RFD16N06LESM N-Channel Logic Level Power MOSFET

Specifications

Product Overview

RFD16N06LESM is an ON Semiconductor N-Channel Logic Level Power MOSFET in the Power_Management category. It is specified in a JEDEC TO-252AA package, with ordering information listing RFD16N06LESM9A, package TO-252AA, and brand marking 16N06LE.

The device has a 60 V drain-to-source absolute maximum rating and a 16 A continuous drain current rating at Tc=25°C. Its gate-to-source voltage rating is +10 V and -8 V, while the drain-to-source breakdown voltage is specified as a minimum of 60 V at ID=250 µA and VGS=0 V.

Electrical data includes a gate threshold voltage range of 1 V to 3 V, maximum 0.047 Ohm on resistance at ID=16 A and VGS=5 V, and typical capacitances of 1350 pF input, 300 pF output, and 90 pF reverse transfer at VDS=25 V. Thermal and assembly limits include -55°C to 175°C operating and storage temperature, 300°C lead soldering temperature for 10 s, and 260°C package body soldering temperature for 10 s.

Key Features

• 60 V drain-to-source absolute maximum rating
• 16 A continuous drain current at Tc=25°C
• Maximum 0.047 Ohm on resistance at VGS=5 V
• Logic-level gate threshold from 1 V to 3 V
• 90 W power dissipation at Tc=25°C
• -55°C to 175°C operating and storage range
• Typical 51 nC total gate charge to 10 V
• Maximum 100 ns turn-on time under stated test conditions
• Maximum 115 ns turn-off time under stated test conditions
• TO-252AA package with 80 °C/W junction-to-ambient resistance

Typical Applications

• Logic-level power switching
• 60 V MOSFET power stages
• 16 A drain-current circuits
• TO-252AA surface-mount designs
• Gate-driven load switching
• Power_Management MOSFET replacement sourcing

Procurement Notes

When requesting a quote for RFD16N06LESM, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.