SI7456CD N-Channel Power MOSFET

Vishay Power_Management — specifications, applications, sourcing support and RFQ.

SI7456CD N-Channel Power MOSFET

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Part Number
SI7456CD
Manufacturer
Vishay
Package
PowerPAK SO-8, 6.15 mm x 5.15 mm nominal; package dimensions D=5.15 mm nom, E=6.15 mm nom, A=1.04 mm nom
Category
Power Management
Product Type
LDO Regulator

Quick Sourcing Note

SI7456CD from Vishay is an N-channel power MOSFET in the PowerPAK SO-8 package, with nominal body dimensions of 6.15 mm x 5.15 mm and 1.04 mm nominal height. It is categorized under Power_Management and is specified for 100 V drain-source voltage, ±20 V gate-source voltage, and 27.5 A continuous drain current at TC=25°C. Key electrical data includes 0.0235 Ω maximum on-resistance at VGS=10 V and ID=10 A, 15 nC typical total gate charge at 10 V drive, and 35.7 W maximum power dissipation at TC=25°C. The datasheet also defines avalanche, body-diode, thermal, switching, and soldering limits for power-switching designs.

Specifications

TypeDescription
Part NumberSI7456CD
ManufacturerVishay
Product TypeLDO Regulator
CategoryPower Management
Package / CasePowerPAK SO-8, 6.15 mm x 5.15 mm nominal; package dimensions D=5.15 mm nom, E=6.15 mm nom, A=1.04 mm nom
Drain-Source Voltage100 V; Absolute maximum rating, TA=25°C unless otherwise noted
Gate-Source Voltage±20 V; Absolute maximum rating, TA=25°C unless otherwise noted
Continuous Drain Current27.5 A; TC=25°C, TJ=150°C
Continuous Drain Current22 A; TC=70°C, TJ=150°C
Continuous Drain Current10.3 A; TA=25°C, surface mounted on 1 in x 1 in FR4 board, t=10 s
Continuous Drain Current8.2 A; TA=70°C, surface mounted on 1 in x 1 in FR4 board, t=10 s
Pulsed Drain Current50 A; Absolute maximum rating
Continuous Source-Drain Diode Current25 A; TC=25°C
Continuous Source-Drain Diode Current4.5 A; TA=25°C, surface mounted on 1 in x 1 in FR4 board, t=10 s
Single Pulse Avalanche Current15 A; L=0.1 mH
Single Pulse Avalanche Energy11.2 mJ; L=0.1 mH
Maximum Power Dissipation35.7 W; TC=25°C
Maximum Power Dissipation22.8 W; TC=70°C
Maximum Power Dissipation5 W; TA=25°C, surface mounted on 1 in x 1 in FR4 board, t=10 s
Maximum Power Dissipation3.2 W; TA=70°C, surface mounted on 1 in x 1 in FR4 board, t=10 s
Operating Junction and Storage Temperature Range-55 to 150 °C; Absolute maximum rating
Soldering Peak Temperature260 °C; Soldering recommendations; leadless package, manual soldering not recommended for rework
Junction-to-Ambient Thermal Resistance20 °C/W typ, 25 °C/W max; t ≤ 10 s, surface mounted on 1 in x 1 in FR4 board
Junction-to-Ambient Thermal Resistance70 °C/W max; Steady-state maximum condition noted in datasheet
Junction-to-Case Thermal Resistance2.9 °C/W typ, 3.5 °C/W max; Drain, steady state
Drain-Source Breakdown Voltage100 V min; VGS=0 V, ID=250 µA, TJ=25°C
Drain-Source Voltage Temperature Coefficient47 mV/°C typ; ID=250 µA
