Specifications
| Type | Description |
|---|---|
| Part Number | TXB0108_Level-Shifter |
| Manufacturer | Texas Instruments |
| Product Type | Level Shifter |
| Category | Logic |
| Package/Case | SON-20 2.00mm x 4.00mm; BGA MICROSTAR JUNIOR-20 2.50mm x 3.00mm; TSSOP-20 6.50mm x 4.40mm; VQFN-20 4.50mm x 3.50mm; DSGBA-20 1.90mm x 2.40mm; nFBGA-20 2.50mm x 3.00mm; WQFN-20 3.00mm x 3.00mm; VSSOP-20 5.10mm x 3.00mm; VQFN-20 4.50mm x 2.50mm |
| Datasheet Device Family | TXB0108 |
| Manufacturer Note | Texas Instruments; provided metadata lists CREE |
| Device Description | 8-bit noninverting bidirectional voltage-level translator with auto-direction sensing |
| A-Port Supply Voltage | 1.2 V to 3.6 V; VCCA <= VCCB |
| B-Port Supply Voltage | 1.65 V to 5.5 V |
| Voltage Translation Nodes | 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5 V; VCCA must not exceed VCCB |
| Output Enable Reference | OE input circuit referenced to VCCA |
| Output Enable Low Function | All outputs high-impedance |
| VCC Isolation Feature | All outputs high-impedance if either VCC input is at GND |
| Low Power Consumption | ICC max 4 μA |
| Partial-Power-Down Support | Ioff supports partial-power-down mode operation; outputs disabled to prevent damaging current backflow when powered down |
| Latch-Up Performance | >100 mA per JESD 78, Class II |
| Absolute Maximum VCCA | -0.5 V to 4.6 V |
| Absolute Maximum VCCB | -0.5 V to 6.5 V |
| Absolute Maximum Input Voltage | -0.5 V to 6.5 V |
| Absolute Maximum High-Impedance or Power-Off Output Voltage | -0.5 V to 6.5 V |
| Absolute Maximum Output Voltage, A Inputs | -0.5 V to VCCA + 0.5 V |
| Absolute Maximum Output Voltage, B Inputs | -0.5 V to VCCB + 0.5 V |
| Input Clamp Current | -50 mA when VI < 0 |
| Output Clamp Current | -50 mA when VO < 0 |
| Continuous Output Current | ±50 mA |
| Continuous Current Through Supply or Ground | ±100 mA through VCCA, VCCB, or GND |
| Storage Temperature Range | -65 °C to 150 °C |
| Junction Temperature | 150 °C |
| Operating Free-Air Temperature | -40 °C to 85 °C |
| High-Level Input Voltage, Data Inputs | VCCI x 0.65; VCCI is associated input-port supply |
| High-Level Input Voltage, OE | VCCA x 0.65 to 5.5 V |
| Low-Level Input Voltage, Data Inputs | 0 V to VCCI x 0.35; VCCI is associated input-port supply |
| Low-Level Input Voltage, OE | 0 V to VCCA x 0.35 |
| A-Port Input Transition Rise/Fall Rate | 40 ns/V |
| B-Port Input Transition Rise/Fall Rate | 40 ns/V at VCCB 1.65 V to 3.6 V |
| B-Port Input Transition Rise/Fall Rate | 30 ns/V at VCCB 4.5 V to 5.5 V |
| HBM ESD Rating, A Port | 2 kV per ANSI/ESDA/JEDEC JS-001 |
| HBM ESD Rating, B Port | ±15 kV per ANSI/ESDA/JEDEC JS-001 |
| CDM ESD Rating, A Port | 1 kV per JEDEC JESD22-C101 |
| CDM ESD Rating, A Port YZP Package | ±8 kV per JEDEC JESD22-C101, YZP package only |
| CDM ESD Rating, B Port | 1 kV per JEDEC JESD22-C101 |
| Junction-to-Ambient Thermal Resistance | PW 101.8 °C/W; RGY 35.3 °C/W; DQS 108.5 °C/W; YZP 66.2 °C/W; GXY 156.7 °C/W; ZXY 156.7 °C/W; NME 56.4 °C/W; RUK 58.8 °C/W; DGS 131.4 °C/W; RKS 111.9 °C/W |
| Junction-to-Case Top Thermal Resistance | PW 35.5 °C/W; RGY 42.1 °C/W; DQS 32.3 °C/W; YZP 0.4 °C/W; GXY 39.9 °C/W; ZXY 39.9 °C/W; NME 56.5 °C/W; RUK 59.1 °C/W; DGS 51.5 °C/W; RKS 63.9 °C/W |
| Junction-to-Board Thermal Resistance | PW 52.8 °C/W; RGY 11.1 °C/W; DQS 42.4 °C/W; YZP 52.0 °C/W; GXY 85.9 °C/W; ZXY 85.9 °C/W; NME 83.2 °C/W; RUK 30.5 °C/W; DGS 67 °C/W; RKS 31.6 °C/W |
| A-Port High-Level Output Voltage | 1.1 V min; DGS/RUK/RKS, VCCA 1.2 V, IOH = -20 μA, TA = 25 °C |
| A-Port High-Level Output Voltage | VCCA - 0.4 V min; DGS/RUK/RKS, VCCA 1.4 V to 3.6 V, IOH = -20 μA, TA = 25 °C |
| A-Port Low-Level Output Voltage | 0.3 V max; DGS/RUK/RKS, VCCA 1.2 V, IOL = 20 μA, TA = 25 °C |
