LMK1C1104 LVCMOS Clock Buffer

Texas Instruments Signal_Chain — specifications, applications, sourcing support and RFQ.

LMK1C1104 LVCMOS Clock Buffer

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
LMK1C1104
Manufacturer
Texas Instruments
Package
8-pin TSSOP, 3.00 mm x 4.40 mm; 8-pin WSON, 2.00 mm x 2.00 mm
Category
Signal Chain
Product Type
LVCMOS Clock Buffer

Quick Sourcing Note

LMK1C1104 from Texas Instruments is a Signal_Chain LVCMOS clock buffer with 1:4 fanout and four LVCMOS outputs. It is offered in 8-pin TSSOP, 3.00 mm x 4.40 mm, and 8-pin WSON, 2.00 mm x 2.00 mm, packages. The device supports 1.8 V, 2.5 V, and 3.3 V supplies, with input tolerance to 3.3 V at all supply voltages. It supports DC to 250 MHz operation at 3.3 V and DC to 200 MHz at 2.5 V or 1.8 V. Typical use cases include LVCMOS clock distribution, clock fanout, and output-enable controlled clock routing.

Specifications

TypeDescription
Part NumberLMK1C1104
ManufacturerTexas Instruments
Product TypeLVCMOS Clock Buffer
CategorySignal Chain
Package / Case8-pin TSSOP, 3.00 mm x 4.40 mm; 8-pin WSON, 2.00 mm x 2.00 mm
Number of Outputs4; condition: LMK1C1104 device variant
Clock Buffer Fanout1:4; condition: LMK1C1104
Logic FamilyLVCMOS input and LVCMOS outputs; condition: functional block diagram and pin descriptions
Supply Voltage1.8 V, 2.5 V, or 3.3 V; condition: supported operating environments
3.3 V Supply Voltage Range3.135 V min, 3.3 V nominal, 3.465 V max; condition: recommended operating conditions
2.5 V Supply Voltage Range2.375 V min, 2.5 V nominal, 2.625 V max; condition: recommended operating conditions
1.8 V Supply Voltage Range1.71 V min, 1.8 V nominal, 1.89 V max; condition: recommended operating conditions
Operating Free-Air Temperature-40°C to 125°C; condition: recommended operating conditions
Operating Junction Temperature-40°C to 150°C; condition: recommended operating conditions
Input FrequencyDC to 250 MHz; condition: VDD = 3.3 V
Input FrequencyDC to 200 MHz; condition: VDD = 2.5 V or 1.8 V
Output Frequency250 MHz max; condition: VDD = 3.3 V
Output Frequency200 MHz max; condition: VDD = 2.5 V or 1.8 V
Input High Voltage0.7 x VDD min; condition: clock input
Input Low Voltage0.3 x VDD max; condition: clock input
Input Slew Rate0.1 V/ns min; condition: 20% to 80% of input swing
Input Leakage Current-50 uA min, 50 uA max; condition: clock input
Input Capacitance7 pF typical; condition: TA = 25°C
Static Core Supply Current25 uA typical, 45 uA max; condition: all outputs disabled, fIN = 0 V
Core Supply Current8 mA typical, 15 mA max; condition: all outputs disabled, fIN = 100 MHz
Core Supply Current14 mA typical, 20 mA max; condition: all outputs active, fIN = 100 MHz, CL = 5 pF, VDD = 1.8 V
Core Supply Current21 mA typical, 30 mA max; condition: all outputs active, fIN = 100 MHz, CL = 5 pF, VDD = 2.5 V
Core Supply Current33 mA typical, 40 mA max; condition: all outputs active, fIN = 100 MHz, CL = 5 pF, VDD = 3.3 V
Output Duty Cycle45% min, 55% max; condition: 50% duty cycle input, all VDD levels
Start-Up Time Before Output Active3 ms max; condition: clock output, all VDD levels
Output Enable Time5 cycles max; condition: 1G_ON
Output Disable Time5 cycles max; condition: 1G_OFF
Output High Voltage2.8 V min; condition: VDD = 3.3 V ±5%, IOH = 1 mA
Output Low Voltage0.2 V max; condition: VDD = 3.3 V ±5%, IOL = 1 mA
Output Rise and Fall Time0.35 ns typical, 0.7 ns max; condition: VDD = 3.3 V ±5%, 20/80%, CL = 5 pF, fIN = 156.25 MHz
Output-to-Output Skew25 ps typical, 50 ps max; condition: VDD = 3.3 V ±5%
Part-to-Part Skew250 ps max; condition: VDD = 3.3 V ±5%
Propagation Delay1.5 ns typical, 2 ns max; condition: VDD = 3.3 V ±5%
Additive Jitter8 fs RMS typical, 20 fs RMS max; condition: VDD = 3.3 V ±5%, fIN = 156.25 MHz, input slew rate = 2 V/ns, integration range = 12 kHz to 20 MHz
Output Impedance50 ohm typical; condition: VDD = 3.3 V ±5%
Output High Voltage0.8 x VDD min; condition: VDD = 2.5 V ±5%, IOH = 1 mA
Output Low Voltage0.2 x VDD max; condition: VDD = 2.5 V ±5%, IOL = 1 mA
Output Rise and Fall Time0.33 ns typical, 0.8 ns max; condition: VDD = 2.5 V ±5%, 20/80%, CL = 5 pF, fIN = 156.25 MHz
Output-to-Output Skew50 ps max; condition: VDD = 2.5 V ±5%
Part-to-Part Skew400 ps max; condition: VDD = 2.5 V ±5%
Propagation Delay1.5 ns typical, 2.5 ns max; condition: VDD = 2.5 V ±5%
Additive Jitter11 fs RMS typical, 27 fs RMS max; condition: VDD = 2.5 V ±5%, fIN = 156.25 MHz, input slew rate = 2 V/ns, integration range = 12 kHz to 20 MHz
Output Impedance52.5 ohm typical; condition: VDD = 2.5 V ±5%
Output High Voltage0.8 x VDD min; condition: VDD = 1.8 V ±5%, IOH = 1 mA
Output Low Voltage0.2 x VDD max; condition: VDD = 1.8 V ±5%, IOL = 1 mA
Output Rise and Fall Time0.38 ns typical, 1 ns max; condition: VDD = 1.8 V ±5%, 20/80%, CL = 5 pF, fIN = 156.25 MHz
Absolute Maximum Supply Voltage3.6 V max; condition: VDD
Absolute Maximum Clock Input Voltage-0.5 V min, 3.6 V max; condition: CLKIN
Absolute Maximum Output Pin Voltage-0.5 V min, VDD + 0.3 V max; condition: Yn output pins
Input Current-20 mA min, 20 mA max; condition: absolute maximum rating
Continuous Output Current-50 mA min, 50 mA max; condition: absolute maximum rating
Storage Temperature-65°C to 150°C; condition: absolute maximum rating
HBM ESD Rating±9000 V; condition: ANSI/ESDA/JEDEC JS-001, all pins
CDM ESD Rating±1500 V; condition: JEDEC JESD22-C101, all pins
WSON Junction-to-Ambient Thermal Resistance163°C/W; condition: LMK1C1104 DQF WSON, 8 pins
TSSOP Junction-to-Ambient Thermal Resistance181.9°C/W; condition: LMK1C1104 PW TSSOP, 8 pins
WSON Junction-to-Case Top Thermal Resistance105.7°C/W; condition: LMK1C1104 DQF WSON, 8 pins
TSSOP Junction-to-Case Top Thermal Resistance76.6°C/W; condition: LMK1C1104 PW TSSOP, 8 pins
WSON Junction-to-Board Thermal Resistance84.2°C/W; condition: LMK1C1104 DQF WSON, 8 pins
TSSOP Junction-to-Board Thermal Resistance111.6°C/W; condition: LMK1C1104 PW TSSOP, 8 pins
Clock Input Pulldown Resistance300 kOhm typical; condition: CLKIN internal pulldown to GND
Output Enable Pulldown Resistance300 kOhm typical; condition: 1G internal pulldown to GND
Output Enable FunctionHIGH enables outputs; LOW disables outputs; condition: 1G global output enable
Disabled Output StateOutputs switch low; condition: 1G is low
Input Tolerance3.3 V tolerant input; condition: at all supply voltages
Fail-Safe InputPrevents output oscillation without input signal and allows input signals before VDD is supplied; condition: CLKIN fail-safe behavior
Datasheet Statusrequest_only