Gate-Source Threshold Voltage Temperature Coefficient-5.4 mV/°C typ; ID=250 µA
Gate-Source Threshold Voltage1.2 V min, 2.8 V max; VDS=VGS, ID=250 µA
Gate-Source Leakage±100 nA max; VDS=0 V, VGS=±20 V
Zero Gate Voltage Drain Current1 µA max; VDS=100 V, VGS=0 V
Zero Gate Voltage Drain Current10 µA max; VDS=100 V, VGS=0 V, TJ=55°C
On-State Drain Current30 A min; VDS≥5 V, VGS=10 V; pulse test
Drain-Source On-State Resistance0.0195 Ω typ, 0.0235 Ω max; VGS=10 V, ID=10 A; pulse test
Drain-Source On-State Resistance0.0204 Ω typ, 0.0245 Ω max; VGS=7.5 V, ID=9 A; pulse test
Drain-Source On-State Resistance0.026 Ω typ, 0.0315 Ω max; VGS=4.5 V, ID=8 A; pulse test
Forward Transconductance25 S typ; VDS=10 V, ID=10 A; pulse test
Input Capacitance730 pF typ; VDS=50 V, VGS=0 V, f=1 MHz
Output Capacitance425 pF typ; VDS=50 V, VGS=0 V, f=1 MHz
Reverse Transfer Capacitance30 pF typ; VDS=50 V, VGS=0 V, f=1 MHz
Total Gate Charge15 nC typ, 23 nC max; VDS=50 V, VGS=10 V, ID=10 A
Total Gate Charge11.6 nC typ, 18 nC max; VDS=50 V, VGS=7.5 V, ID=10 A
Total Gate Charge7.7 nC typ, 12 nC max; VDS=50 V, VGS=4.5 V, ID=10 A
Gate-Source Charge2 nC typ; VDS=50 V, VGS=4.5 V, ID=10 A
Gate-Drain Charge3.7 nC typ; VDS=50 V, VGS=4.5 V, ID=10 A
Gate Resistance1 Ω min, 5 Ω typ, 10 Ω max; f=1 MHz
Turn-On Delay Time9 ns typ, 18 ns max; VDD=50 V, RL=5 Ω, ID≈10 A, VGEN=10 V, Rg=1 Ω
Rise Time13 ns typ, 26 ns max; VDD=50 V, RL=5 Ω, ID≈10 A, VGEN=10 V, Rg=1 Ω
Turn-Off Delay Time22 ns typ, 44 ns max; VDD=50 V, RL=5 Ω, ID≈10 A, VGEN=10 V, Rg=1 Ω
Fall Time10 ns typ, 20 ns max; VDD=50 V, RL=5 Ω, ID≈10 A, VGEN=10 V, Rg=1 Ω
Turn-On Delay Time11 ns typ, 22 ns max; VDD=50 V, RL=5 Ω, ID≈10 A, VGEN=7.5 V, Rg=1 Ω
Rise Time14 ns typ, 28 ns max; VDD=50 V, RL=5 Ω, ID≈10 A, VGEN=7.5 V, Rg=1 Ω
Turn-Off Delay Time20 ns typ, 40 ns max; VDD=50 V, RL=5 Ω, ID≈10 A, VGEN=7.5 V, Rg=1 Ω
Fall Time9 ns typ, 18 ns max; VDD=50 V, RL=5 Ω, ID≈10 A, VGEN=7.5 V, Rg=1 Ω
Continuous Source-Drain Diode Current25 A; TC=25°C
Pulse Diode Forward Current50 A; Pulse test
Body Diode Voltage0.79 V typ, 1.1 V max; IS=4 A
Body Diode Reverse Recovery Time34 ns typ, 68 ns max; IF=5 A, dI/dt=100 A/µs, TJ=25°C
Body Diode Reverse Recovery Charge32 nC typ, 64 nC max; IF=5 A, dI/dt=100 A/µs, TJ=25°C
Reverse Recovery Fall Time16 ns typ; IF=5 A, dI/dt=100 A/µs, TJ=25°C
Reverse Recovery Rise Time18 ns typ; IF=5 A, dI/dt=100 A/µs, TJ=25°C
Package Dimension A0.97 mm min, 1.04 mm nom, 1.12 mm max; PowerPAK SO-8 package mechanical dimension
Package Dimension b0.33 mm min, 0.41 mm nom, 0.51 mm max; PowerPAK SO-8 package mechanical dimension
Package Dimension D5.05 mm min, 5.15 mm nom, 5.26 mm max; PowerPAK SO-8 package mechanical dimension
Package Dimension E6.05 mm min, 6.15 mm nom, 6.25 mm max; PowerPAK SO-8 package mechanical dimension
Terminal Pitch1.27 mm BSC; PowerPAK SO-8 package mechanical dimension e
Ordering InformationSi7456CDP-T1-GE3; Lead (Pb)-free and halogen-free ordering part number
Datasheet Statusrequest_only

