IRL510 N-channel Power MOSFET

Vishay Power_Management — specifications, applications, sourcing support and RFQ.

IRL510 N-channel Power MOSFET

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
IRL510
Manufacturer
Vishay
Package
TO-220AB
Category
Power Management
Product Type
LDO Regulator

Quick Sourcing Note

IRL510 from Vishay is an N-channel power MOSFET in the Power_Management category, supplied in a TO-220AB package. It is specified for 100 V drain-source voltage and logic-level gate drive, with 0.54 ohm maximum on-state resistance at VGS=5.0 V. Key limits include 5.6 A continuous drain current at TC=25 °C, 18 A pulsed drain current, 43 W maximum power dissipation, and a -55 to +175 °C operating junction and storage range. Gate charge is specified at 6.1 nC maximum, supporting logic-level switching applications where TO-220AB mounting and thermal design are required.

Specifications

TypeDescription
Part NumberIRL510
ManufacturerVishay
Product TypeLDO Regulator
CategoryPower Management
Component TypeOther
Package / CaseTO-220AB
Drain-Source Voltage100 V; condition: Product summary; source page: 1
Drain-Source On-State Resistance0.54 ohm max; condition: VGS=5.0 V; source page: 1
Total Gate Charge6.1 nC max; condition: Product summary; source page: 1
Gate-Source Charge2.6 nC; condition: Product summary; source page: 1
Gate-Drain Charge3.3 nC; condition: Product summary; source page: 1
ConfigurationSingle; condition: Product summary; source page: 1
Lead-Free Ordering Part NumberIRL510PbF; condition: TO-220AB package; source page: 1
Lead-Free and Halogen-Free Ordering Part NumberIRL510PbF-BE3; condition: TO-220AB package; source page: 1
Gate-Source Voltage+/-10 V; condition: Absolute maximum rating, TC=25 °C; source page: 1
Continuous Drain Current5.6 A; condition: VGS=5 V, TC=25 °C; source page: 1
Continuous Drain Current4.0 A; condition: VGS=5 V, TC=100 °C; source page: 1
Pulsed Drain Current18 A; condition: Repetitive rating; pulse width limited by maximum junction temperature; source page: 1
Linear Derating Factor0.29 W/°C; condition: Absolute maximum rating; source page: 1
Single Pulse Avalanche Energy100 mJ; condition: VDD=25 V, starting TJ=25 °C, L=4.8 mH, Rg=25 ohm, IAS=5.6 A; source page: 1
Repetitive Avalanche Current5.6 A; condition: Repetitive rating; pulse width limited by maximum junction temperature; source page: 1
Repetitive Avalanche Energy4.3 mJ; condition: Repetitive rating; pulse width limited by maximum junction temperature; source page: 1
Maximum Power Dissipation43 W; condition: TC=25 °C; source page: 1
Peak Diode Recovery dV/dt5.5 V/ns; condition: ISD<=5.6 A, dI/dt<=75 A/us, VDD<=VDS, TJ<=175 °C; source page: 1
Operating Junction and Storage Temperature Range-55 to +175 °C; condition: Absolute maximum rating; source page: 1
Soldering Peak Temperature300 °C; condition: For 10 s, 1.6 mm from case; source page: 1
Mounting Torque10 lbf·in; 1.1 N·m; condition: 6-32 or M3 screw; source page: 1
Maximum Junction-to-Ambient Thermal Resistance62 °C/W max; condition: Thermal resistance rating; source page: 2
Case-to-Sink Thermal Resistance0.50 °C/W typ; condition: Flat, greased surface; source page: 2
Maximum Junction-to-Case Thermal Resistance3.5 °C/W max; condition: Drain; source page: 2
Drain-Source Breakdown Voltage100 V min; condition: VGS=0 V, ID=250 uA; source page: 2
Drain-Source Voltage Temperature Coefficient0.12 V/°C typ; condition: Reference to 25 °C, ID=1 mA; source page: 2
Gate-Source Threshold Voltage1.0 V min, 2.0 V max; condition: VDS=VGS, ID=250 uA; source page: 2
Gate-Source Leakage+/-100 nA max; condition: VGS=+/-10 V; source page: 2
Zero Gate Voltage Drain Current25 uA max; condition: VDS=100 V, VGS=0 V; source page: 2
Zero Gate Voltage Drain Current250 uA max; condition: VDS=80 V, VGS=0 V, TJ=150 °C; source page: 2
Drain-Source On-State Resistance0.54 ohm max; condition: VGS=5.0 V, ID=3.4 A, pulse width<=300 us, duty cycle<=2 %; source page: 2
Drain-Source On-State Resistance0.76 ohm max; condition: VGS=4.0 V, ID=2.8 A, pulse width<=300 us, duty cycle<=2 %; source page: 2
Forward Transconductance1.9 S min; condition: VDS=50 V, ID=3.4 A, pulse width<=300 us, duty cycle<=2 %; source page: 2
Input Capacitance250 pF typ; condition: VGS=0 V, VDS=25 V, f=1.0 MHz; source page: 2
Output Capacitance80 pF typ; condition: VGS=0 V, VDS=25 V, f=1.0 MHz; source page: 2
Reverse Transfer Capacitance15 pF typ; condition: VGS=0 V, VDS=25 V, f=1.0 MHz; source page: 2
Total Gate Charge6.1 nC max; condition: ID=5.6 A, VDS=80 V, VGS=5.0 V; source page: 2
Gate-Source Charge2.6 nC max; condition: ID=5.6 A, VDS=80 V, VGS=5.0 V; source page: 2
Gate-Drain Charge3.3 nC max; condition: ID=5.6 A, VDS=80 V, VGS=5.0 V; source page: 2
Turn-On Delay Time9.3 ns typ; condition: VDD=50 V, RD=12 ohm, RG=8.4 ohm, ID=5.6 A; source page: 2
Rise Time47 ns typ; condition: VDD=50 V, RD=12 ohm, RG=8.4 ohm, ID=5.6 A; source page: 2
Turn-Off Delay Time16 ns typ; condition: VDD=50 V, RD=12 ohm, RG=8.4 ohm, ID=5.6 A; source page: 2
Fall Time18 ns typ; condition: VDD=50 V, RD=12 ohm, RG=8.4 ohm, ID=5.6 A; source page: 2
Internal Drain Inductance4.5 nH typ; condition: Between lead 6 mm (0.25 in) from package and center of die contact; source page: 2
Internal Source Inductance7.5 nH typ; condition: Between lead 6 mm (0.25 in) from package and center of die contact; source page: 2
Continuous Source-Drain Diode Current5.6 A max; condition: MOSFET integral reverse p-n junction diode; source page: 2
Pulsed Diode Forward Current18 A max; condition: Repetitive rating; pulse width limited by maximum junction temperature; source page: 2
Body Diode Voltage2.5 V max; condition: TJ=25 °C, IS=5.6 A, VGS=0 V, pulse width<=300 us, duty cycle<=2 %; source page: 2
Body Diode Reverse Recovery Time110 ns typ, 130 ns max; condition: TJ=25 °C, IF=5.6 A, dI/dt=100 A/us, pulse width<=300 us, duty cycle<=2 %; source page: 2
Body Diode Reverse Recovery Charge0.50 uC typ, 0.65 uC max; condition: TJ=25 °C, IF=5.6 A, dI/dt=100 A/us, pulse width<=300 us, duty cycle<=2 %; source page: 2
Forward Turn-On TimeIntrinsic turn-on time is negligible; condition: Turn-on dominated by LS and LD; source page: 2
Gate Drive TypeLogic-level gate drive; condition: Feature list; source page: 1
Operating Temperature Rating175 °C; condition: Feature list; source page: 1
Channel TypeN-channel; condition: Product description; source page: 1
Datasheet Statusrequest_only

