LP5562 Four-Channel LED Driver

Texas Instruments LED — specifications, applications, sourcing support and RFQ.

LP5562 Four-Channel LED Driver

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
LP5562
Manufacturer
Texas Instruments
Package
YQE DSBGA, 12 pins, 0.4-mm pitch, body size max 1.648 mm x 1.248 mm
Category
LED
Product Type
SMD LED

Quick Sourcing Note

LP5562 from Texas Instruments is an LED-category four-channel LED driver in a YQE DSBGA package with 12 pins, 0.4-mm pitch, and maximum 1.648 mm x 1.248 mm body size. It provides four independently programmable R, G, B, and W current-sink outputs with 0 to 25.5 mA per output, 100 uA current steps, and 8-bit PWM control. The device supports autonomous lighting sequences through three program execution engines and offers four pin-selectable I2C addresses. It is suited to RGBW LED driver designs, I2C-controlled lighting, and low-current autonomous LED sequence applications using a 2.7 V to 5.5 V VDD supply.

Specifications

TypeDescription
Part NumberLP5562
ManufacturerTexas Instruments
Product TypeSMD LED
CategoryLED
Package / CaseYQE DSBGA, 12 pins, 0.4-mm pitch, body size max 1.648 mm x 1.248 mm
LED outputs4 independently programmable channels; R, G, B, W LED driver current sink outputs
Output current setting range0 to 25.5 mA per LED output
Output current step size100 uA; 8-bit current setting
PWM control resolution8-bit per LED output
Program execution engines3; flexible instruction set for autonomous lighting sequences
I2C address options4 pin-selectable addresses using ADDR_SEL0 and ADDR_SEL1 pins
Supply voltage2.7 min, 5.5 max V; recommended operating condition, VDD
Enable and logic supply voltage1.65 min, VDD max V; recommended operating condition, EN/VCC
Operating junction temperature-40 min, 125 max degC; recommended operating condition, TJ
Operating ambient temperature-40 min, 85 max degC; recommended operating condition, TA
Absolute maximum voltage-0.3 min, 6 max V; VDD, EN/VCC, R, G, B, W pins
Absolute maximum pin voltage-0.3 min, VDD + 0.3 max V with 6 V maximum; voltage on pins
Maximum junction temperature125 degC; absolute maximum rating, TJ-MAX
Storage temperature-65 min, 150 max degC; Tstg
Thermal shutdown threshold150 typ degC; engages at junction temperature
Thermal shutdown release threshold130 typ degC; disengages at junction temperature
HBM ESD rating+/-1000 V; human-body model per ANSI/ESDA/JEDEC JS-001
CDM ESD rating+/-250 V; charged-device model per JEDEC JESD22-C101
Junction-to-ambient thermal resistance85.9 degC/W; YQE DSBGA 12-pin package, RthetaJA
Junction-to-case top thermal resistance1.0 degC/W; YQE DSBGA 12-pin package, RthetaJC(top)
Junction-to-board thermal resistance15.3 degC/W; YQE DSBGA 12-pin package, RthetaJB
Junction-to-top characterization parameter0.6 degC/W; YQE DSBGA 12-pin package, psiJT
Junction-to-board characterization parameter15.4 degC/W; YQE DSBGA 12-pin package, psiJB
Shutdown supply current0.2 typ, 2 max uA; EN=0 pin, CHIP_EN=0 bit, external 32-kHz clock running or not running
Standby supply current2 typ uA; EN=1 pin, CHIP_EN=0 bit, external 32-kHz clock not running
Standby supply current with external clock2.4 typ uA; EN=1 pin, CHIP_EN=0 bit, external 32-kHz clock running
Normal mode supply current0.25 typ mA; LED drivers disabled
Normal mode supply current1 typ mA; LED drivers enabled
Power-save mode supply current10 typ uA; external 32-kHz clock running
Power-save mode supply current0.25 typ mA; internal oscillator running
Internal oscillator frequency accuracy-4 typ, +4 typ %; TA=25 degC
Internal oscillator frequency accuracy-7 max, +7 max %; operating ambient temperature range
LED pin leakage current0.1 typ, 1 max uA; R, G, B, W outputs, TA=25 degC
Maximum output current25.5 mA; outputs R, G, B, W
Output current accuracy-4 min, +4 max %; output current set to 17.5 mA, VDD=3.6 V, TA=25 degC
Output current accuracy-5 min, +5 max %; output current set to 17.5 mA, VDD=3.6 V
Output current matching1 typ, 2 max %; output current set to 17.5 mA, VDD=3.6 V
LED PWM switching frequency558 Hz; PWM_HF=1
LED PWM switching frequency256 Hz; PWM_HF=0
LED output saturation voltage60 typ, 100 max mV; output current set to 17.5 mA, TA=25 degC
EN input low level0.5 max V; logic input EN, VEN=1.65 V
EN input high level1.2 min V; logic input EN, VEN=1.65 V
EN logic input current-1 min, 1 max uA; logic input EN, VEN=1.65 V
EN input delay2 typ us; logic input EN
I2C host startup delayAt least 1 ms before sending data after rising edge of enable line
SCL/SDA/CLK/ADDR input low level0.2 x VEN max V; SCL, SDA, CLK_32K, ADDR_SEL0, ADDR_SEL1; VEN=1.8 V
SCL/SDA/CLK/ADDR input high level0.8 x VEN min V; SCL, SDA, CLK_32K, ADDR_SEL0, ADDR_SEL1; VEN=1.8 V
SCL/SDA/CLK/ADDR input current-1 min, 1 max uA; SCL, SDA, CLK_32K, ADDR_SEL0, ADDR_SEL1; VEN=1.8 V
CLK_32K input frequency32 kHz; logic input CLK_32K, VEN=1.8 V
SCL clock frequency400 kHz; logic input SCL, VEN=1.8 V
SDA output low level0.3 typ, 0.5 max V; IOUT=3 mA pullup current
SDA output leakage current1 max uA; logic output SDA
Recommended external clock frequency32.7 max kHz; logic input CLK_32K
External clock high time6 min us; logic input CLK_32K
External clock low time6 min us; logic input CLK_32K
External clock rise time2 max us; 10% to 90%, CLK_32K
External clock fall time2 max us; 90% to 10%, CLK_32K
I2C clock frequency400 max kHz; SDA, SCL timing requirements
I2C repeated START hold time0.6 min us; SDA, SCL timing requirement
I2C clock low time1.3 min us; SDA, SCL timing requirement
I2C clock high time600 min ns; SDA, SCL timing requirement
I2C repeated START setup time600 min ns; SDA, SCL timing requirement
I2C data hold time50 min ns; SDA, SCL timing requirement
I2C data setup time100 min ns; SDA, SCL timing requirement
I2C SDA/SCL rise time20 + 0.1Cb min, 300 max ns; SDA, SCL timing requirement
I2C SDA/SCL fall time15 + 0.1Cb min, 300 max ns; SDA, SCL timing requirement
I2C STOP setup time600 min ns; SDA, SCL timing requirement
I2C bus-free time1.3 min us; between STOP and START condition
I2C bus capacitive load10 min, 200 max pF; capacitive load for each bus line, Cb
Datasheet Statusrequest_only

