LMK3H0102 Reference-less PCIe Clock Generator

Texas Instruments Signal_Chain — specifications, applications, sourcing support and RFQ.

LMK3H0102 Reference-less PCIe Clock Generator

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Part Number
LMK3H0102
Manufacturer
Texas Instruments
Package
RER TQFN-16, 3.0 mm x 3.0 mm
Category
Signal Chain
Product Type
Operational Amplifier

Quick Sourcing Note

LMK3H0102 from Texas Instruments is a Signal_Chain reference-less PCIe clock generator in an RER TQFN-16, 3.0 mm x 3.0 mm package. It uses an integrated BAW resonator, so no external crystal or external clock reference is required. The device supports 2 differential outputs or up to 5 single-ended LVCMOS outputs, with LP-HCSL output frequency capability from 2.5 MHz to 400 MHz and LVCMOS outputs up to 200 MHz. It is specified for PCIe Gen 1 to Gen 7 common clock, SRNS, and SRIS use cases, with SSC options, less than 1.5 ms startup time, and less than 50 ps output-to-output skew.

Specifications

TypeDescription
Part NumberLMK3H0102
ManufacturerTexas Instruments
Product TypeOperational Amplifier
CategorySignal Chain
Package / CaseRER TQFN-16, 3.0 mm x 3.0 mm
Output Configuration2 differential outputs or up to 5 single-ended LVCMOS outputs; Device output capability
Reference RequirementNo external crystal or external clock reference required; Integrated BAW resonator
PCIe CompliancePCIe Gen 1 to Gen 7 compliant; Common Clock with or without SSC, SRNS, and SRIS
Output Frequency Range2.5 MHz to 400 MHz; LP-HCSL clock output characteristics
LVCMOS Output FrequencyUp to 200 MHz; 1.8 V, 2.5 V, or 3.3 V LVCMOS outputs
Total Frequency Stability-25 ppm to +25 ppm; Includes temperature variation, 10-year aging at 25°C, solder shift, hysteresis, and initial frequency accuracy
Supply Voltage1.71 V min, 1.8 V nominal, 1.89 V max; VDD recommended operating condition, 1.8 V rail
Supply Voltage2.375 V min, 2.5 V nominal, 2.625 V max; VDD recommended operating condition, 2.5 V rail
Supply Voltage3.135 V min, 3.3 V nominal, 3.465 V max; VDD recommended operating condition, 3.3 V rail
Output Supply Voltage1.71 V min, 1.8 V nominal, 1.89 V max; VDDO recommended operating condition, 1.8 V rail
Output Supply Voltage2.375 V min, 2.5 V nominal, 2.625 V max; VDDO recommended operating condition, 2.5 V rail
Output Supply Voltage3.135 V min, 3.3 V nominal, 3.465 V max; VDDO recommended operating condition, 3.3 V rail
Ambient Temperature-40°C to +85°C; Recommended operating condition
Junction Temperature-40°C to +105°C; Recommended operating condition
Power Supply Ramp Time0.05 ms to 5 ms; VDD = 1.8 V
Power Supply Ramp Time0.05 ms to 5 ms; VDD = 2.5 V or 3.3 V
Device Supply Absolute Maximum-0.3 V to 3.9 V; VDD absolute maximum rating
Output Supply Absolute Maximum-0.3 V to 3.9 V; VDDO absolute maximum rating
Logic Input Voltage Absolute Maximum-0.3 V to 3.9 V; VIN, VDD = VDDO = -0.3 V to -3.9 V
Maximum Junction Temperature105°C; Absolute maximum rating
ESD Rating HBM±2000 V; ANSI/ESDA/JEDEC JS-001, all pins
ESD Rating CDM±500 V; JEDEC JS-002, all pins
LP-HCSL Output Low Voltage-60 mV min, 25 mV max; Undershoot included
LP-HCSL Overshoot Voltage150 mV max; Vmax - VOH
LP-HCSL Static Differential Impedance80.75 Ω min, 85 Ω typ, 91.25 Ω max; 85 Ω setting
LP-HCSL Static Differential Impedance95 Ω min, 100 Ω typ, 105 Ω max; 100 Ω setting
Output Slew Rate2.1 V/ns min, 3.1 V/ns max; Measured -150 mV to +150 mV, OUTx_SLEW_RATE = 0
Output Slew Rate2.0 V/ns min, 3.2 V/ns max; Measured -150 mV to +150 mV, OUTx_SLEW_RATE = 1
Output Slew Rate1.7 V/ns min, 2.8 V/ns max; Measured -150 mV to +150 mV, OUTx_SLEW_RATE = 2
Output Slew Rate1.4 V/ns min, 2.7 V/ns max; Measured -150 mV to +150 mV, OUTx_SLEW_RATE = 3
Output Duty Cycle47% min, 53% max; LP-HCSL output duty cycle, visible table excerpt
Startup Time<1.5 ms; Device startup
Output-to-Output Skew<50 ps; Between clock outputs
PCIe Gen 3 Common Clock Jitter135.3 fs max; With SSC, PCIe limit 1 ps
PCIe Gen 4 Common Clock Jitter135.3 fs max; With SSC, PCIe limit 500 fs
PCIe Gen 5 Common Clock Jitter57.5 fs max; With SSC, PCIe limit 150 fs
PCIe Gen 6 Common Clock Jitter34.5 fs max; With SSC, PCIe limit 100 fs
PCIe Gen 7 Common Clock Jitter29.6 fs max; With SSC, PCIe limit 67 fs
Preprogrammed SSC Modulation Depth-0.1%, -0.25%, -0.3%, -0.5% down spread; At 200 MHz FOD frequency
Register Programmable SSC Modulation Depth-0.1% to -3% down spread or ±0.05% to ±1.5% center spread; Register programmable SSC
Power Supply Noise Rejection-93.1 dBc; 500 kHz switching noise, LP-HCSL outputs
Datasheet Statusrequest_only

