UCC27524 Dual Low-Side Gate Driver

Texas Instruments Power_Management — specifications, applications, sourcing support and RFQ.

UCC27524 Dual Low-Side Gate Driver

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
UCC27524
Manufacturer
Texas Instruments
Package
SOIC-8 D 4.90 mm x 3.91 mm; HVSSOP-8 DGN 3.00 mm x 3.00 mm; WSON-8 DSD 3.00 mm x 3.00 mm
Category
Power Management
Product Type
LDO Regulator

Quick Sourcing Note

UCC27524 from Texas Instruments is a Power_Management dual low-side gate driver with 2 independent non-inverting channels. It is offered in SOIC-8 D 4.90 mm x 3.91 mm, HVSSOP-8 DGN 3.00 mm x 3.00 mm, and WSON-8 DSD 3.00 mm x 3.00 mm packages. Key parameters include 5 A peak source and sink drive capability, a 4.5 V to 18 V recommended supply range, 17 ns typical propagation delay, 6 ns typical rise time, and 10 ns typical fall time. It suits dual-channel low-side gate-drive applications that require defined input, enable, UVLO, ESD, and thermal limits.

Specifications

TypeDescription
Part NumberUCC27524
ManufacturerTexas Instruments
Product TypeLDO Regulator
CategoryPower Management
Component TypePower_IC
Package / CaseSOIC-8 D 4.90 mm x 3.91 mm; HVSSOP-8 DGN 3.00 mm x 3.00 mm; WSON-8 DSD 3.00 mm x 3.00 mm
Gate Drive Channels2 independent channels; dual-channel device
Driver PolarityDual non-inverting; UCC27524 device
Peak Source Current5 A; gate-drive output capability
Peak Sink Current5 A; gate-drive output capability
Single Supply Range4.5 V to 18 V; recommended supply operating range
Typical Propagation Delay17 ns; typical condition
Typical Rise Time6 ns; typical condition
Typical Fall Time10 ns; typical condition
Typical Delay Matching1 ns; between two channels
Input Negative Voltage Capability-5 V; input pins, robustness feature
Operating Junction Temperature Range-40 degC to 150 degC; device operating junction temperature range
Supply Voltage Absolute Maximum-0.3 V to 20 V; VDD, over operating free-air temperature range
Output Voltage Absolute Maximum-0.3 V to VDD + 0.3 V; OUTA, OUTB DC voltage
Output Repetitive Pulse Voltage Absolute Maximum-2 V to VDD + 0.3 V; OUTA, OUTB, repetitive pulse less than 200 ns
Output Continuous Source/Sink Current Absolute Maximum0.3 A; IOUT_DC
Output Pulsed Source/Sink Current Absolute Maximum5 A; 0.5 us pulse, IOUT_pulsed
Input and Enable Voltage Absolute Maximum-5 V to 20 V; INA, INB, ENA, ENB; D and DGN packages
Input and Enable Voltage Absolute Maximum-0.3 V to 20 V; INA, INB, ENA, ENB; DSD package
Storage Temperature Range-65 degC to 150 degC; Tstg
HBM ESD Rating+/-2000 V; D and DGN packages, ANSI/ESDA/JEDEC JS-001
HBM ESD Rating+/-4000 V; DSD package, ANSI/ESDA/JEDEC JS-001
CDM ESD Rating+/-1000 V; JEDEC JESD22-C101
Recommended Supply Voltage4.5 V min, 12 V nom, 18 V max; VDD, recommended operating conditions
Recommended Operating Junction Temperature-40 degC to 140 degC; recommended operating conditions
Recommended Input Voltage-2 V to 18 V; INA, INB; D and DGN packages
Recommended Input Voltage0 V to 18 V; INA, INB; DSD package
Recommended Enable Voltage-2 V to 18 V; ENA, ENB
Junction-to-Ambient Thermal Resistance48.9 degC/W; DGN package, RthetaJA
Junction-to-Ambient Thermal Resistance126.4 degC/W; D package, RthetaJA
