Specifications
| Type | Description |
|---|---|
| Part Number | LM95071 |
| Manufacturer | Texas Instruments |
| Product Type | Digital temperature sensor |
| Category | Signal Chain |
| Package / Case | SOT-23 (DBV), 5 pins, 2.90 mm x 1.60 mm nominal body |
| Interface | SPI and MICROWIRE compatible; 3-wire serial interface |
| Temperature sensing range | -40°C to +150°C; operating range |
| Supply voltage | 2.4 V to 5.5 V; recommended operating range |
| Temperature accuracy | ±1.0°C max; VDD=3.0 V to 3.6 V, TA=0°C to +70°C, TA=TJ=TMIN to TMAX |
| Temperature accuracy | ±2.0°C max; VDD=3.0 V to 3.6 V, TA=-40°C to +150°C, TA=TJ=TMIN to TMAX |
| Temperature resolution | 0.03125°C; 13-bit plus sign output; 14-bit converter representation |
| Resolution | 14 bits; temperature-to-digital converter |
| Temperature conversion time | 130 ms typ; TA=TJ=+25°C |
| Temperature conversion time | 228 ms max; TA=TJ=TMIN to TMAX |
| Operating quiescent current | 280 µA typ; serial bus inactive, TA=TJ=+25°C |
| Operating quiescent current | 520 µA max; serial bus inactive, TA=TJ=TMIN to TMAX |
| Shutdown current | 6 µA typ; TA=TJ=+25°C |
| Shutdown current | 28 µA max; TA=TJ=TMIN to TMAX |
| Line regulation | +0.3°C/V; VDD=3.6 V to 5.5 V, TA=0°C to +70°C |
| Line regulation | -0.6°C/V; VDD=3.0 V to 2.4 V, TA=0°C to +70°C |
| Power-on first valid read delay | At least 228 ms; following power-on reset |
| Minimum interval between temperature reads | >228 ms; for accurate temperature result between consecutive reads |
| Absolute maximum supply voltage | -0.3 V to 6 V; stress rating |
| Absolute maximum voltage at any pin | -0.3 V to VDD + 0.3 V; stress rating |
| Absolute maximum input current at any pin | 5 mA max; when input voltage exceeds supplies |
| Storage temperature | -65°C to +150°C; absolute maximum rating |
| HBM ESD rating | ±2000 V; ANSI/ESDA/JEDEC JS-001 |
| CDM ESD rating | ±250 V; JEDEC JESD22-C101 |
| Junction-to-ambient thermal resistance | 167.2°C/W; DBV SOT-23, 5 pins |
| Junction-to-case top thermal resistance | 118.8°C/W; DBV SOT-23, 5 pins |
| Junction-to-board thermal resistance | 30.7°C/W; DBV SOT-23, 5 pins |
| Junction-to-top characterization parameter | 14.4°C/W; DBV SOT-23, 5 pins |
| Junction-to-board characterization parameter | 30.1°C/W; DBV SOT-23, 5 pins |
| Logical 1 input voltage | 0.7 x VDD min to VDD + 0.3 V max; TA=TJ=TMIN to TMAX |
| Logical 0 input voltage | -0.3 V min to 0.3 x VDD max; TA=TJ=TMIN to TMAX |
| Input hysteresis voltage | 0.4 V typ; VDD=3 V to 3.6 V, TA=TJ=+25°C |
| Input hysteresis voltage | 0.33 V min; VDD=3 V to 3.6 V, TA=TJ=TMIN to TMAX |
| Logical 1 input current | 0.005 µA typ, 3 µA max; VIN=VDD; typ at TA=TJ=+25°C, max at TA=TJ=TMIN to TMAX |
| Logical 0 input current | -0.005 µA typ, -3 µA min; VIN=0 V; typ at TA=TJ=+25°C, min at TA=TJ=TMIN to TMAX |
| Digital input capacitance | 20 pF typ; all digital inputs, TA=TJ=+25°C |
| High-level output voltage | 2.25 V min; IOH=-400 µA, TA=TJ=TMIN to TMAX |
| Low-level output voltage | 0.4 V max; IOL=+1.6 mA, TA=TJ=TMIN to TMAX |
| TRI-STATE output leakage current | -1 µA to +1 µA; VO=GND or VO=VDD, TA=TJ=TMIN to TMAX |
| SC clock period | 0.16 µs min; TA=TJ=TMIN to TMAX |
| SC clock period | DC typ; TA=TJ=+25°C |
| CS low to SC high setup time | 100 ns min; TA=TJ=TMIN to TMAX |
| CS low to data out delay | 70 ns max; TA=TJ=TMIN to TMAX |
| SC low to data out delay | 70 ns max; TA=TJ=TMIN to TMAX |
| CS high to data out TRI-STATE time | 200 ns max; TA=TJ=TMIN to TMAX |
| SC high to data in hold time | 50 ns min; TA=TJ=TMIN to TMAX |
| Data in setup time to SC high | 30 ns min; TA=TJ=TMIN to TMAX |
| SC high to CS high hold time | 50 ns min; TA=TJ=TMIN to TMAX |
