Specifications
| Type | Description |
|---|---|
| Part Number | LM5163 |
| Manufacturer | Texas Instruments |
| Product Type | LDO Regulator |
| Category | Power Management |
| Package / Case | DDA, 8-pin SO PowerPAD, 4.9 mm × 6 mm |
| Component Type | Power_IC |
| Input Voltage Range | 6 to 100 V; recommended operating conditions |
| Output Load Current | 0.5 A nominal, 0.6 A maximum; recommended operating conditions |
| Switching Frequency | up to 1000 kHz; recommended operating conditions |
| Programmable On-Time | 50 to 10000 ns; recommended operating conditions |
| External Bootstrap Capacitance | 2.2 nF; recommended operating conditions, BST to SW |
| Bootstrap Capacitance Absolute Maximum | 1.5 to 2.5 nF; external BST to SW capacitance |
| VIN to GND Absolute Maximum | -0.3 to 100 V; over recommended junction temperature range |
| EN to GND Absolute Maximum | -0.3 to 100 V; over recommended junction temperature range |
| FB to GND Absolute Maximum | -0.3 to 5.5 V; over recommended junction temperature range |
| RON to GND Absolute Maximum | -0.3 to 5.5 V; over recommended junction temperature range |
| BST to GND Absolute Maximum | -0.3 to 105.5 V; over recommended junction temperature range |
| BST to SW Absolute Maximum | -0.3 to 5.5 V; over recommended junction temperature range |
| SW to GND Absolute Maximum | -1.5 to 100 V; over recommended junction temperature range |
| SW to GND Transient Absolute Maximum | -3 V; 20 ns transient |
| PGOOD to GND Absolute Maximum | -0.3 to 14 V; over recommended junction temperature range |
| Operating Junction Temperature | -40 to 150 °C; absolute maximum ratings and recommended operating junction temperature range |
| Storage Temperature | -65 to 150 °C; absolute maximum ratings |
| ESD Rating HBM | ±2000 V; human-body model per ANSI/ESDA/JEDEC JS-001 |
| ESD Rating CDM | ±500 V; charged-device model per JEDEC JESD22-C101 |
| Shutdown Current | 3 µA typ, 15 µA max; VIN shutdown current, VEN = 0 V |
| Sleep Current | 10.5 µA typ, 25 µA max; VIN sleep current, VEN = 2.5 V, VFB = 1.5 V |
| Active Current | 600 µA typ, 880 µA max; VIN active current, VEN = 2.5 V |
| Shutdown Threshold Rising | 1.1 V; EN/UVLO voltage rising |
| Shutdown Threshold Falling | 0.45 V; EN/UVLO voltage falling |
| Enable Threshold Rising | 1.45 V min, 1.5 V typ, 1.55 V max; EN/UVLO voltage rising |
| Enable Threshold Falling | 1.35 V min, 1.4 V typ, 1.44 V max; EN/UVLO voltage falling |
| Feedback Regulation Voltage | 1.181 V min, 1.2 V typ, 1.218 V max; VFB falling |
| On-Time 1 | 5000 ns; VIN = 6 V, RRON = 75 kΩ |
| On-Time 2 | 1650 ns; VIN = 6 V, RRON = 25 kΩ |
| On-Time 3 | 2550 ns; VIN = 12 V, RRON = 75 kΩ |
| On-Time 4 | 830 ns; VIN = 12 V, RRON = 25 kΩ |
| PGOOD Upper Threshold | 1.105 V min, 1.14 V typ, 1.175 V max; FB upper threshold for PGOOD high to low, VFB rising |
| PGOOD Lower Threshold | 1.055 V min, 1.08 V typ, 1.1 V max; FB lower threshold for PGOOD high to low, VFB falling |
| PGOOD Threshold Hysteresis | 60 mV; PGOOD upper and lower threshold hysteresis, VFB falling |
| PGOOD Pulldown Resistance | 30 Ω; VFB = 1 V |
| Gate Drive UVLO | 2.7 V min, 3.4 V typ; BST voltage rising |
| High-Side MOSFET On-Resistance | 0.725 Ω typ; ISW = -100 mA |
| Low-Side MOSFET On-Resistance | 0.33 Ω typ; ISW = 100 mA |
| Internal Soft-Start Time | 1.75 ms min, 3 ms typ, 4.75 ms max |
| High-Side Peak Current Limit | 0.63 A min, 0.75 A typ, 0.87 A max |
| Low-Side Peak Current Limit | 0.63 A min, 0.75 A typ, 0.87 A max |
