Specifications
| Type | Description |
|---|---|
| Part Number | INA260 |
| Manufacturer | Texas Instruments |
| Product Type | Operational Amplifier |
| Category | Signal Chain |
| Package / Case | 16-pin TSSOP (PW), 5.00 mm x 4.40 mm nominal body |
| Integrated shunt resistance | 2 mΩ; current sense resistance |
| Integrated shunt tolerance equivalent | 0.1%; precision integrated shunt resistor |
| Maximum continuous current | 15 A; TA=-40°C to +85°C |
| Shunt temperature coefficient | 10 ppm/°C; 0°C to +125°C |
| Bus voltage sensing range | 0 V to 36 V; operating bus voltage measurement range |
| System gain error | 0.15% max; high accuracy specification |
| Current offset | 5 mA max; high accuracy specification |
| Programmable I2C addresses | 16 addresses; address pins A0 and A1 programmable |
| Operating supply voltage | 2.7 V to 5.5 V; single supply operation |
| Typical supply current | 310 µA typ; device operating supply current |
| Operating temperature range | -40°C to +125°C; specified operating temperature range |
| Analog input current absolute maximum | ±15 A; continuous conduction |
| Analog input common-mode absolute maximum | -0.3 V to 40 V; IN+ and IN- common-mode, (VIN+ + VIN-)/2 |
| Supply voltage absolute maximum | 6 V max; VS pin |
| VBUS pin voltage absolute maximum | -0.3 V to 40 V; VBUS pin |
| SDA/SCL/ALERT voltage absolute maximum | -0.3 V to 6 V; digital pins SDA, SCL, ALERT |
| Address pin voltage absolute maximum | -0.3 V to VS + 0.3 V; A0 and A1 pins |
| Open-drain digital output current | 10 mA max; IOUT absolute maximum |
| Junction temperature absolute maximum | 150°C max; TJ |
| Storage temperature range | -65°C to +150°C; Tstg |
| ESD rating, HBM | ±2000 V; human body model per ANSI/ESDA/JEDEC JS-001 |
| ESD rating, CDM | ±1000 V; charged device model per JEDEC JESD22-C101 |
| Recommended common-mode input voltage | 0 V to 36 V; VCM operating condition |
| Recommended operating supply voltage | 2.7 V to 5.5 V; VS operating condition |
| Recommended operating free-air temperature | -40°C to +125°C; TA operating condition |
| Junction-to-ambient thermal resistance | 115.6°C/W; 16-pin TSSOP package |
| Junction-to-case top thermal resistance | 50.1°C/W; 16-pin TSSOP package |
| Junction-to-board thermal resistance | 46.8°C/W; 16-pin TSSOP package |
| Junction-to-top characterization parameter | 3.3°C/W; 16-pin TSSOP package |
| Junction-to-board characterization parameter | 46.5°C/W; 16-pin TSSOP package |
| Common-mode input range | 0 V to 36 V; TA=25°C, VS=3.3 V, VIN+=12 V, VSENSE=0 mV, VVBUS=12 V unless otherwise noted |
| Bus voltage input range | 0 V to 36 V; ADC full-scale scaling is 40.96 V; do not apply more than 36 V |
| Common-mode rejection | 0 to 150 µA/V; 0 V ≤ VIN+ ≤ 36 V |
| Current sense offset, RTI | ±1.25 mA typ, ±5 mA max; TA=25°C, VS=3.3 V, VIN+=12 V, VSENSE=0 mV, VVBUS=12 V |
| Current sense offset drift, RTI | 1 µA/°C typ, 50 µA/°C max; -40°C ≤ TA ≤ +125°C |
| Current sense offset vs power supply, RTI | 1.6 mA/V typ, 3 mA/V max; 2.7 V ≤ VS ≤ 5.5 V |
| Bus offset voltage, RTI | ±1.25 mV typ, ±7.5 mV max; TA=25°C, VS=3.3 V, VIN+=12 V, VSENSE=0 mV, VVBUS=12 V |
| Bus offset voltage drift, RTI | 0.6 µV/°C typ, 40 µV/°C max; -40°C ≤ TA ≤ +125°C |
