Specifications
| Type | Description |
|---|---|
| Part Number | TPS51620 |
| Manufacturer | Texas Instruments |
| Product Type | LDO Regulator |
| Category | Power Management |
| Package Case | RHA 40 VQFN, 6 x 6 mm, 0.5 mm pitch, 1 mm max height, plastic quad flatpack no-lead |
| Component Type | Power_IC |
| Target Application | Powering IMVP Mobile Processors; designed under Intel disclosure agreement |
| Disclosure Requirement | End user must have a current CNDA Agreement with Intel for access/use of device information |
| Information Contact | IMVP@list.ti.com for more information |
| TPS51620RHAR Package Type | VQFN |
| TPS51620RHAR Package Drawing | RHA |
| TPS51620RHAR Pin Count | 40 pins |
| TPS51620RHAR Standard Pack Quantity | 2500 |
| TPS51620RHAR Reel Diameter | 330.0 mm |
| TPS51620RHAR Reel Width W1 | 16.4 mm |
| TPS51620RHAR Tape Cavity A0 | 6.3 mm |
| TPS51620RHAR Tape Cavity B0 | 6.3 mm |
| TPS51620RHAR Tape Cavity K0 | 1.1 mm |
| TPS51620RHAR Tape Pitch P1 | 12.0 mm |
| TPS51620RHAR Carrier Tape Width W | 16.0 mm |
| TPS51620RHAR Pin 1 Tape Quadrant | Q2 |
| TPS51620RHAT Package Type | VQFN |
| TPS51620RHAT Standard Pack Quantity | 250 |
| TPS51620RHAT Reel Diameter | 180.0 mm |
| TPS51620RHAT Reel Width W1 | 16.4 mm |
| TPS51620RHAT Tape Cavity A0 | 6.3 mm |
| TPS51620RHAT Tape Cavity B0 | 6.3 mm |
| TPS51620RHAT Tape Cavity K0 | 1.1 mm |
| TPS51620RHAT Tape Pitch P1 | 12.0 mm |
| TPS51620RHAT Carrier Tape Width W | 16.0 mm |
| TPS51620RHAT Pin 1 Tape Quadrant | Q2 |
| TPS51620RHAR Tape and Reel Box Dimensions | 367.0 x 367.0 x 38.0 mm, length x width x height |
| TPS51620RHAT Tape and Reel Box Dimensions | 210.0 x 185.0 x 35.0 mm, length x width x height |
| Generic Package View | RHA 40 VQFN package family representation |
| Package Body Size | 6 x 6 mm |
| Package Pitch | 0.5 mm |
| Package Maximum Height | 1 mm max |
| Package Construction | Plastic quad flatpack - no lead |
| Datasheet Status | request_only |
Product Overview
TPS51620 is a Texas Instruments Power_Management device identified as an IMVP mobile processor power IC. Its target application is powering IMVP mobile processors, and the available technical information states that the device was designed under an Intel disclosure agreement.
The package representation is RHA 40 VQFN. The package body size is 6 x 6 mm with 0.5 mm pitch, 1 mm maximum height, and plastic quad flatpack no-lead construction. Device TPS51620RHAR is listed with package drawing RHA, VQFN package type, and 40 pins.
Tape-and-reel handling differs by ordering variant. TPS51620RHAR has a 2500 standard pack quantity on a 330.0 mm reel, while TPS51620RHAT has a 250 standard pack quantity on a 180.0 mm reel. Both variants use 16.4 mm reel width W1, 6.3 mm A0 and B0 tape cavities, 1.1 mm K0, 12.0 mm P1 tape pitch, 16.0 mm carrier tape width, and Q2 pin-1 tape quadrant orientation.
Key Features
- IMVP mobile processor power IC from Texas Instruments
- Designed for powering IMVP mobile processors
- Device information requires current Intel CNDA agreement
- RHA 40 VQFN package family representation
- 6 x 6 mm package body size
- 0.5 mm package pitch
- 1 mm maximum package height
- Plastic quad flatpack no-lead construction
- TPS51620RHAR supplied in 2500-unit standard pack
- TPS51620RHAT supplied in 250-unit standard pack
- Both variants use Q2 pin-1 tape quadrant
- Both variants use 16.0 mm carrier tape width
Typical Applications
- Powering IMVP mobile processors
- IMVP mobile processor power designs
- Intel CNDA-controlled processor power projects
- VQFN-based Power_Management assemblies
- Tape-and-reel automated assembly flows
Procurement Notes
When requesting a quote for TPS51620, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.
FAQ
What is the target application for TPS51620?
TPS51620 is identified as a Texas Instruments IMVP mobile processor power IC. The extracted datasheet facts state that its target application is powering IMVP mobile processors and that the device was designed under an Intel disclosure agreement.
What package is used for TPS51620?
TPS51620 is represented in the RHA 40 VQFN package family. The package body size is 6 x 6 mm, with 0.5 mm pitch, 1 mm maximum height, and plastic quad flatpack no-lead construction.
What access requirement applies to TPS51620 device information?
The extracted facts state that an end user must have a current CNDA Agreement with Intel for access or use of device information. The listed information contact for more details is IMVP@list.ti.com.
How do TPS51620RHAR and TPS51620RHAT packing quantities differ?
TPS51620RHAR is listed with a standard pack quantity of 2500 and a 330.0 mm reel diameter. TPS51620RHAT is listed with a standard pack quantity of 250 and a 180.0 mm reel diameter.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 13, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.