Product Overview

The LMK1C1104 is a Texas Instruments LVCMOS clock buffer in the Signal_Chain category. It provides one LVCMOS clock input and four LVCMOS outputs, forming a 1:4 clock buffer fanout. The clock input uses LVCMOS thresholds, with 0.7 x VDD minimum input-high voltage and 0.3 x VDD maximum input-low voltage.

The device supports 1.8 V, 2.5 V, and 3.3 V operating supplies. Recommended ranges are 1.71 V to 1.89 V, 2.375 V to 2.625 V, and 3.135 V to 3.465 V. At 3.3 V, input and output frequency operation extends to 250 MHz; at 2.5 V or 1.8 V, operation extends to 200 MHz.

Package options include an 8-pin TSSOP measuring 3.00 mm x 4.40 mm and an 8-pin WSON measuring 2.00 mm x 2.00 mm. Thermal resistance values are specified for both packages. The global 1G output-enable pin enables outputs when high and disables outputs when low, with disabled outputs switching low.

Key Features

  • 1:4 LVCMOS clock buffer fanout with four outputs
  • Supports 1.8 V, 2.5 V, and 3.3 V supplies
  • DC to 250 MHz input frequency at 3.3 V
  • DC to 200 MHz input frequency at 2.5 V or 1.8 V
  • 45% to 55% output duty cycle with 50% input
  • 3 ms maximum start-up time before output active
  • 5-cycle maximum output enable and disable timing
  • 3.3 V tolerant input at all supply voltages
  • Fail-safe input prevents output oscillation without input signal
  • Disabled outputs switch low when 1G is low

Typical Applications

  • LVCMOS clock distribution
  • 1:4 clock fanout
  • Multi-output timing trees
  • Enable-controlled clock routing
  • 3.3 V tolerant clock inputs
  • Compact TSSOP clock layouts
  • Compact WSON clock layouts

Procurement Notes

When requesting a quote for LMK1C1104, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For analog and signal-chain sourcing, supply voltage, bandwidth, accuracy, noise level, package, temperature grade, input/output configuration and qualification requirements should be verified before approval.

FAQ

What type of device is the LMK1C1104?

The LMK1C1104 is a Texas Instruments LVCMOS clock buffer in the Signal_Chain category. It has one LVCMOS clock input and four LVCMOS outputs, providing a 1:4 fanout structure.

Which supply voltages does LMK1C1104 support?

The device supports 1.8 V, 2.5 V, and 3.3 V operation. Recommended operating ranges are 1.71 V to 1.89 V, 2.375 V to 2.625 V, and 3.135 V to 3.465 V.

What frequency range is specified for the LMK1C1104?

At VDD = 3.3 V, the input frequency range is DC to 250 MHz and output frequency is 250 MHz maximum. At 2.5 V or 1.8 V, both input and output operation are specified to 200 MHz.

What happens when the 1G output enable is low?

The 1G pin is the global output enable. A high level enables the outputs, while a low level disables them. When 1G is low, the disabled output state is specified as outputs switching low.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 12, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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