SUM90N10-8M2P N-channel Power MOSFET

Vishay Power_Management — specifications, applications, sourcing support and RFQ.

SUM90N10-8M2P N-channel Power MOSFET

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Part Number
SUM90N10-8M2P
Manufacturer
Vishay
Package
TO-263 / D2PAK 3-lead; Version 1 dimensions approx. 8.636-9.652 mm D x 9.652-10.414 mm E x 4.064-4.826 mm A; Version 2 dimensions approx. 8.60-9.00 mm D x 10.15-10.55 mm E x 4.36-4.56 mm A
Category
Power Management
Product Type
LDO Regulator

Quick Sourcing Note

SUM90N10-8M2P from Vishay is an N-channel power MOSFET in the Power_Management category. It is supplied in a TO-263 / D2PAK 3-lead package with listed Version 1 and Version 2 dimensional ranges. Key ratings include 100 V drain-source voltage, ±20 V gate-source voltage, 90 A continuous drain current at TC=25°C or TC=70°C with package limitation, and 240 A pulsed drain current at duty cycle ≤1%. Electrical parameters include maximum 0.0082 Ω RDS(on) at VGS=10 V and ID=20 A, typical 97 nC total gate charge, and -55 to +175°C junction and storage temperature ranges.

Specifications

TypeDescription
Part NumberSUM90N10-8M2P
ManufacturerVishay
Product TypeLDO Regulator
CategoryPower Management
Component TypeOther
Package / CaseTO-263 / D2PAK 3-lead; Version 1 dimensions approx. 8.636-9.652 mm D x 9.652-10.414 mm E x 4.064-4.826 mm A; Version 2 dimensions approx. 8.60-9.00 mm D x 10.15-10.55 mm E x 4.36-4.56 mm A
Drain-Source Voltage100 V; Absolute maximum, TC=25°C unless otherwise noted
Gate-Source Voltage±20 V; Absolute maximum, TC=25°C unless otherwise noted
Continuous Drain Current90 A; TC=25°C, TJ=175°C, package limited
Continuous Drain Current90 A; TC=70°C, TJ=175°C, package limited
Pulsed Drain Current240 A; Absolute maximum, duty cycle ≤1%
Avalanche Current60 A; Absolute maximum
Single Avalanche Energy180 mJ; L=0.1 mH
Maximum Power Dissipation300 W; TC=25°C; see SOA curve for voltage derating
Maximum Power Dissipation3.75 W; TA=25°C; mounted on 1 inch square PCB, FR4 material
Operating Junction Temperature Range-55 to +175 °C; Absolute maximum
Storage Temperature Range-55 to +175 °C; Absolute maximum
Junction-to-Ambient Thermal Resistance40 °C/W; PCB mount, 1 inch square PCB, FR4 material
Junction-to-Case Thermal Resistance0.5 °C/W; Drain case reference
Drain-Source Breakdown Voltagemin 100 V; VGS=0 V, ID=250 µA
Gate Threshold Voltagemin 2.5 V, max 4.5 V; VDS=VGS, ID=250 µA
Gate-Body Leakagemax ±250 nA; VDS=0 V, VGS=±20 V
Zero Gate Voltage Drain Currentmax 1 µA; VDS=100 V, VGS=0 V
Zero Gate Voltage Drain Currentmax 50 µA; VDS=100 V, VGS=0 V, TJ=125°C
Zero Gate Voltage Drain Currentmax 250 µA; VDS=100 V, VGS=0 V, TJ=150°C
On-State Drain Currentmin 70 A; VDS≥10 V, VGS=10 V; pulse test
Drain-Source On-State Resistancetyp 0.0067 Ω, max 0.0082 Ω; VGS=10 V, ID=20 A; pulse test
Drain-Source On-State Resistancetyp 0.0127 Ω, max 0.0170 Ω; VGS=10 V, ID=20 A, TJ=125°C; pulse test
Forward Transconductancetyp 62 S; VDS=15 V, ID=20 A; pulse test
Input Capacitancetyp 6290 pF; VGS=0 V, VDS=50 V, f=1 MHz
Output Capacitancetyp 535 pF; VGS=0 V, VDS=50 V, f=1 MHz
Reverse Transfer Capacitancetyp 182 pF; VGS=0 V, VDS=50 V, f=1 MHz
Total Gate Chargetyp 97 nC, max 150 nC; VDS=50 V, VGS=10 V, ID=85 A
Gate-Source Chargetyp 32 nC; VDS=50 V, VGS=10 V, ID=85 A
Gate-Drain Chargetyp 25 nC; VDS=50 V, VGS=10 V, ID=85 A
Gate Resistancemin 0.28 Ω, typ 1.4 Ω, max 2.8 Ω; f=1 MHz
Turn-On Delay Timetyp 23 ns, max 35 ns; VDD=50 V, ID≈85 A, VGEN=10 V, RL=0.588 Ω, Rg=1 Ω
Rise Timetyp 34 ns, max 52 ns; VDD=50 V, ID≈85 A, VGEN=10 V, RL=0.588 Ω, Rg=1 Ω
Turn-Off Delay Timetyp 17 ns, max 26 ns; VDD=50 V, ID≈85 A, VGEN=10 V, RL=0.588 Ω, Rg=1 Ω
Fall Timetyp 9 ns, max 18 ns; VDD=50 V, ID≈85 A, VGEN=10 V, RL=0.588 Ω, Rg=1 Ω
Source-Drain Diode Continuous Currentmax 85 A; TC=25°C
Source-Drain Diode Pulsed Currentmax 240 A; TC=25°C
Source-Drain Diode Forward Voltagetyp 0.85 V, max 1.5 V; IF=30 A, VGS=0 V; pulse test
Reverse Recovery Timetyp 61 ns, max 100 ns; IF=75 A, di/dt=100 A/µs
Peak Reverse Recovery Currenttyp 3 A, max 4.5 A; IF=75 A, di/dt=100 A/µs
Reverse Recovery Chargetyp 91 nC, max 130 nC; IF=75 A, di/dt=100 A/µs
ConfigurationSingle N-channel MOSFET; Product summary
PackageTO-263; Ordering information
Lead-Free Ordering Part NumberSUM90N10-8m2P-E3; Ordering information
Datasheet Statusrequest_only