| Peak-to-Valley Current Limit Delta | 100 mA; minimum of IPEAK1 or IPEAK2 minus IVALLEY |
| Valley Current Limit Threshold | 0.5 A min, 0.6 A typ, 0.72 A max |
| Thermal Shutdown Threshold | 175 °C; TJ rising |
| Thermal Shutdown Hysteresis | 10 °C |
| Junction-to-Ambient Thermal Resistance | 43.4 °C/W; DDA SOIC 8-pin package |
| Junction-to-Case Top Thermal Resistance | 59.5 °C/W; DDA SOIC 8-pin package |
| Junction-to-Board Thermal Resistance | 16.1 °C/W; DDA SOIC 8-pin package |
| Junction-to-Top Characterization Parameter | 4.0 °C/W; DDA SOIC 8-pin package |
| Junction-to-Board Characterization Parameter | 16.3 °C/W; DDA SOIC 8-pin package |
| Junction-to-Case Bottom Thermal Resistance | 3.9 °C/W; DDA SOIC 8-pin package |
| Datasheet Status | request_only |
Product Overview
The LM5163 is a Texas Instruments synchronous buck DC/DC converter categorized under Power_Management. Its recommended input voltage range is 6 to 100 V, and the specified output load capability is 0.5 A nominal with a 0.6 A maximum. The converter supports switching frequencies up to 1000 kHz and programmable on-time from 50 to 10000 ns.
The device uses a DDA, 8-pin SO PowerPAD package measuring 4.9 mm × 6 mm. Assembly and layout review should account for the external bootstrap capacitance requirement of 2.2 nF from BST to SW, with an absolute maximum bootstrap capacitance range of 1.5 to 2.5 nF.
Control and protection data include EN/UVLO thresholds, 1.2 V typical feedback regulation voltage, PGOOD upper and lower thresholds, internal soft-start from 1.75 ms to 4.75 ms, high-side and low-side current limits, and thermal shutdown at 175 °C with 10 °C hysteresis. These parameters support use in high-voltage buck regulation and monitored power-management rails.
Key Features
- 6 to 100 V recommended input voltage range
- 0.5 A nominal, 0.6 A maximum output load current
- Switching frequency specified up to 1000 kHz
- Programmable on-time range from 50 to 10000 ns
- 2.2 nF recommended external bootstrap capacitance
- 1.2 V typical feedback regulation voltage
- PGOOD thresholds specified for rising and falling feedback
- Internal soft-start time from 1.75 ms to 4.75 ms
- High-side and low-side 0.75 A typical peak current limits
- Thermal shutdown at 175 °C with 10 °C hysteresis
- DDA 8-pin SO PowerPAD, 4.9 mm × 6 mm package
Typical Applications
- 6 to 100 V input rails
- 0.5 A nominal buck outputs
- Synchronous DC/DC conversion
- Power-management supply rails
- PGOOD-monitored voltage rails
- Thermally reviewed SOIC designs
- Externally programmed on-time converters
Procurement Notes
When requesting a quote for LM5163, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.
FAQ
What input voltage range does LM5163 support?
LM5163 supports a recommended operating input voltage range of 6 to 100 V. The VIN-to-GND absolute maximum rating is -0.3 to 100 V over the recommended junction temperature range.
What output current is specified for LM5163?
The specified output load current is 0.5 A nominal and 0.6 A maximum under recommended operating conditions. Current-limit data includes 0.75 A typical high-side and low-side peak current thresholds.
Which package is used for LM5163?
LM5163 is specified in a DDA, 8-pin SO PowerPAD package measuring 4.9 mm × 6 mm. Thermal data for this package includes 43.4 °C/W junction-to-ambient resistance and 3.9 °C/W junction-to-case bottom resistance.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.