Product Overview

The SI7456CD is a Vishay N-channel power MOSFET for Power_Management use. Datasheet ratings identify a 100 V drain-source voltage limit, ±20 V gate-source voltage limit, and continuous drain current ratings up to 27.5 A at TC=25°C with TJ=150°C. Board-mounted current ratings are also specified, including 10.3 A at TA=25°C for a 1 in x 1 in FR4 board with a 10 s condition.

Its conduction characteristics include 100 V minimum drain-source breakdown voltage, 1.2 V to 2.8 V gate-source threshold voltage, and drain-source on-state resistance down to 0.0195 Ω typical at VGS=10 V and ID=10 A. Gate charge is specified at 15 nC typical and 23 nC maximum for VGS=10 V, with additional 7.5 V and 4.5 V drive data.

The PowerPAK SO-8 package is defined with nominal D=5.15 mm, E=6.15 mm, and A=1.04 mm dimensions, plus 1.27 mm BSC terminal pitch. Thermal data includes 2.9°C/W typical junction-to-case resistance and 20°C/W typical junction-to-ambient resistance for the 10 s FR4 condition. The soldering peak temperature is 260°C, and the datasheet notes that manual soldering is not recommended for rework on the leadless package.

Key Features

  • 100 V drain-source voltage absolute maximum rating
  • ±20 V gate-source voltage absolute maximum rating
  • 27.5 A continuous drain current at TC=25°C
  • 50 A pulsed drain current absolute maximum rating
  • 0.0235 Ω maximum on-resistance at 10 V gate drive
  • 15 nC typical total gate charge at 10 V
  • 730 pF typical input capacitance at 1 MHz
  • 34 ns typical body-diode reverse recovery time
  • PowerPAK SO-8 package with 1.27 mm terminal pitch
  • 260°C soldering peak temperature for leadless package

Typical Applications

  • Power management switching stages
  • 100 V MOSFET power rails
  • Board-mounted power switches
  • Pulsed load switching
  • Body-diode conduction paths
  • Avalanche-rated switching circuits
  • Compact PowerPAK SO-8 layouts

Procurement Notes

When requesting a quote for SI7456CD, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.

FAQ

What type of device is the SI7456CD?

The SI7456CD is a Vishay N-channel power MOSFET in the Power_Management category. The extracted datasheet facts identify it in a PowerPAK SO-8 package with nominal D=5.15 mm, E=6.15 mm, and A=1.04 mm package dimensions.

What voltage and current ratings are specified for SI7456CD?

The device has a 100 V drain-source voltage absolute maximum rating and a ±20 V gate-source voltage rating. Continuous drain current is specified as 27.5 A at TC=25°C and 22 A at TC=70°C, both with TJ=150°C.

What on-resistance values are listed for different gate drives?

The datasheet facts list 0.0195 Ω typical and 0.0235 Ω maximum at VGS=10 V and ID=10 A, 0.0204 Ω typical and 0.0245 Ω maximum at VGS=7.5 V and ID=9 A, and 0.026 Ω typical and 0.0315 Ω maximum at VGS=4.5 V and ID=8 A.

What thermal resistance data is available for this MOSFET?

Junction-to-case thermal resistance is specified as 2.9°C/W typical and 3.5°C/W maximum for the drain in steady state. Junction-to-ambient thermal resistance is 20°C/W typical and 25°C/W maximum for t≤10 s on a 1 in x 1 in FR4 board, with 70°C/W maximum also noted for steady state.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 13, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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