing, density, organization, speed grade, voltage, package, temperature grade, date code, lifecycle status and original packing condition should be verified before approval.

FAQ

What type of sensor is the HDC3021?

The HDC3021 is a Texas Instruments digital relative humidity and temperature sensor. It is categorized as a Sensor and supplied in a WSON (8), 2.50 mm x 2.50 mm x 0.8 mm package.

What humidity range does the HDC3021 support?

The HDC3021 relative humidity operating range is 0 to 100 %RH under non-condensing conditions. Listed humidity accuracy depends on the RH span, including ±0.5 %RH typical over 10% to 50% RH at TA=25°C.

How is the HDC3021 I2C address configured?

The HDC3021 provides four selectable I2C addresses: 0x44, 0x45, 0x46, and 0x47. ADDR and ADDR1 set the address by connection to GND or VDD, and the extracted facts state they cannot be left floating.

Does the HDC3021 include condensation handling features?

Yes. The HDC3021 has an integrated heater used to dissipate condensation and moisture. The heater operating free-air temperature range is specified as -40 to 60 °C for condensation removal.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 28, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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