| Pullup/Pulldown Resistor Guidance | >50 kΩ; 50 kΩ safe recommended value if pullup or pulldown resistors are needed for Logic I/O |
| Thermal Pad Connection | Connect exposed center thermal pad to ground for RKS/RGY/RUK packages |
| Datasheet Source | Manufacturer technical datasheet |
| Datasheet Status | request_only |
Product Overview
TXB0108_Level-Shifter is an Interface-category 8-bit noninverting bidirectional voltage-level translator with auto-direction sensing. The supplied CMS metadata lists CREE as the manufacturer, while the datasheet footer and product folder identify Texas Instruments for the TXB0108 device family. The device supports bidirectional translation across 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5 V logic nodes, with VCCA required not to exceed VCCB.
The A-port supply range is 1.2 V to 3.6 V, and the B-port supply range is 1.65 V to 5.5 V. The OE input circuit is referenced to VCCA; when OE is low, all outputs are high-impedance. The device also places all outputs in high-impedance if either VCC input is at GND, and Ioff circuitry supports partial-power-down operation by disabling outputs to prevent damaging current backflow.
Package coverage includes multiple 20-pin formats such as SON, BGA MICROSTAR JUNIOR, TSSOP, VQFN, DSGBA, nFBGA, WQFN, and VSSOP. For RKS, RGY, and RUK packages, the exposed center thermal pad should be connected to ground. Pullup or pulldown resistors, when needed for logic I/O, should be greater than 50 kΩ, with 50 kΩ listed as a safe recommended value.
Key Features
- 8-bit noninverting bidirectional voltage-level translation
- Auto-direction sensing for supported logic nodes
- A-port supply range from 1.2 V to 3.6 V
- B-port supply range from 1.65 V to 5.5 V
- OE input circuit referenced to VCCA
- Outputs high-impedance when OE is low
- VCC isolation when either supply is at GND
- Ioff support for partial-power-down operation
- ICC maximum current listed as 4 μA
- Latch-up performance greater than 100 mA
Typical Applications
- Logic voltage translation
- Mixed-voltage digital interfaces
- 1.2 V to 5 V logic links
- Bidirectional data bus translation
- Partial-power-down systems
- High-impedance controlled interfaces
- Compact 20-pin interface assemblies
Procurement Notes
When requesting a quote for TXB0108_Level-Shifter, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For MCU, processor and logic IC sourcing, package, operating voltage, temperature grade, speed or frequency grade, firmware or mask version, lifecycle status and programming requirements should be checked before approval.
FAQ
What type of interface device is TXB0108_Level-Shifter?
TXB0108_Level-Shifter is described as an 8-bit noninverting bidirectional voltage-level translator with auto-direction sensing. It is categorized as an Interface component and supports translation between listed logic voltage nodes when VCCA does not exceed VCCB.
What supply ranges are specified for the A and B ports?
The recommended A-port supply voltage is 1.2 V to 3.6 V with VCCA less than or equal to VCCB. The recommended B-port supply voltage is 1.65 V to 5.5 V.
What happens when the OE input is low?
The OE input circuit is referenced to VCCA. When OE is low, all outputs are placed in the high-impedance state according to the extracted device description and pin-function information.
Does the device support partial-power-down operation?
Yes. The extracted facts state that Ioff supports partial-power-down mode operation. The Ioff circuitry disables outputs to help prevent damaging current backflow when the device is powered down.
What assembly guidance is listed for exposed-pad packages?
For RKS, RGY, and RUK packages, the exposed center thermal pad should be connected to ground. This guidance applies specifically to those package options in the extracted facts.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.