HUF76407D3S N-channel Logic-level Power MOSFET

ON Semiconductor Power_Management — specifications, applications, sourcing support and RFQ.

HUF76407D3S N-channel Logic-level Power MOSFET

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
HUF76407D3S
Manufacturer
ON Semiconductor
Package
JEDEC TO-252AA
Category
Power Management
Product Type
LDO Regulator

Quick Sourcing Note

HUF76407D3S from ON Semiconductor is an N-channel logic-level power MOSFET in the Power_Management category, supplied in a JEDEC TO-252AA package. The device is specified for 60 V drain-to-source voltage and ±16 V gate-to-source voltage. Continuous drain current is rated at 11 A with VGS=5 V and 12 A with VGS=10 V at TC=25°C, with 38 W power dissipation at TC=25°C. Key electrical parameters include low drain-to-source on resistance down to 0.092 Ohm maximum at VGS=10 V, 9.4 nC typical total gate charge, and switching timing characterized at both 4.5 V and 10 V gate drive.

Specifications

TypeDescription
Part NumberHUF76407D3S
ManufacturerON Semiconductor
Product TypeLDO Regulator
CategoryPower Management
Package CaseJEDEC TO-252AA
Drain-to-Source Voltage60 V; absolute maximum rating, TC=25°C
Drain-to-Gate Voltage60 V; RGS=20 kOhm, TC=25°C
Gate-to-Source Voltage±16 V; absolute maximum rating, TC=25°C
Continuous Drain Current11 A; TC=25°C, VGS=5 V
Continuous Drain Current12 A; TC=25°C, VGS=10 V
Continuous Drain Current6 A; TC=135°C, VGS=5 V
Continuous Drain Current6 A; TC=135°C, VGS=4.5 V
Power Dissipation38 W; TC=25°C
Power Derating0.25 W/°C; above 25°C
Operating and Storage Temperature-55 to 175 °C; TJ, TSTG
Lead Soldering Temperature300 °C; leads at 0.063 in / 1.6 mm from case for 10 s
Package Body Soldering Temperature260 °C; package body for 10 s
Drain-to-Source Breakdown Voltagemin 60 V; ID=250 µA, VGS=0 V, TC=25°C
Drain-to-Source Breakdown Voltagemin 55 V; ID=250 µA, VGS=0 V, TC=-40°C
Zero Gate Voltage Drain Currentmax 1 µA; VDS=55 V, VGS=0 V
Zero Gate Voltage Drain Currentmax 250 µA; VDS=50 V, VGS=0 V, TC=150°C
Gate-to-Source Leakage Currentmax ±100 nA; VGS=±16 V
Gate-to-Source Threshold Voltagemin 1 V, max 3 V; VGS=VDS, ID=250 µA
Drain-to-Source On Resistancetyp 0.077 Ohm, max 0.092 Ohm; ID=13 A, VGS=10 V
Drain-to-Source On Resistancetyp 0.095 Ohm, max 0.107 Ohm; ID=8 A, VGS=5 V
Drain-to-Source On Resistancetyp 0.107 Ohm, max 0.117 Ohm; ID=8 A, VGS=4.5 V
Thermal Resistance Junction-to-Casemax 3.94 °C/W; TO-252 package
Thermal Resistance Junction-to-Ambientmax 100 °C/W; specified thermal condition not detailed
Turn-On Timemax 170 ns; VGS=4.5 V, VDD=30 V, ID=8 A, RGS=32 Ohm
Turn-On Delay Timetyp 8 ns; VGS=4.5 V, VDD=30 V, ID=8 A, RGS=32 Ohm
Rise Timetyp 105 ns; VGS=4.5 V, VDD=30 V, ID=8 A, RGS=32 Ohm
Turn-Off Delay Timetyp 22 ns; VGS=4.5 V, VDD=30 V, ID=8 A, RGS=32 Ohm
Fall Timetyp 39 ns; VGS=4.5 V, VDD=30 V, ID=8 A, RGS=32 Ohm
Turn-Off Timemax 92 ns; VGS=4.5 V, VDD=30 V, ID=8 A, RGS=32 Ohm
Turn-On Timemax 56 ns; VGS=10 V, VDD=30 V, ID=13 A, RGS=32 Ohm
Turn-On Delay Timetyp 5 ns; VGS=10 V, VDD=30 V, ID=13 A, RGS=32 Ohm
Rise Timetyp 32 ns; VGS=10 V, VDD=30 V, ID=13 A, RGS=32 Ohm
Turn-Off Delay Timetyp 43 ns; VGS=10 V, VDD=30 V, ID=13 A, RGS=32 Ohm
Fall Timetyp 45 ns; VGS=10 V, VDD=30 V, ID=13 A, RGS=32 Ohm
Turn-Off Timemax 132 ns; VGS=10 V, VDD=30 V, ID=13 A, RGS=32 Ohm
Total Gate Chargetyp 9.4 nC, max 11.3 nC; VGS=0 to 10 V, VDD=30 V, ID=8 A, Ig(REF)=1.0 mA
Gate Charge at 5 Vtyp 5.2 nC, max 6.2 nC; VGS=0 to 5 V, VDD=30 V, ID=8 A, Ig(REF)=1.0 mA
Threshold Gate Chargetyp 0.36 nC, max 0.43 nC; VGS=0 to 1 V, VDD=30 V, ID=8 A, Ig(REF)=1.0 mA
Gate-to-Source Gate Chargetyp 1.2 nC; VDD=30 V, ID=8 A, Ig(REF)=1.0 mA
Gate-to-Drain Chargetyp 2.5 nC; VDD=30 V, ID=8 A, Ig(REF)=1.0 mA
Input Capacitancetyp 350 pF; VDS=25 V, VGS=0 V, f=1 MHz
Output Capacitancetyp 105 pF; VDS=25 V, VGS=0 V, f=1 MHz
Reverse Transfer Capacitancetyp 23 pF; VDS=25 V, VGS=0 V, f=1 MHz
Source-to-Drain Diode Voltagemax 1.25 V; ISD=8 A
Source-to-Drain Diode Voltagemax 1.0 V; ISD=3 A
Reverse Recovery Timemax 66 ns; ISD=8 A, dISD/dt=100 A/µs
Reverse Recovered Chargemax 159 nC; ISD=8 A, dISD/dt=100 A/µs
Datasheet Statusrequest_only