Junction-to-Ambient Thermal Resistance46.7 degC/W; DSD package, RthetaJA
VDD Quiescent Supply Current300 uA typ, 450 uA max; D/DGN, VINx=3.3 V, VDD=3.4 V, ENx=VDD
VDD Static Supply Current0.6 mA typ, 1.0 mA max; D/DGN, VINx=3.3 V, ENx=VDD
VDD Static Supply Current0.7 mA typ, 1.0 mA max; D/DGN, VINx=0 V, ENx=VDD
VDD Operating Current3.2 mA typ, 3.8 mA max; D/DGN, fSW=1000 kHz, ENx=VDD, VINx=0 V to 3.3 V PWM
VDD Disable Current0.8 mA typ, 1.1 mA max; D/DGN, VINx=3.3 V, ENx=0 V
Startup Current55 uA min, 110 uA typ, 175 uA max; DSD, VDD=3.4 V, INA=VDD, INB=VDD
Startup Current25 uA min, 75 uA typ, 145 uA max; DSD, VDD=3.4 V, INA=GND, INB=GND
VDD UVLO Rising Threshold3.8 V min, 4.1 V typ, 4.4 V max; D/DGN packages
VDD UVLO Falling Threshold3.5 V min, 3.8 V typ, 4.1 V max; D/DGN packages
VDD UVLO Hysteresis0.3 V typ; D/DGN packages
Supply Start Threshold3.91 V min, 4.2 V typ, 4.5 V max; DSD, TJ=25 degC
Supply Start Threshold3.7 V min, 4.2 V typ, 4.65 V max; DSD, TJ=-40 degC to 140 degC
Minimum Operating Voltage After Supply Start3.4 V min, 3.9 V typ, 4.4 V max; DSD, VOFF
Supply Voltage Hysteresis0.2 V min, 0.3 V typ, 0.5 V max; DSD, VDD_H
Input Signal High Threshold1.8 V min, 2.0 V typ, 2.3 V max; D/DGN, output high, ENx=HIGH
Input Signal Low Threshold0.8 V min, 1.0 V typ, 1.2 V max; D/DGN, output low, ENx=HIGH
Input Signal Hysteresis1 V typ; D/DGN, INA/INB
Input Pin Pulldown Resistor120 kOhm typ; D/DGN, INx=3.3 V
Input Signal High Threshold1.9 V min, 2.1 V typ, 2.3 V max; DSD, output high for non-inverting input pins
Input Signal Low Threshold1.0 V min, 1.2 V typ, 1.4 V max; DSD, output low for non-inverting input pins
Input Hysteresis0.7 V min, 0.9 V typ, 1.1 V max; DSD, INA/INB
Enable Signal High Threshold1.8 V min, 2.0 V typ, 2.3 V max; D/DGN, output high, INx=HIGH
Enable Signal Low Threshold0.8 V min, 1.0 V typ, 1.2 V max; D/DGN, output low, INx=HIGH
Enable Signal Hysteresis1 V typ; D/DGN, ENA/ENB
Enable Pin Pullup Resistance200 kOhm typ; D/DGN, ENx=0 V
Enable Signal High Threshold1.9 V min, 2.1 V typ, 2.3 V max; DSD, output enabled
Enable Signal Low Threshold0.95 V min, 1.15 V typ, 1.35 V max; DSD, output disabled
Enable Hysteresis0.7 V min, 0.95 V typ, 1.1 V max; DSD, ENA/ENB
Peak Output Source Current5 A; D/DGN, VDD=12 V, CVDD=10 uF, CL=0.1 uF, f=1 kHz
Peak Output Sink Current-5 A; D/DGN, VDD=12 V, CVDD=10 uF, CL=0.1 uF, f=1 kHz
Output Pullup Resistance5 Ohm typ, 8.5 Ohm max; D/DGN, IOUT=-50 mA
Output Pulldown Resistance0.6 Ohm typ, 1.1 Ohm max; D/DGN, IOUT=50 mA
Sink/Source Peak Current+/-5 A; DSD, CLOAD=0.22 uF, FSW=1 kHz
High Output Voltage Drop0.075 V typ; DSD, VDD-VOH, IOUT=-10 mA
Low Output Voltage0.01 V typ; DSD, IOUT=10 mA
Output Pullup Resistance2.5 Ohm min, 5 Ohm typ, 7.5 Ohm max; DSD, IOUT=-10 mA
Output Pulldown Resistance0.15 Ohm min, 0.5 Ohm typ, 1 Ohm max; DSD, IOUT=10 mA
Rise Time6 ns typ, 10 ns max; D/DGN, CLOAD=1.8 nF, 20% to 80%, VIN=0 V to 3.3 V
Fall Time10 ns typ, 14 ns max; D/DGN, CLOAD=1.8 nF, 90% to 10%, VIN=0 V to 3.3 V
Turn-On Propagation Delay17 ns typ, 27 ns max; D/DGN, CLOAD=1.8 nF, input rise at VINx_H to 10% output rise, VIN=0 V to 3.3 V, FSW=500 kHz, 50% duty cycle, TJ=125 degC
Datasheet Statusrequest_only