Product Overview

The Vishay SUM90N10-8M2P is identified in the datasheet as a single N-channel power MOSFET for Power_Management use. Its absolute maximum ratings include 100 V drain-source voltage, ±20 V gate-source voltage, 90 A continuous drain current under specified case-temperature conditions, and 240 A pulsed drain current at duty cycle ≤1%.

The device is offered in a TO-263 / D2PAK 3-lead package. The extracted package data lists two dimensional versions: Version 1 at approximately 8.636-9.652 mm D, 9.652-10.414 mm E, and 4.064-4.826 mm A; and Version 2 at approximately 8.60-9.00 mm D, 10.15-10.55 mm E, and 4.36-4.56 mm A.

For conduction and switching review, the datasheet specifies drain-source on-state resistance of typ 0.0067 Ω and max 0.0082 Ω at VGS=10 V and ID=20 A, total gate charge of typ 97 nC and max 150 nC, and switching times measured at VDD=50 V and ID≈85 A. Thermal limits include 0.5°C/W junction-to-case resistance and 40°C/W junction-to-ambient resistance on a 1 inch square FR4 PCB.

Key Features

  • 100 V drain-source absolute maximum rating
  • ±20 V gate-source absolute maximum rating
  • 90 A continuous drain current, package limited
  • 240 A pulsed drain current at duty cycle ≤1%
  • 60 A avalanche current absolute maximum
  • 180 mJ single avalanche energy with 0.1 mH load
  • Maximum RDS(on) 0.0082 Ω at VGS=10 V
  • Typical total gate charge 97 nC
  • 0.5 °C/W junction-to-case thermal resistance
  • TO-263 / D2PAK 3-lead package

Typical Applications

  • Power MOSFET switching stages
  • 100 V drain-source designs
  • High-current power management circuits
  • Avalanche-rated switching applications
  • TO-263 PCB-mounted power assemblies
  • Circuits requiring source-drain diode recovery data

Procurement Notes

When requesting a quote for SUM90N10-8M2P, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.

FAQ

What type of device is SUM90N10-8M2P?

SUM90N10-8M2P is listed as a Vishay N-channel power MOSFET. The product summary identifies its configuration as a single N-channel MOSFET, and the ordering information lists the package as TO-263.

What voltage and current ratings define this MOSFET?

The extracted ratings specify 100 V drain-source voltage, ±20 V gate-source voltage, 90 A continuous drain current at TC=25°C or TC=70°C with package limitation, and 240 A pulsed drain current at duty cycle ≤1%.

What package is used for SUM90N10-8M2P?

The device uses a TO-263 / D2PAK 3-lead package. The extracted package data includes separate Version 1 and Version 2 dimensional ranges for D, E, and A dimensions.

What is the specified on-state resistance?

At VGS=10 V and ID=20 A under pulse-test conditions, drain-source on-state resistance is typ 0.0067 Ω and max 0.0082 Ω. At TJ=125°C under the same drive and current, it is typ 0.0127 Ω and max 0.0170 Ω.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 21, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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