TPS51620 IMVP Mobile Processor Power IC

Specifications

Product Overview

TPS51620 is a Texas Instruments Power_Management device described as an IMVP mobile processor power IC. Its stated target application is powering IMVP mobile processors, and use of the device information is tied to Intel disclosure controls: the end user must have a current CNDA agreement with Intel under a strict disclosure agreement.

The TPS51620RHAR device option is listed in a VQFN package with RHA package drawing and 40 pins. The package case is a 40-pin VQFN (RHA) with a 6 x 6 mm body, 0.5 mm pitch, and 1 mm maximum height. The package description is plastic quad flatpack, no-lead.

Assembly and logistics data include tape-and-reel configurations. TPS51620RHAR is supplied in 2500-unit standard packs on a 330.0 mm reel with 16.4 mm reel width W1, 16.0 mm carrier tape width W, 6.3 mm A0 and B0 cavities, 1.1 mm K0 cavity, 12.0 mm P1 pitch, and Pin 1 in quadrant Q2. TPS51620RHAT is listed as a VQFN tape-and-reel option with 250-unit standard pack and 180.0 mm reel diameter.

Key Features

• IMVP mobile processor power IC from Texas Instruments
• Targeted for powering IMVP mobile processors
• Intel CNDA agreement required for end-user disclosure
• 40-pin VQFN package using RHA drawing
• 6 x 6 mm package body size
• 0.5 mm package pitch
• 1 mm maximum package height
• Plastic quad flatpack no-lead package construction
• TPS51620RHAR supplied in 2500-unit tape-and-reel packs
• TPS51620RHAT supplied in 250-unit tape-and-reel packs

Typical Applications

• Powering IMVP mobile processors
• Intel CNDA-controlled processor power designs
• VQFN-based power-management assemblies
• TPS51620RHAR tape-and-reel production builds
• TPS51620RHAT tape-and-reel evaluation builds

Procurement Notes

When requesting a quote for TPS51620, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.