| Bus offset voltage vs power supply | 1.5 mV/V typ; TA=25°C, VS=3.3 V, VIN+=12 V, VSENSE=0 mV, VVBUS=12 V |
| Input bias current | 17 µA typ; IN+ plus IN- pins, ISENSE=0 A |
| VBUS input impedance | 830 kΩ typ; VBUS pin |
| Input leakage | 0.1 µA typ, 0.5 µA max; IN+ plus IN- pins, power-down mode |
| System current sense gain error, 25°C | 0.02% typ, 0.15% max; ISENSE=-15 A to +15 A, TA=25°C |
| System current sense gain error, full temperature | 0.2% typ, 0.5% max; ISENSE=-10 A to +10 A, -40°C ≤ TA ≤ +125°C |
| System current sense gain error drift | 10 ppm/°C typ, 35 ppm/°C max; -40°C ≤ TA ≤ +125°C |
| Bus voltage gain error, 25°C | 0.02% typ, 0.1% max; VBUS=0 V to 36 V, TA=25°C |
| Bus voltage gain error, full temperature | 0.1% typ, 0.4% max; VBUS=0 V to 36 V, -40°C ≤ TA ≤ +125°C |
| Bus voltage gain error drift | 15 ppm/°C typ, 40 ppm/°C max; -40°C ≤ TA ≤ +125°C |
| ADC native resolution | 16 bits; integrated ADC |
| Current register LSB step size | 1.25 mA; integrated ADC current measurement |
| Bus voltage register LSB step size | 1.25 mV; integrated ADC bus voltage measurement |
| Power register LSB step size | 10 mW; integrated ADC power calculation |
| ADC conversion time, CT bit=000 | 140 µs typ, 154 µs max |
| ADC conversion time, CT bit=001 | 204 µs typ, 224 µs max |
| ADC conversion time, CT bit=010 | 332 µs typ, 365 µs max |
| ADC conversion time, CT bit=011 | 588 µs typ, 646 µs max |
| ADC conversion time, CT bit=100 | 1.1 ms typ, 1.21 ms max |
| ADC conversion time, CT bit=101 | 2.116 ms typ, 2.328 ms max |
| ADC conversion time, CT bit=110 | 4.156 ms typ, 4.572 ms max |
| ADC conversion time, CT bit=111 | 8.244 ms typ, 9.068 ms max |
| ADC differential nonlinearity | ±0.1 LSB typ; integrated ADC |
| Package resistance | 4.5 mΩ typ; IN+ to IN- |
| Integrated shunt maximum continuous current | ±15 A; -40°C ≤ TA ≤ +85°C |
| Short-time overload change | ±0.05% typ; ISENSE=30 A for 5 seconds |
| Thermal shock resistance change | ±0.1% typ; -65°C ≤ TA ≤ +150°C, 500 cycles |
| Resistance change to solder heat | ±0.1% typ; 260°C solder, 10 s |
| High temperature exposure change | ±0.15% typ; 1000 hours, TA=150°C |
| Cold temperature storage change | ±0.025% typ; 24 hours, TA=-65°C |
| SMBus timeout | 28 ms min, 35 ms typ; interface resets anytime SCL is low for more than 28 ms |
| Digital input capacitance | 3 pF typ; digital input/output pins |
| Digital leakage input current | 0.1 µA typ, 1 µA max; 0 V ≤ VSCL ≤ VS, 0 V ≤ VSDA ≤ VS, 0 V ≤ VALERT ≤ VS, 0 V ≤ VA0 ≤ VS, 0 V ≤ VA1 ≤ VS |
| High-level input voltage | 0.7 × VS min, 6 V max; digital input VIH |
| Low-level input voltage | 0 V min, 0.3 × VS max; digital input VIL |
| Low-level output voltage | 0 V min, 0.4 V max; SDA and ALERT, IOL=3 mA |
| SDA/SCL hysteresis | 500 mV typ; I2C/SMBus interface pins |
| Operating supply range | 2.7 V to 5.5 V; power supply |
| Quiescent current | 310 µA typ, 420 µA max; operating mode |
| Power-down quiescent current | 0.5 µA typ, 2 µA max; shutdown mode |
| Power-on reset threshold | 2 V typ; VPOR |
| ALERT pin function | Open-drain multifunction alert output; pin 7 |
| VBUS pin function | Bus voltage monitor input; pin 12 |
| SDA pin function | Open-drain serial bus data input/output; pin 8 |