| Pin 1 function | CS, chip select input, active low; DBV 5-pin SOT-23 package |
| Pin 3 function | SI/O, bidirectional serial input/output; Schmitt trigger input in input mode |
| Pin 4 function | SC, serial bus clock input; Schmitt trigger input |
| Pin 5 function | VDD positive supply voltage; bypass with 0.1-µF ceramic capacitor to ground |
| Datasheet Status | request_only |
Product Overview
The LM95071 is a Texas Instruments digital temperature sensor for systems that need temperature data over a compact 3-wire serial interface. Its interface is compatible with SPI and MICROWIRE, using CS, SC, and SI/O signal pins in the 5-pin DBV SOT-23 package. Pin 1 is active-low chip select, pin 3 is bidirectional serial input/output, pin 4 is the serial bus clock input, and pin 5 is the VDD supply pin with a specified 0.1-µF ceramic bypass capacitor to ground.
The sensor operates across -40°C to +150°C with a recommended supply range of 2.4 V to 5.5 V. The temperature-to-digital converter is specified as 14 bits, with a 13-bit plus sign output resolution of 0.03125°C. Accuracy is specified as ±1.0°C maximum over 0°C to +70°C and ±2.0°C maximum over -40°C to +150°C when VDD is 3.0 V to 3.6 V.
Timing and power parameters support embedded temperature monitoring designs. Conversion time is 130 ms typical at +25°C and 228 ms maximum across the full temperature range, with at least 228 ms required after power-on before the first valid read and more than 228 ms between accurate consecutive reads.
Key Features
- SPI and MICROWIRE compatible 3-wire serial interface
- -40°C to +150°C operating temperature sensing range
- 2.4 V to 5.5 V recommended supply range
- 0.03125°C temperature resolution from 13-bit plus sign output
- 14-bit temperature-to-digital converter representation
- ±1.0°C maximum accuracy from 0°C to +70°C
- ±2.0°C maximum accuracy across -40°C to +150°C
- 130 ms typical temperature conversion at +25°C
- 280 µA typical operating quiescent current
- 6 µA typical shutdown current
- 5-pin SOT-23 DBV package
Typical Applications
- SPI temperature monitoring
- MICROWIRE temperature sensing
- Compact SOT-23 sensor designs
- 2.4 V to 5.5 V systems
- Wide-temperature measurement nodes
- Low-current shutdown applications
- Digital thermal readout circuits
Procurement Notes
When requesting a quote for LM95071, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For analog and signal-chain sourcing, supply voltage, bandwidth, accuracy, noise level, package, temperature grade, input/output configuration and qualification requirements should be verified before approval.
FAQ
What interface does the LM95071 use for temperature data?
The LM95071 uses a 3-wire serial interface that is compatible with SPI and MICROWIRE. The DBV package pin functions include active-low CS, SC serial bus clock input, and bidirectional SI/O serial input/output.
What temperature range can the LM95071 measure?
The LM95071 operating temperature sensing range is -40°C to +150°C. Across this full range, the listed maximum accuracy is ±2.0°C when VDD is 3.0 V to 3.6 V and TA equals TJ over TMIN to TMAX.
What supply voltage range is specified for LM95071 operation?
The recommended operating supply voltage range is 2.4 V to 5.5 V. The absolute maximum supply voltage stress rating is -0.3 V to 6 V, which is not the same as the recommended operating range.
How soon can the first valid temperature read occur after power-on?
Following power-on reset, the first valid read requires at least 228 ms. The datasheet facts also specify a minimum interval greater than 228 ms between consecutive reads for an accurate temperature result.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.