UCC27200 120V Half-Bridge Gate Driver

Texas Instruments Power_Management — specifications, applications, sourcing support and RFQ.

UCC27200 120V Half-Bridge Gate Driver

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
UCC27200
Manufacturer
Texas Instruments
Package
D (SOIC, 8) 3.9 mm x 4.9 mm; DDA (PowerPAD SOIC, 8) 3.9 mm x 4.9 mm; DRM (VSON, 8) 4.0 mm x 4.0 mm
Category
Power Management
Product Type
LDO Regulator

Quick Sourcing Note

UCC27200 from Texas Instruments is a Power_Management 120V half-bridge gate driver for driving two N-channel MOSFETs in high-side and low-side configuration. It is offered in D SOIC-8, DDA PowerPAD SOIC-8, and DRM VSON-8 packages. Key parameters include 120 V maximum boot voltage, 20 V maximum VDD voltage, 3 A peak source and sink current, 22 ns typical propagation delay, and 1 ns typical delay matching. The device supports -5 V repetitive-pulse handling on HS, 50 V/ns maximum HS slew rate, and on-chip bootstrap diode operation for high-side drive supply support.

Specifications

TypeDescription
Part NumberUCC27200
ManufacturerTexas Instruments
Product TypeLDO Regulator
CategoryPower Management
Package / CaseD (SOIC, 8) 3.9 mm x 4.9 mm; DDA (PowerPAD SOIC, 8) 3.9 mm x 4.9 mm; DRM (VSON, 8) 4.0 mm x 4.0 mm
Driver configurationDrives two N-channel MOSFETs in high-side and low-side configuration
Maximum boot voltage120 V
Maximum VDD voltage20 V
Negative voltage handling on HS-5 V
Peak source current3 A; high-side and low-side gate drivers
Peak sink current3 A; high-side and low-side gate drivers
Typical propagation delay22 ns
Delay matching1 ns typ
Rise time8 ns; CLOAD=1000 pF
Fall time7 ns; CLOAD=1000 pF
Bootstrap diode forward voltage0.65 V typ; on-chip bootstrap diode
Bootstrap diode dynamic resistance, page 10.65 ohm typ; on-chip bootstrap diode
Input threshold type, UCC27200High-noise-immune CMOS input thresholds
Input threshold type, UCC27201TTL-compatible thresholds
HB pin functionHigh-side bootstrap supply; external bootstrap capacitor required; typical HB bypass capacitor 0.022 uF to 0.1 uF
VDD decoupling capacitor range0.22 uF to 1 uF; VDD to VSS
Absolute maximum VDD supply voltage-0.3 V to 20 V; with respect to VSS
Absolute maximum HI/LI input voltage-0.3 V to 20 V; with respect to VSS
Absolute maximum LO output voltage, DC-0.3 V to VDD + 0.3 V; with respect to VSS
Absolute maximum LO output voltage, repetitive pulse-2 V to VDD + 0.3 V; pulse <100 ns
Absolute maximum HO output voltage, DCVHS - 0.3 V to VHB + 0.3 V; with respect to VSS
Absolute maximum HO output voltage, repetitive pulseVHS - 2 V to VHB + 0.3 V; pulse <100 ns
Absolute maximum HS voltage, DC-1 V to 120 V; with respect to VSS
Absolute maximum HS voltage, repetitive pulse-5 V to 120 V; pulse <100 ns
Absolute maximum HB voltage-0.3 V to 120 V; with respect to VSS
Absolute maximum HB-HS voltage-0.3 V to 20 V
Operating junction temperature-40°C to 150°C; absolute maximum rating
Storage temperature-65°C to 150°C
ESD rating, HBM+/-2000 V; ANSI/ESDA/JEDEC JS-001
ESD rating, CDM+/-1000 V; JEDEC JESD22-C101
Recommended VDD supply voltage8 V min, 12 V nom, 17 V max; operating free-air temperature range
Recommended HS voltage-1 V min, 105 V max; operating free-air temperature range
Recommended HS voltage, repetitive pulse-5 V min, 110 V max; pulse <100 ns
Recommended HB voltageVHS + 8.0 V min, 115 V max; operating free-air temperature range
HS voltage slew rate50 V/ns max
Recommended junction temperature-40°C to 150°C