Product Overview

The LP5562 is a Texas Instruments four-channel LED driver for R, G, B, and W LED current-sink outputs. Each of the four channels is independently programmable, with a per-output current setting range from 0 to 25.5 mA in 100 uA steps and 8-bit PWM control resolution. Three program execution engines support autonomous lighting sequences using a flexible instruction set.

The device operates from a recommended VDD supply range of 2.7 V to 5.5 V, while EN/VCC supports 1.65 V to VDD logic supply operation. I2C operation supports a 400 kHz clock frequency, and four pin-selectable addresses are available through ADDR_SEL0 and ADDR_SEL1. A 32 kHz external clock input is supported, with timing requirements defined for high time, low time, rise time, and fall time.

LP5562 is supplied in a 12-pin YQE DSBGA package with 0.4-mm pitch and maximum body size of 1.648 mm x 1.248 mm. Recommended operating limits include -40 degC to 125 degC junction temperature and -40 degC to 85 degC ambient temperature. Thermal shutdown engages at 150 degC typical and releases at 130 degC typical.

Key Features

  • Four independently programmable RGBW current-sink LED outputs
  • 0 to 25.5 mA current setting per output
  • 100 uA output current step size from 8-bit setting
  • 8-bit PWM control resolution on each LED output
  • Three program execution engines for autonomous lighting sequences
  • Four pin-selectable I2C addresses via ADDR_SEL0 and ADDR_SEL1
  • 2.7 V to 5.5 V recommended VDD supply range
  • 400 kHz maximum I2C clock frequency
  • Thermal shutdown engages at 150 degC typical
  • 12-pin YQE DSBGA package with 0.4-mm pitch

Typical Applications

  • RGBW LED driver designs
  • Autonomous lighting sequences
  • I2C-controlled LED indicators
  • Four-channel LED current sinks
  • Low-current LED standby systems
  • External 32 kHz clocked lighting

Procurement Notes

When requesting a quote for LP5562, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What type of device is the LP5562?

The LP5562 is a Texas Instruments four-channel LED driver. It provides four independently programmable R, G, B, and W current-sink outputs for LED control.

What output current range does each LP5562 LED channel support?

Each LED output supports a current setting range from 0 to 25.5 mA. The current setting uses 8-bit control with a 100 uA step size per LED output.

What supply voltage range is recommended for LP5562 VDD?

The recommended operating condition for VDD is 2.7 V minimum to 5.5 V maximum. The EN/VCC logic supply range is 1.65 V minimum to VDD maximum.

What package is used for the LP5562?

The LP5562 uses a YQE DSBGA package with 12 pins and 0.4-mm pitch. The listed maximum body size is 1.648 mm x 1.248 mm.

What I2C timing limit is specified for the LP5562?

The extracted timing requirements specify a maximum I2C clock frequency of 400 kHz. The device also specifies repeated START, clock high and low, data setup, data hold, STOP setup, and bus-free timing limits.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 25, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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