Product Overview

The Vishay IRL510 is a single N-channel power MOSFET intended for Power_Management designs that require a 100 V drain-source rating and logic-level gate drive. The device is packaged in TO-220AB and has ordering options IRL510PbF for lead-free supply and IRL510PbF-BE3 for lead-free and halogen-free supply.

Electrical limits include 0.54 ohm maximum drain-source on-state resistance at VGS=5.0 V and ID=3.4 A, or 0.76 ohm maximum at VGS=4.0 V and ID=2.8 A. Gate-source threshold voltage is specified from 1.0 V to 2.0 V, with gate-source leakage of +/-100 nA maximum at VGS=+/-10 V.

For thermal and assembly planning, the IRL510 is rated for 43 W maximum power dissipation at TC=25 °C, 3.5 °C/W maximum junction-to-case thermal resistance, and 62 °C/W maximum junction-to-ambient thermal resistance. It supports soldering at 300 °C for 10 s at 1.6 mm from the case and mounting torque of 10 lbf·in or 1.1 N·m using a 6-32 or M3 screw.

Key Features

  • 100 V drain-source voltage rating
  • Logic-level gate drive for low-voltage control
  • 0.54 ohm maximum RDS(on) at VGS=5.0 V
  • 6.1 nC maximum total gate charge
  • 5.6 A continuous drain current at TC=25 °C
  • 18 A repetitive pulsed drain current rating
  • 43 W maximum power dissipation at TC=25 °C
  • -55 to +175 °C junction and storage range
  • TO-220AB package with 10 lbf·in mounting torque
  • Integral body diode rated to 5.6 A continuous

Typical Applications

  • Logic-level power switching
  • Low-voltage gate-drive circuits
  • TO-220AB power stages
  • Avalanche-rated switching designs
  • Body-diode commutation paths
  • Thermally managed power control
  • 100 V N-channel MOSFET replacement

Procurement Notes

When requesting a quote for IRL510, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.

FAQ

What type of MOSFET is the IRL510?

The IRL510 is a Vishay single N-channel power MOSFET. It is listed in the Power_Management category and supplied in a TO-220AB package with logic-level gate drive.

What drain-source voltage rating does the IRL510 provide?

The IRL510 has a 100 V drain-source voltage rating in the product summary. Its drain-source breakdown voltage is specified as 100 V minimum at VGS=0 V and ID=250 uA.

What is the IRL510 on-state resistance at logic gate drive?

At VGS=5.0 V, the IRL510 drain-source on-state resistance is specified as 0.54 ohm maximum. The detailed condition is ID=3.4 A with pulse width <=300 us and duty cycle <=2 %.

What thermal limits are specified for the IRL510 package?

The IRL510 is rated for 43 W maximum power dissipation at TC=25 °C. Thermal resistance values include 3.5 °C/W maximum junction-to-case, 62 °C/W maximum junction-to-ambient, and 0.50 °C/W typical case-to-sink on a flat greased surface.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 21, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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