Thermal resistance junction-to-ambient, D SOIC112.5 °C/W; 8-pin D package
Thermal resistance junction-to-ambient, DDA PowerPAD SOIC44.8 °C/W; 8-pin DDA package
Thermal resistance junction-to-ambient, DRM VSON46.2 °C/W; 8-pin DRM package
VDD quiescent current0.11 mA typ, 0.8 mA max; VDD=VHB=12 V, VHS=VSS=0 V, no load, TA=TJ=-40°C to 150°C, VLI=VHI=0 V
VDD operating current1 mA typ, 3 mA max; f=500 kHz, CLOAD=0
Boot voltage quiescent current0.065 mA typ, 0.8 mA max; VLI=VHI=0 V
Boot voltage operating current0.9 mA typ, 3 mA max; f=500 kHz, CLOAD=0
HB to VSS quiescent current0.0005 uA typ, 1 uA max; VHS=VHB=105 V
HB to VSS operating current0.03 mA typ; f=500 kHz, CLOAD=0
UCC27200 input high threshold6 V min, 8 V max
UCC27200 input low threshold3 V min, 5.6 V max
UCC27200 input hysteresis0.4 V typ
UCC27200 input pulldown resistance100 kohm min, 200 kohm typ, 350 kohm max; VIN=3 V
UCC27201 input high threshold1.9 V min, 2.3 V typ, 2.7 V max
UCC27201 input low threshold1.3 V min, 1.6 V typ, 1.9 V max
UCC27201 input hysteresis0.7 V typ
UCC27201 input pulldown resistance68 kohm typ; VIN=3 V
VDD UVLO rising threshold6.2 V min, 7.1 V typ, 7.8 V max
VDD UVLO hysteresis0.5 V typ
VHB UVLO rising threshold5.8 V min, 6.7 V typ, 7.2 V max
VHB UVLO hysteresis0.4 V typ
Bootstrap diode low-current forward voltage0.65 V typ, 0.85 V max; I(VDD-HB)=100 uA
Bootstrap diode high-current forward voltage0.85 V typ, 1.1 V max; I(VDD-HB)=100 mA
Bootstrap diode dynamic resistance, electrical characteristics0.65 ohm typ, 1 ohm max; Delta VF / Delta I, I(VDD-HB)=120 mA and 100 mA
LO low-level output voltage0.1 V typ, 0.4 V max; ILO=100 mA
LO high-level output voltage drop0.13 V typ, 0.42 V max; ILO=-100 mA, VLOH=VDD-VLO
LO peak pullup current3 A typ; VLO=0 V; not production tested
LO peak pulldown current3 A typ; VLO=12 V; not production tested
HO low-level output voltage0.1 V typ, 0.4 V max; IHO=100 mA
HO high-level output voltage drop0.13 V typ, 0.42 V max; IHO=-100 mA, VHOH=VHB-VHO
HO peak pullup current3 A typ; VHO=0 V; not production tested
HO peak pulldown current3 A typ; VHO=12 V; not production tested
LI falling to LO falling propagation delay22 ns typ, 50 ns max; CLOAD=0 pF, from VLIT of LI to 90% of LO falling
HI falling to HO falling propagation delay22 ns typ, 50 ns max; CLOAD=0 pF, from VIT of HI to 90% of HO falling
LI rising to LO rising propagation delay22 ns typ, 50 ns max; CLOAD=0 pF, from VHIT of LI to 10% of LO rising
HI rising to HO rising propagation delay22 ns typ, 50 ns max; CLOAD=0 pF, from VHIT of HI to 10% of HO rising
Delay matching, LI ON HI OFF1 ns typ, 7 ns max
Delay matching, LI OFF HI ON1 ns typ, 7 ns max
LO rise time8 ns typ; CLOAD=1000 pF, 10% to 90%
HO rise time8 ns typ; CLOAD=1000 pF, 10% to 90%
LO fall time7 ns typ; CLOAD=1000 pF, 10% to 90%
HO fall time7 ns typ; CLOAD=1000 pF, 10% to 90%
LO rise time, heavy capacitive load0.26 us typ, 0.6 us max; CLOAD=0.1 uF, 3 V to 9 V
HO rise time, heavy capacitive load0.26 us typ, 0.6 us max; CLOAD=0.1 uF, 3 V to 9 V
LO fall time, heavy capacitive load0.22 us typ, 0.6 us max; CLOAD=0.1 uF, 9 V to 3 V
HO fall time, heavy capacitive load0.22 us typ, 0.6 us max; CLOAD=0.1 uF, 9 V to 3 V
Minimum LI input pulse width affecting output50 ns; minimum input pulse width that changes LO output
Minimum HI input pulse width affecting output50 ns; minimum input pulse width that changes HO output
Bootstrap diode turnoff time20 ns typ; IF=20 mA, IREV=0.5 A, TA=25°C; not production tested
Datasheet Statusrequest_only

