LDC1312 12-bit Inductance-to-Digital Converter

Texas Instruments Sensor — specifications, applications, sourcing support and RFQ.

LDC1312 12-bit Inductance-to-Digital Converter

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Part Number
LDC1312
Manufacturer
Texas Instruments
Package
LDC1312: WSON-12, 4 mm x 4 mm; LDC1314: WQFN-16, 4 mm x 4 mm
Category
Sensors
Product Type
12-bit inductance-to-digital converter

Quick Sourcing Note

LDC1312 from Texas Instruments is a Sensor component described as a 12-bit inductance-to-digital converter. The LDC1312 version provides 2 channels in a WSON-12, 4 mm x 4 mm package. It supports sensor resonance frequencies from 1 kHz to 10 MHz and remote sensor positioning beyond 20 cm. Key operating limits include a 2.7 to 3.6 V supply range, -40 to 125 °C operating temperature, 13.3 kSPS maximum channel sample rate, and I2C address selection at 0x2A or 0x2B. Use cases should align with inductive sensing channels, remote sensor placement, and CLKIN or internal oscillator configurations.

Specifications

TypeDescription
Part NumberLDC1312
ManufacturerTexas Instruments
Product Type12-bit inductance-to-digital converter
CategorySensors
Component TypeSensor
Package / CaseLDC1312: WSON-12, 4 mm x 4 mm; LDC1314: WQFN-16, 4 mm x 4 mm
Channel Count2 channels; condition: LDC1312
ADC Resolution12 bits; condition: RESET_DEV.OUTPUT_GAIN=b00; RCOUNTx >= 0x0400
Sensor Frequency Range1 kHz to 10 MHz; condition: supported sensor resonance frequency range
Remote Sensor Position>20 cm; condition: remote sensor position supported
Supply Voltage2.7 to 3.6 V; condition: recommended operating condition, TA=25°C unless otherwise specified
Operating Temperature-40 to 125 °C; condition: recommended operating condition
Absolute Maximum Supply Voltage5 V; condition: stress rating only
Absolute Maximum Voltage on Any Pin-0.3 V to VDD + 0.3 V; condition: stress rating only
Absolute Maximum INx Pin Input Current-8 to 8 mA; condition: any INx pin, stress rating only
Absolute Maximum Digital Pin Input Current-5 to 5 mA; condition: any digital pin, stress rating only
Absolute Maximum Junction Temperature-55 to 150 °C; condition: stress rating only
Storage Temperature Range-65 to 150 °C; condition: stress rating only
ESD HBM Rating±2000 V; condition: LDC1312 WSON-12, ANSI/ESDA/JEDEC JS-001
ESD CDM Rating±750 V; condition: LDC1312 WSON-12, JEDEC JESD22-C101
Junction-to-Ambient Thermal Resistance50 °C/W; condition: LDC1312 WSON-12 package
Supply Current2.1 mA typ; condition: fCLKIN=10 MHz; sensor current not included; TA=25°C, VDD=3.3 V
Sleep Mode Supply Current35 µA typ, 60 µA max; condition: SLEEP_MODE_EN=b1; TA=25°C, VDD=3.3 V
Shutdown Mode Supply Current0.2 µA typ, 1 µA max; condition: SD=VDD; TA=25°C, VDD=3.3 V
Sensor Maximum Current Drive1.5 mA typ; condition: HIGH_CURRENT_DRV=b0; DRIVE_CURRENTx=0xF800
Sensor Parallel Resistance Range1 to 100 kΩ; condition: sensor RP
High-Current Sensor Maximum Current Drive6 mA typ; condition: HIGH_CURRENT_DRV=b1; DRIVE_CURRENT0=0xF800; channel 0 only
Minimum Sensor Parallel Resistance in High-Current Mode250 Ω; condition: RP, high-current sensor drive mode
Sensor Resonance Frequency0.001 to 10 MHz; condition: TA=-40°C to +125°C
Maximum Oscillation Amplitude1.8 V peak; condition: sensor maximum oscillation amplitude
Maximum Channel Sample Rate13.3 kSPS; condition: single active channel continuous conversion, SCL=400 kHz
Sensor Pin Input Capacitance4 pF typ; condition: sensor input pins
ADDR and SD Low Voltage Threshold0.3 x VDD max; condition: digital pin logic low threshold
ADDR and SD High Voltage Threshold0.7 x VDD min; condition: digital pin logic high threshold
INTB Low Output Voltage0.4 V max; condition: 3 mA sink current
INTB High Output Voltage2.4 V min; condition: digital output high level
External Reference Clock Input Frequency2 to 40 MHz; condition: CLKIN, TA=-40°C to +125°C
External Reference Clock Minimum Duty Cycle40%; condition: CLKIN
External Reference Clock Maximum Duty Cycle60%; condition: CLKIN
CLKIN Low Voltage Threshold0.3 x VDD max; condition: external reference clock input
CLKIN High Voltage Threshold0.7 x VDD min; condition: external reference clock input
I2C Address Low Selection0x2A; condition: ADDR=L
I2C Address High Selection0x2B; condition: ADDR=H
Shutdown Pin LogicSD=L normal operation; SD=H inactive mode; condition: SD input must not float
External Clock Pin UsageTie CLKIN to GND if internal oscillator is used; condition: CLKIN pin configuration
Datasheet Statusrequest_only