Product Overview

The HUF76407D3S is an ON Semiconductor N-channel logic-level power MOSFET intended for Power_Management designs requiring a 60 V drain-to-source rating in a JEDEC TO-252AA package. Its logic-level gate drive specifications include continuous drain current ratings at VGS=5 V, VGS=4.5 V, and VGS=10 V, supporting designs that evaluate operation across different gate-drive conditions.

Electrical limits include ±16 V gate-to-source voltage, 60 V drain-to-gate voltage with RGS=20 kOhm, and drain-to-source breakdown voltage of at least 60 V at TC=25°C. On-resistance is specified at 0.092 Ohm maximum with ID=13 A and VGS=10 V, 0.107 Ohm maximum with ID=8 A and VGS=5 V, and 0.117 Ohm maximum with ID=8 A and VGS=4.5 V.

Thermal and assembly data include 38 W power dissipation at TC=25°C, 0.25 W/°C derating above 25°C, -55 to 175°C junction and storage temperature range, 300°C lead soldering temperature for 10 s, and 260°C package-body soldering temperature for 10 s.

Key Features

  • 60 V drain-to-source voltage absolute maximum rating
  • ±16 V gate-to-source voltage absolute maximum rating
  • 12 A continuous drain current at VGS=10 V
  • 11 A continuous drain current at VGS=5 V
  • 38 W power dissipation at TC=25°C
  • 0.092 Ohm maximum on resistance at VGS=10 V
  • 0.107 Ohm maximum on resistance at VGS=5 V
  • 9.4 nC typical total gate charge to 10 V
  • 350 pF typical input capacitance at 1 MHz
  • JEDEC TO-252AA package with 3.94°C/W junction-to-case resistance

Typical Applications

  • Logic-level MOSFET switching
  • 60 V power management rails
  • Low-side power switching
  • Gate-driven load control
  • TO-252 surface-mount power stages
  • Switching circuits using 4.5 V gate drive
  • Switching circuits using 10 V gate drive

Procurement Notes

When requesting a quote for HUF76407D3S, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.

FAQ

What type of device is the HUF76407D3S?

The HUF76407D3S is an ON Semiconductor N-channel logic-level power MOSFET in the Power_Management category. The extracted package information identifies it as a JEDEC TO-252AA device.

What voltage ratings are specified for HUF76407D3S?

The datasheet facts specify a 60 V drain-to-source absolute maximum rating at TC=25°C, a 60 V drain-to-gate rating with RGS=20 kOhm, and a ±16 V gate-to-source absolute maximum rating.

What on-resistance values are listed for this MOSFET?

Drain-to-source on resistance is specified as 0.092 Ohm maximum at ID=13 A and VGS=10 V, 0.107 Ohm maximum at ID=8 A and VGS=5 V, and 0.117 Ohm maximum at ID=8 A and VGS=4.5 V.

What thermal limits are provided for HUF76407D3S?

The extracted facts list 38 W power dissipation at TC=25°C, 0.25 W/°C derating above 25°C, -55 to 175°C operating and storage temperature range, and 3.94°C/W maximum junction-to-case thermal resistance.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 13, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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