Product Overview

The UCC27200 is a Texas Instruments 120V half-bridge gate driver in the Power_Management category. It drives two N-channel MOSFETs in a high-side and low-side configuration, with separate HO and LO outputs referenced to the bootstrap and low-side supply domains. The UCC27200 version uses high-noise-immune CMOS input thresholds, while the related UCC27201 uses TTL-compatible thresholds.

Electrical limits include 120 V maximum boot voltage, 20 V maximum VDD voltage, and -5 V repetitive-pulse handling on the HS node for pulses under 100 ns. Recommended operation specifies VDD from 8 V to 17 V, HS up to 105 V, repetitive HS pulses from -5 V to 110 V, and an HS slew rate up to 50 V/ns.

The driver provides 3 A typical peak pullup and pulldown current on both HO and LO. Timing specifications include 22 ns typical propagation delay, 1 ns typical delay matching, 8 ns rise time, and 7 ns fall time with 1000 pF load. Packages include SOIC-8, PowerPAD SOIC-8, and VSON-8 options for assembly needs.

Key Features

  • Drives two N-channel MOSFETs in half-bridge configuration
  • 120 V maximum boot voltage rating
  • 20 V maximum VDD supply voltage rating
  • 3 A peak source and sink gate-drive current
  • 22 ns typical propagation delay
  • 1 ns typical delay matching
  • 8 ns rise time with 1000 pF load
  • 7 ns fall time with 1000 pF load
  • On-chip bootstrap diode with 0.65 V typical forward voltage
  • High-noise-immune CMOS input thresholds for UCC27200

Typical Applications

  • High-side and low-side MOSFET drive
  • Half-bridge power stages
  • Synchronous power converter gate drive
  • Bootstrap-supplied high-side drive circuits
  • Fast switching N-channel MOSFET stages
  • PWM-driven power management circuits

Procurement Notes

When requesting a quote for UCC27200, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.

FAQ

What type of driver is the UCC27200?

The UCC27200 is a Texas Instruments 120V half-bridge gate driver. It drives two N-channel MOSFETs in a high-side and low-side configuration using HO and LO gate-driver outputs.

What supply voltage range is recommended for VDD?

The recommended VDD supply voltage is 8 V minimum, 12 V nominal, and 17 V maximum over the operating free-air temperature range. The absolute maximum VDD supply rating is -0.3 V to 20 V with respect to VSS.

What are the typical switching timing specifications?

Typical propagation delay is 22 ns, with 1 ns typical delay matching. With a 1000 pF load, the listed typical rise time is 8 ns and the typical fall time is 7 ns for the driver outputs.

Which packages are listed for the UCC27200?

The listed package options are D SOIC-8 at 3.9 mm x 4.9 mm, DDA PowerPAD SOIC-8 at 3.9 mm x 4.9 mm, and DRM VSON-8 at 4.0 mm x 4.0 mm.

What input threshold type applies to UCC27200?

The UCC27200 uses high-noise-immune CMOS input thresholds. Its listed input high threshold is 6 V minimum and 8 V maximum, and its input low threshold is 3 V minimum and 5.6 V maximum.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 13, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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