TLV9002 Dual Rail-to-Rail Operational Amplifier

Texas Instruments Signal_Chain — specifications, applications, sourcing support and RFQ.

TLV9002 Dual Rail-to-Rail Operational Amplifier

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
TLV9002
Manufacturer
Texas Instruments
Package
SOIC-8 3.91 mm x 4.90 mm; WSON-8 2.00 mm x 2.00 mm; VSSOP-8 3.00 mm x 3.00 mm; SOT-23-8 1.60 mm x 2.90 mm; TSSOP-8 3.00 mm x 4.40 mm
Category
Signal Chain
Product Type
Operational Amplifier

Quick Sourcing Note

The TLV9002 from Texas Instruments is a Signal_Chain dual rail-to-rail operational amplifier with two channels for low-voltage analog designs. It operates from 1.8 V to 5.5 V supplies and is specified with +/-0.4 mV input offset voltage, 1 MHz unity-gain bandwidth, 27 nV/sqrt(Hz) broadband noise, 5 pA input bias current, and 60 uA/ch quiescent current. The device is unity-gain stable, includes an internal RFI and EMI filter, drives 500 pF capacitive loads, and has no phase reversal under overdrive. Package options include 8-pin SOIC, WSON, VSSOP, SOT-23, and TSSOP formats. A single-pole low-pass filter is shown as an example application.

Specifications

TypeDescription
Part NumberTLV9002
ManufacturerTexas Instruments
Product TypeOperational Amplifier
CategorySignal Chain
Number of channels2
Amplifier typelow-voltage operational amplifier
Input/output swingrail-to-rail input and output
Supply voltage range1.8 V to 5.5 V
Minimum operating supply voltage1.8 V
Input offset voltage+/-0.4 mV
Unity-gain bandwidth1 MHz
Broadband noise27 nV/sqrt(Hz)
Input bias current5 pA
Quiescent current per channel60 uA/ch
Stabilityunity-gain stable
RFI/EMI filteringinternal RFI and EMI filter
Capacitive-load drive500 pF
Open-loop output impedanceresistive
Overdrive behaviorno phase reversal
Shutdown mode availabilityavailable on TLV9002S
Shutdown currentless than 1 uA typical
Operating temperature range-40°C to 125°C
TLV9002 SOIC package8-pin SOIC, 3.91 mm x 4.90 mm
TLV9002 WSON package8-pin WSON, 2.00 mm x 2.00 mm
TLV9002 VSSOP package8-pin VSSOP, 3.00 mm x 3.00 mm
TLV9002 SOT-23 package8-pin SOT-23, 1.60 mm x 2.90 mm
TLV9002 TSSOP package8-pin TSSOP, 3.00 mm x 4.40 mm
Absolute maximum supply voltage7 V max
Example application circuitsingle-pole low-pass filter
Datasheet SourceManufacturer technical datasheet
Datasheet Statusrequest_only

Product Overview

TLV9002 is the dual-channel member of the Texas Instruments TLV900x low-voltage operational amplifier family. It provides rail-to-rail input and output operation across a 1.8 V to 5.5 V supply range, with operation supported at supply voltages as low as 1.8 V. Key electrical parameters include +/-0.4 mV input offset voltage, 1 MHz unity-gain bandwidth, 27 nV/sqrt(Hz) broadband noise, 5 pA input bias current, and 60 uA/ch quiescent current.

The amplifier is unity-gain stable and includes an internal RFI and EMI filter. It supports 500 pF capacitive-load drive, and its resistive open-loop output impedance is used to simplify stabilization with higher capacitive loads. Under overdrive conditions, the device has no phase reversal.

TLV9002 package options include 8-pin SOIC at 3.91 mm x 4.90 mm, 8-pin WSON at 2.00 mm x 2.00 mm, 8-pin VSSOP at 3.00 mm x 3.00 mm, 8-pin SOT-23 at 1.60 mm x 2.90 mm, and 8-pin TSSOP at 3.00 mm x 4.40 mm. The datasheet shows a single-pole low-pass filter as an example application.

Key Features

  • Dual-channel low-voltage operational amplifier
  • Rail-to-rail input and output operation
  • 1.8 V to 5.5 V supply range
  • +/-0.4 mV input offset voltage
  • 1 MHz unity-gain bandwidth
  • 27 nV/sqrt(Hz) broadband noise
  • 5 pA input bias current
  • 60 uA/ch quiescent current
  • Unity-gain stable with 500 pF capacitive-load drive
  • Internal RFI and EMI filter
  • No phase reversal under overdrive conditions
  • TLV9002S variant supports shutdown mode

Typical Applications

  • Single-pole low-pass filter
  • Low-voltage signal conditioning
  • Rail-to-rail analog buffering
  • Capacitive-load amplifier stages
  • Low-current dual-channel amplifier circuits

Procurement Notes

When requesting a quote for TLV9002, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For analog and signal-chain sourcing, supply voltage, bandwidth, accuracy, noise level, package, temperature grade, input/output configuration and qualification requirements should be verified before approval.

FAQ

How many amplifier channels does the TLV9002 include?

The TLV9002 is the dual-channel variant of the TLV900x family, so it includes two operational amplifier channels in the package options listed for the TLV9002 device.

What supply voltage range does the TLV9002 support?

The TLV9002 operates from a 1.8 V to 5.5 V supply range. The extracted datasheet facts also identify 1.8 V as the minimum operating supply voltage for normal operation.

What package options are listed for the TLV9002?

The TLV9002 is listed in 8-pin SOIC, WSON, VSSOP, SOT-23, and TSSOP packages, with sizes from 2.00 mm x 2.00 mm WSON to 3.91 mm x 4.90 mm SOIC.

Does the TLV9002 support rail-to-rail operation?

Yes. The TLV9002 is specified with rail-to-rail input and output operation, matching its product description as a dual rail-to-rail operational amplifier for low-voltage Signal_Chain designs.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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