IRFP140 N-channel Power MOSFET

Specifications

Product Overview

The Vishay IRFP140 is a single N-channel power MOSFET intended for power-management switching roles where the design requires a 100 V drain-source rating and a TO-247AC through-hole power package. The package information identifies pins as 1=Gate, 2=Drain, 3=Source, and 4=Drain, with package body dimensions varying by facility code and Version 1 dimensions listed as D=20.40-20.70 mm and E=15.50-15.87 mm.

The device is rated for 31 A continuous drain current at TC=25°C with VGS=10 V, reduced to 22 A at TC=100°C, and supports 120 A pulsed drain current under the repetitive pulse limitation. Its maximum on-state resistance is 0.077 ohm at VGS=10 V, ID=19 A, and TJ=25°C. Switching and drive data include 72 nC maximum total gate charge, 11 nC gate-source charge, 32 nC gate-drain charge, and typical timing values of 11 ns turn-on delay, 45 ns rise time, 43 ns turn-off delay, and 43 ns fall time.

Thermal and assembly limits include 180 W maximum power dissipation at TC=25°C, 0.83°C/W maximum junction-to-case thermal resistance, 40°C/W maximum junction-to-ambient thermal resistance, 300°C soldering peak temperature for 10 seconds at 1.6 mm from the case, and 10 lbf·in / 1.1 N·m mounting torque with a 6-32 or M3 screw.

Key Features

• Single N-channel MOSFET configuration
• 100 V drain-source voltage rating
• 0.077 ohm maximum on-state resistance
• 31 A continuous drain current at TC=25°C
• 120 A repetitive pulsed drain current rating
• 180 W maximum power dissipation at TC=25°C
• 72 nC maximum total gate charge
• TO-247AC package with drain tab connection
• -55 to +175°C junction temperature range
• Body diode rated for 31 A continuous current

Typical Applications

• 100 V power switching stages
• TO-247AC heat-sinked power designs
• Gate-driven MOSFET switching circuits
• Avalanche-rated power switching circuits
• Body-diode conduction paths
• High-current pulsed switching designs

Procurement Notes

When requesting a quote for IRFP140, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.