Product Overview

The LDC1312 is a Texas Instruments Sensor component and a 12-bit inductance-to-digital converter. For the LDC1312 device, the channel count is 2 channels, and the package is WSON-12 with a 4 mm x 4 mm body size. The extracted package data also lists the related LDC1314 in WQFN-16, 4 mm x 4 mm.

The device operates from a recommended 2.7 to 3.6 V supply and across a -40 to 125 °C operating temperature range. Its supported sensor resonance frequency range is 1 kHz to 10 MHz, with the electrical table also specifying 0.001 to 10 MHz across -40 °C to +125 °C. The maximum channel sample rate is 13.3 kSPS for a single active channel in continuous conversion with SCL at 400 kHz.

Interface and assembly planning should account for ADDR-selected I2C addresses of 0x2A and 0x2B, SD pin logic where SD low is normal operation and SD high is inactive mode, and CLKIN handling where CLKIN is tied to GND when the internal oscillator is used.

Key Features

  • 2-channel LDC1312 inductance-to-digital converter
  • 12-bit ADC resolution under specified register conditions
  • Supports 1 kHz to 10 MHz sensor frequency range
  • Remote sensor position supported beyond 20 cm
  • 2.7 to 3.6 V recommended supply range
  • -40 to 125 °C recommended operating temperature
  • 13.3 kSPS maximum channel sample rate
  • I2C address selectable as 0x2A or 0x2B
  • External CLKIN supports 2 to 40 MHz input
  • Shutdown pin selects normal or inactive mode

Typical Applications

  • Two-channel inductive sensing
  • Remote sensor placement beyond 20 cm
  • I2C-addressed sensor interfaces
  • External reference clock sensor systems
  • Internal oscillator sensor configurations
  • High-current channel 0 sensor drive
  • Continuous single-channel conversion

Procurement Notes

When requesting a quote for LDC1312, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.

FAQ

What type of device is the LDC1312?

The LDC1312 is a Texas Instruments Sensor component described as a 12-bit inductance-to-digital converter. The LDC1312 version has 2 channels and is listed in a WSON-12, 4 mm x 4 mm package.

What sensor frequency range does LDC1312 support?

The extracted datasheet facts specify a supported sensor resonance frequency range of 1 kHz to 10 MHz. The electrical table also lists sensor resonance frequency as 0.001 to 10 MHz across -40°C to +125°C.

What supply and temperature ranges apply to LDC1312?

The recommended supply voltage range is 2.7 to 3.6 V. The recommended operating temperature range is -40 to 125 °C. Absolute maximum and storage ratings are stress ratings, not normal operating conditions.

How are the LDC1312 I2C addresses selected?

The ADDR pin selects the I2C address. When ADDR is low, the address is 0x2A. When ADDR is high, the address is 0x2B. The SD input must not float.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 28, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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