Product Overview

The UCC27524 is a Texas Instruments Power_Management IC configured as a dual low-side gate driver. It provides 2 independent channels with dual non-inverting driver polarity, supporting 5 A peak source current and 5 A peak sink current for gate-drive output operation.

The recommended VDD operating range is 4.5 V to 18 V, with 12 V nominal operation specified in the recommended conditions. Timing parameters include 17 ns typical propagation delay, 6 ns typical rise time, 10 ns typical fall time, and 1 ns typical delay matching between the two channels.

Package options include SOIC-8 D, HVSSOP-8 DGN, and WSON-8 DSD footprints. Thermal resistance is package dependent, with RthetaJA values of 126.4 degC/W for D, 48.9 degC/W for DGN, and 46.7 degC/W for DSD. The device supports low-side gate-drive assemblies where package size, operating junction temperature, input threshold behavior, enable control, UVLO behavior, and pulsed output current limits must be accounted for.

Key Features

  • 2 independent low-side gate-drive channels
  • Dual non-inverting driver polarity for UCC27524
  • 5 A peak source and sink drive capability
  • 4.5 V to 18 V recommended VDD range
  • 17 ns typical propagation delay
  • 6 ns typical rise time and 10 ns typical fall time
  • 1 ns typical delay matching between channels
  • -40 degC to 150 degC operating junction range
  • Input pins support -5 V negative voltage capability
  • SOIC-8, HVSSOP-8, and WSON-8 package options

Typical Applications

  • Dual low-side gate driving
  • Power MOSFET gate drive stages
  • PWM power switching circuits
  • Two-channel gate-drive assemblies
  • Enable-controlled power switching
  • Fast low-side switching outputs
  • Compact WSON gate-driver layouts

Procurement Notes

When requesting a quote for UCC27524, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.

FAQ

What type of device is the UCC27524?

The UCC27524 is a Texas Instruments dual low-side gate driver in the Power_Management category. It has 2 independent channels and uses dual non-inverting driver polarity.

What supply range is recommended for UCC27524 operation?

The recommended supply range is 4.5 V to 18 V, with 12 V listed as the nominal recommended VDD condition. Absolute maximum VDD is specified from -0.3 V to 20 V.

What output drive current does the UCC27524 support?

The device supports 5 A peak source current and 5 A peak sink current as gate-drive output capability. The absolute maximum pulsed source or sink current is also 5 A for a 0.5 us pulse.

Which package options are listed for the UCC27524?

Package options include SOIC-8 D at 4.90 mm x 3.91 mm, HVSSOP-8 DGN at 3.00 mm x 3.00 mm, and WSON-8 DSD at 3.00 mm x 3.00 mm.

What timing parameters are specified for the UCC27524?

Typical timing includes 17 ns propagation delay, 6 ns rise time, 10 ns fall time, and 1 ns typical delay matching between the two channels.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 13, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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