| SCL pin function | Serial bus clock input; pin 9 |
| Datasheet Status | request_only |
Product Overview
The INA260 is a Texas Instruments Signal_Chain sensor for digital current and power monitoring. It combines current sensing with an integrated 2 mΩ shunt resistor and a 16-bit ADC, providing current, bus voltage, and power register outputs with 1.25 mA, 1.25 mV, and 10 mW LSB step sizes respectively.
The device operates from a 2.7 V to 5.5 V supply and measures bus voltages from 0 V to 36 V. Current measurement supports an integrated shunt maximum continuous current of ±15 A from -40°C to +85°C, with current sense gain error specified as 0.02% typical and 0.15% maximum at 25°C across -15 A to +15 A.
The package is a 16-pin TSSOP (PW) with a 5.00 mm x 4.40 mm nominal body. Assembly and thermal-related facts include 115.6°C/W junction-to-ambient thermal resistance, ±0.1% typical resistance change to 260°C solder heat for 10 s, and storage from -65°C to +150°C. Interface functions include SDA, SCL, VBUS, A0/A1 address pins, and an open-drain ALERT pin.
Key Features
- Integrated 2 mΩ precision current-sense shunt
- 0.1% integrated shunt tolerance equivalent
- ±15 A integrated shunt continuous current rating
- 0 V to 36 V bus voltage sensing range
- 2.7 V to 5.5 V single-supply operation
- 16-bit ADC for current, voltage, and power registers
- 1.25 mA current register LSB step size
- 1.25 mV bus voltage register LSB step size
- 10 mW power register LSB step size
- 16 programmable I2C addresses using A0 and A1
- Open-drain multifunction ALERT output on pin 7
- 310 µA typical operating supply current
Typical Applications
- Current monitoring over I2C
- Bus voltage monitoring
- Power register measurement
- Bidirectional current measurement
- SMBus-based sensor nodes
- Systems with 0 V to 36 V buses
- Low-power shutdown monitoring
- Alert-driven measurement systems
Procurement Notes
When requesting a quote for INA260, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For analog and signal-chain sourcing, supply voltage, bandwidth, accuracy, noise level, package, temperature grade, input/output configuration and qualification requirements should be verified before approval.
FAQ
What current range does the INA260 integrated shunt support?
The INA260 integrated shunt is specified for ±15 A maximum continuous current from -40°C to +85°C. The analog input current absolute maximum is also ±15 A for continuous conduction.
What bus voltage range can INA260 measure?
INA260 supports a 0 V to 36 V operating bus voltage measurement range. The bus voltage input range is also specified as 0 V to 36 V, with ADC full-scale scaling at 40.96 V and a note not to apply more than 36 V.
What interface and address options are available?
INA260 uses I2C/SMBus pins including SDA and SCL. It provides 16 programmable I2C addresses through the A0 and A1 address pins and includes an open-drain multifunction ALERT output.
What supply range and current consumption are specified?
The device operates from a 2.7 V to 5.5 V supply. Operating quiescent current is specified as 310 µA typical and 420 µA maximum, while shutdown mode current is 0.5 µA typical and 2 µA maximum.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.