Specifications
| Type | Description |
|---|---|
| Part Number | TMP006 |
| Manufacturer | Texas Instruments |
| Product Type | Infrared thermopile temperature sensor |
| Category | Sensor |
| Package Case | 8-pin DSBGA (YZF), 1.60 mm x 1.60 mm x 0.625 mm |
| Sensing Method | Integrated MEMS thermopile for noncontact temperature sensing; passive infrared energy from object |
| Infrared Wavelength Range | 4 um to 16 um; thermopile absorbs passive infrared energy within user-defined field of view |
| Local Die Temperature Sensor Accuracy | ±1 °C max, 0 °C to 60 °C |
| Local Die Temperature Sensor Accuracy | ±1.5 °C max, -40 °C to +125 °C |
| Interface Type | I2C and SMBus compatible two-wire serial interface |
| TMP006 Interface Voltage | 3.3 V two-wire interface voltage |
| TMP006B Interface Voltage | 1.8 V two-wire interface voltage |
| Programmable Addresses | 8 addresses; address selection via ADR0 and ADR1 pins |
| Supply Voltage Range | 2.2 V to 5.5 V |
| Recommended Supply Voltage | 2.5 V min, 3.3 V nom, 5.5 V max |
| Active Current | 240 uA typ, active operating mode |
| Shutdown Current | 1 uA max, shutdown mode |
| Operating Temperature Range | -40 °C to +125 °C |
| Die Temperature Limit | 125 °C max, TDIE |
| Object Temperature Range | Application dependent, TOBJ |
| Absolute Maximum Supply Voltage | 7 V max, V+ pin over operating free-air temperature range |
| Absolute Maximum ADR1 Input Voltage | -0.5 V min, VS + 0.5 V max |
| Absolute Maximum SDA/SCL/DRDY/ADR0 Input Voltage | -0.5 V min, +7 V max |
| Absolute Maximum Input Current | 10 mA max, input pins |
| Absolute Maximum Operating Range | -40 °C to +125 °C |
| Maximum Junction Temperature | +150 °C max, TJmax |
| Storage Temperature Range | -65 °C to +150 °C, Tstg |
| ESD Rating HBM | ±2000 V, human-body model, ANSI/ESDA/JEDEC JS-001 |
| ESD Rating CDM | ±500 V, charged-device model, JEDEC JESD22-C101 |
| ESD Rating Machine Model | ±200 V |
| Junction-to-Ambient Thermal Resistance | 123.8 °C/W, YZF DSBGA, 8 pins |
| Junction-to-Case Top Thermal Resistance | 69 °C/W, YZF DSBGA, 8 pins |
| Junction-to-Board Thermal Resistance | 103 °C/W, YZF DSBGA, 8 pins |
| Junction-to-Top Characterization Parameter | 4.7 °C/W, YZF DSBGA, 8 pins |
| Junction-to-Board Characterization Parameter | 55 °C/W, YZF DSBGA, 8 pins |
| Junction-to-Case Bottom Thermal Resistance | N/A, YZF DSBGA, 8 pins |
| DRDY Pin Function | Pin C2; data ready, active low, open-drain; requires pullup resistor to V+ |
| SCL Pin Function | Pin B3; serial clock line, open-drain; requires pullup resistor to V+ |
| SDA Pin Function | Pin C3; serial data line, open-drain; requires pullup resistor to V+ |
| ADR0 Pin Function | Pin C1; address select input |
| ADR1 Pin Function | Pin B1; address select input |
| AGND Pin Function | Pin A2; analog ground |
| DGND Pin Function | Pin A1; digital ground |
| V+ Pin Function | Pin A3; positive supply, 2.2 V to 5.5 V |
| ADC Resolution | 16-bit, simplified schematic signal path |
| Datasheet Status | request_only |
Product Overview
The TMP006 is a Texas Instruments infrared thermopile temperature sensor for noncontact temperature sensing. Its sensing path uses an integrated MEMS thermopile that absorbs passive infrared energy from an object within a user-defined field of view. The infrared wavelength range is 4 um to 16 um, and the simplified signal path includes a 16-bit ADC.
The device is supplied in an 8-pin DSBGA (YZF) package measuring 1.60 mm x 1.60 mm x 0.625 mm. Pin functions include V+ positive supply, analog ground, digital ground, serial clock, serial data, data-ready output, and two address-select inputs. SCL, SDA, and DRDY are open-drain pins that require pullup resistors to V+.
TMP006 operates from a 2.2 V to 5.5 V supply range, with recommended supply values of 2.5 V minimum, 3.3 V nominal, and 5.5 V maximum. It supports I2C and SMBus compatible communication, 8 programmable addresses through ADR0 and ADR1, 240 uA typical active current, and 1 uA maximum shutdown current.
Key Features
- Integrated MEMS thermopile for noncontact temperature sensing
- Absorbs passive infrared energy from objects
- 4 um to 16 um infrared wavelength range
- 16-bit ADC in the signal path
- I2C and SMBus compatible two-wire interface
- 8 programmable addresses via ADR0 and ADR1
- 2.2 V to 5.5 V supply range
- 240 uA typical active operating current
- 1 uA maximum shutdown current
- Open-drain SDA, SCL, and DRDY pins
Typical Applications
- Noncontact object temperature sensing
- Passive infrared energy measurement
- I2C temperature sensor nodes
- SMBus temperature sensor nodes
- Address-selectable sensor arrays
- Low-current shutdown sensor designs
- User-defined field-of-view sensing
Procurement Notes
When requesting a quote for TMP006, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For memory and storage sourcing, density, organization, speed grade, voltage, package, temperature grade, date code, lifecycle status and original packing condition should be verified before approval.
FAQ
What sensing method does the TMP006 use?
The TMP006 uses an integrated MEMS thermopile for noncontact temperature sensing. The thermopile absorbs passive infrared energy from an object within a user-defined field of view.
What interface does the TMP006 support?
The TMP006 uses an I2C and SMBus compatible two-wire serial interface. SDA and SCL are open-drain pins, and the datasheet facts specify that they require pullup resistors to V+.
What supply range is specified for TMP006?
The TMP006 feature summary gives a 2.2 V to 5.5 V supply range. Recommended operating conditions list 2.5 V minimum, 3.3 V nominal, and 5.5 V maximum.
How many addresses can TMP006 support?
TMP006 supports 8 programmable addresses. Address selection is handled through the ADR0 and ADR1 pins, which are listed as address select inputs in the pin function facts.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.