IRF530 N-channel Power MOSFET

Specifications

Product Overview

The Vishay IRF530 is a single N-channel power MOSFET supplied in a TO-220AB package. Key electrical limits include 100 V drain-source voltage, +/-20 V gate-source voltage, and 14 A continuous drain current at TC=25 degC with VGS=10 V. At TC=100 degC, the continuous drain current rating is 10 A, while the repetitive pulsed drain current rating is 56 A when limited by maximum junction temperature.

Conduction performance is specified with 0.16 ohm maximum drain-source on-state resistance at VGS=10 V and ID=8.4 A. Gate-drive and switching data include 26 nC maximum total gate charge, 10 ns typical turn-on delay, 23 ns typical rise time, 34 ns typical turn-off delay, and 24 ns typical fall time under the stated pulsed test conditions.

Thermal and assembly data include 88 W maximum power dissipation at TC=25 degC, 1.7 degC/W maximum junction-to-case thermal resistance, 62 degC/W maximum junction-to-ambient thermal resistance, and 0.50 degC/W typical case-to-sink resistance on a flat greased surface. The device has a 300 degC soldering recommendation for 10 s at 1.6 mm from the case and 10 lbf in; 1.1 N m mounting torque for a 6-32 or M3 screw.

Key Features

• Single N-channel power MOSFET configuration
• 100 V drain-source voltage rating
• 0.16 ohm maximum on-resistance at VGS=10 V
• 26 nC maximum total gate charge
• 14 A continuous drain current at TC=25 degC
• 56 A repetitive pulsed drain current rating
• 88 W maximum power dissipation at TC=25 degC
• -55 to +175 degC junction and storage range
• TO-220AB package with specified mounting torque
• Integral source-drain diode rated to 14 A continuous

Typical Applications

• Power switching circuits
• Load switching stages
• Motor-drive power stages
• DC converter switching
• Solenoid and relay drivers
• Body-diode recovery circuits
• TO-220 heat-sinked assemblies

Procurement Notes

When requesting a quote for IRF530, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.