Product Overview

The LMK3H0102 is a Texas Instruments reference-less PCIe clock generator for Signal_Chain designs. Its integrated BAW resonator removes the need for an external crystal or external clock reference, reducing the required timing components around the clock source. The output structure supports either 2 differential outputs or up to 5 single-ended LVCMOS outputs.

For PCIe timing, the device is specified as PCIe Gen 1 to Gen 7 compliant for Common Clock operation with or without SSC, as well as SRNS and SRIS conditions. LP-HCSL outputs cover 2.5 MHz to 400 MHz, while 1.8 V, 2.5 V, or 3.3 V LVCMOS outputs support operation up to 200 MHz. Total frequency stability is specified from -25 ppm to +25 ppm.

The device is supplied in an RER TQFN-16 package measuring 3.0 mm x 3.0 mm. Recommended operating conditions include 1.8 V, 2.5 V, and 3.3 V VDD and VDDO rails, -40°C to +85°C ambient operation, and -40°C to +105°C junction operation.

Key Features

  • Reference-less PCIe clock generator with integrated BAW resonator
  • No external crystal or clock reference required
  • PCIe Gen 1 to Gen 7 compliant timing
  • 2 differential outputs or up to 5 LVCMOS outputs
  • LP-HCSL output frequency range from 2.5 MHz to 400 MHz
  • LVCMOS output frequency up to 200 MHz
  • Total frequency stability from -25 ppm to +25 ppm
  • Startup time below 1.5 ms
  • Output-to-output skew below 50 ps
  • Register programmable SSC depth options

Typical Applications

  • PCIe common clock timing
  • PCIe SRNS clocking
  • PCIe SRIS clocking
  • LP-HCSL clock distribution
  • LVCMOS clock generation
  • Reference-less board timing
  • Multi-output signal-chain timing

Procurement Notes

When requesting a quote for LMK3H0102, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For analog and signal-chain sourcing, supply voltage, bandwidth, accuracy, noise level, package, temperature grade, input/output configuration and qualification requirements should be verified before approval.

FAQ

Does LMK3H0102 require an external crystal reference?

No. The extracted datasheet facts state that LMK3H0102 uses an integrated BAW resonator and requires no external crystal or external clock reference.

What output formats does LMK3H0102 support?

The device supports 2 differential outputs or up to 5 single-ended LVCMOS outputs. LP-HCSL clock outputs are specified from 2.5 MHz to 400 MHz, and LVCMOS outputs support operation up to 200 MHz.

Which PCIe generations are covered by LMK3H0102?

LMK3H0102 is specified as PCIe Gen 1 to Gen 7 compliant under Common Clock operation with or without SSC, and also under SRNS and SRIS conditions.

What supply rails are specified for LMK3H0102?

Recommended VDD and VDDO operating rails include 1.8 V, 2.5 V, and 3.3 V options, with listed min and max ranges for each rail in the extracted datasheet facts.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 21, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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