LMG3522R030 650V GaN FET with Integrated Driver

Texas Instruments Power_Management — specifications, applications, sourcing support and RFQ.

LMG3522R030 650V GaN FET with Integrated Driver

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
LMG3522R030
Manufacturer
Texas Instruments
Package
RQS VQFN-52, 12.00 mm x 12.00 mm
Category
Power Management
Product Type
LDO Regulator

Quick Sourcing Note

LMG3522R030 from Texas Instruments is a Power_Management power IC described as a 650V GaN FET with integrated driver. It is supplied in an RQS VQFN-52 package measuring 12.00 mm x 12.00 mm. Key datasheet parameters include 650 V maximum drain-source voltage when off, 720 V maximum switching surge voltage, 800 V maximum transient ringing peak voltage for t1 below 200 ns, 38 A recommended drain RMS current, and 2 MHz switching frequency. The device supports adjustable 20 to 150 V/ns slew rate control, temperature duty-cycle output at 9 kHz, and operation across -40 to 150 °C junction temperature for power-stage designs.

Specifications

TypeDescription
Part NumberLMG3522R030
ManufacturerTexas Instruments
Product TypeLDO Regulator
CategoryPower Management
Package / CaseRQS VQFN-52, 12.00 mm x 12.00 mm
Component TypePower_IC
Drain-Source Voltage650 V max; FET off, absolute maximum rating
Drain-Source Switching Surge Voltage720 V max; FET switching, surge condition
Drain-Source Transient Ringing Peak Voltage800 V max; FET off, surge condition, t1 < 200 ns
VDD Pin Voltage-0.3 to 20 V; absolute maximum rating, referenced to SOURCE
LDO5V Pin Voltage-0.3 to 5.5 V; absolute maximum rating, referenced to SOURCE
VNEG Pin Voltage-16 to 0.5 V; absolute maximum rating, referenced to SOURCE
IN Pin Voltage-0.3 to 20 V; absolute maximum rating, referenced to SOURCE
FAULT/OC/ZVD/ZCD/TEMP Pin Voltage-0.3 to LDO5V + 0.3 V; absolute maximum rating, referenced to SOURCE
RDRV Pin Voltage-0.3 to 5.5 V; absolute maximum rating, referenced to SOURCE
Drain RMS Current55 A max; FET on, absolute maximum rating
Drain Pulsed Current-125 A max; FET on, tp < 10 us, internally limited
Source Pulsed Current80 A max; FET off, tp < 1 us
Operating Junction Temperature-40 to 150 °C; absolute maximum rating
Storage Temperature-55 to 150 °C; absolute maximum rating
HBM ESD Rating±2000 V; human-body model per ANSI/ESDA/JEDEC JS-001
CDM ESD Rating±500 V; charged-device model per ANSI/ESDA/JEDEC JS-002
Recommended VDD Supply Voltage7.5 V min, 12 V nom, 18 V max; maximum switching frequency derated for VDD < 9 V
Recommended IN Input Voltage0 V min, 5 V nom, 18 V max
Recommended Drain RMS Current38 A max
LDO5V Positive Source Current25 mA max
RDRV External Slew-Rate Control Resistance0 to 500 kΩ; RDRV to SOURCE resistance
VNEG External Bypass Capacitance1 to 10 µF; VNEG to SOURCE capacitance
BBSW External Buck-Boost Inductance3 µH min, 4.7 µH nom, 10 µH max; BBSW to SOURCE inductance; >1 A current rating recommended
Junction-to-Case Top Thermal Resistance0.28 °C/W; RQS VQFN 52-pin package
Drain-Source On Resistance at 25 °C26 mΩ typ, 35 mΩ max; VIN = 5 V, TJ = 25 °C
Drain-Source On Resistance at 125 °C45 mΩ max; VIN = 5 V, TJ = 125 °C
Third-Quadrant Source-Drain Voltage at 0.1 A3.6 V typ; IS = 0.1 A
Third-Quadrant Source-Drain Voltage at 20 A3 V typ, 5 V max; IS = 20 A
Drain Leakage Current at 25 °C1 µA typ; VDS = 650 V, TJ = 25 °C
Drain Leakage Current at 125 °C10 µA typ; VDS = 650 V, TJ = 125 °C
Switching Frequency2 MHz
Slew Rate Adjustment Range20 to 150 V/ns; adjustable slew rate for switching performance and EMI mitigation
Temperature PWM Output Frequency9 kHz; TEMP push-pull digital output; temperature encoded as duty cycle
Datasheet Statusrequest_only

Product Overview

LMG3522R030 is a Texas Instruments Power_Management power IC combining a 650V GaN FET with an integrated driver. The datasheet identifies the package as RQS VQFN-52 with a 12.00 mm x 12.00 mm body, and gives a junction-to-case top thermal resistance of 0.28 °C/W for this 52-pin package.

Electrical limits include 650 V maximum drain-source voltage with the FET off, 720 V maximum drain-source switching surge voltage, and 800 V maximum transient ringing peak voltage under the stated surge condition. Recommended operating values include a 7.5 V to 18 V VDD supply range with 12 V nominal, 0 V to 18 V IN input range with 5 V nominal, and 38 A maximum recommended drain RMS current.

The part supports 2 MHz switching and adjustable slew rate from 20 to 150 V/ns using the RDRV external resistance range of 0 to 500 kΩ. The TEMP output is a push-pull digital output with temperature encoded as duty cycle at 9 kHz, supporting monitored power-stage applications where switching behavior, EMI control, and thermal information are design inputs.

Key Features

  • 650 V maximum drain-source voltage rating
  • 720 V maximum switching surge voltage
  • 800 V transient ringing peak voltage limit
  • 55 A maximum absolute drain RMS current
  • 38 A maximum recommended drain RMS current
  • 2 MHz switching frequency specification
  • 20 to 150 V/ns adjustable slew rate
  • 26 mΩ typical on resistance at 25 °C
  • 0.28 °C/W junction-to-case top thermal resistance
  • 9 kHz temperature PWM output frequency

Typical Applications

  • High-frequency power conversion
  • 650 V GaN switching stages
  • EMI-tuned power stages
  • Thermally monitored power designs
  • Compact VQFN power assemblies
  • Driver-integrated GaN FET designs

Procurement Notes

When requesting a quote for LMG3522R030, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.

FAQ

What type of device is LMG3522R030?

LMG3522R030 is a Texas Instruments Power_Management power IC described in the extracted facts as a 650V GaN FET with integrated driver. It is supplied in an RQS VQFN-52 package measuring 12.00 mm x 12.00 mm.

What drain-source voltage limits are specified?

The extracted datasheet facts list 650 V maximum drain-source voltage with the FET off, 720 V maximum drain-source switching surge voltage, and 800 V maximum transient ringing peak voltage for the stated surge condition with t1 below 200 ns.

What operating supply voltage is recommended?

The recommended VDD supply range is 7.5 V minimum, 12 V nominal, and 18 V maximum. The extracted fact also notes that maximum switching frequency is derated when VDD is below 9 V.

How is slew rate adjusted on this part?

The extracted facts specify a 20 to 150 V/ns slew rate adjustment range. RDRV external slew-rate control resistance is listed as 0 to 500 kΩ from RDRV to SOURCE.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 13, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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