Specifications
| Type | Description |
|---|---|
| Part Number | XL-1606UBC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SMD LED, 1.7 x 0.6 x 1.1 mm |
| Outline Dimensions | 1.7 x 0.6 x 1.1 mm |
| Luminous Color | High brightness blue |
| Moisture Sensitivity Level | MSL 3 |
| Maximum Power Dissipation | 70 mW |
| Maximum Continuous Forward Current | 20 mA |
| Peak Forward Current | 80 mA |
| Maximum Reverse Voltage | 5 V |
| ESD Withstand Voltage | 2000 V |
| Operating Temperature Range | -40 to +85 °C |
| Storage Temperature Range | -40 to +85 °C |
| Lead Soldering Temperature/Time | 260°C, <=6 s |
| Luminous Intensity | 80 to 300 mcd |
| Dominant Wavelength | 460 to 475 nm |
| Peak Wavelength | 465 nm typ |
| Forward Voltage | 2.7 to 3.3 V |
| Viewing Angle | 120° typ |
| Half Wave Width | 25 nm typ |
| Reverse Current | <=5 µA |
| Brightness Bin D2 | 80 to 120 mcd |
| Brightness Bin D3 | 120 to 150 mcd |
| Brightness Bin D4 | 150 to 180 mcd |
| Brightness Bin D5 | 180 to 210 mcd |
| Brightness Bin D6 | 210 to 240 mcd |
| Brightness Bin D7 | 240 to 270 mcd |
| Brightness Bin D8 | 270 to 300 mcd |
| Voltage Bin N11-8 | 2.7 to 2.9 V |
| Voltage Bin N11-9 | 2.9 to 3.1 V |
| Voltage Bin N12-1 | 3.1 to 3.3 V |
| Wavelength Bin HB04 | 460 to 465 nm |
| Wavelength Bin HB05 | 465 to 470 nm |
| Wavelength Bin HB06 | 470 to 475 nm |
| Test Environment Temperature | 25 ±5 °C |
| General Dimension Tolerance | ±0.25 mm |
| Tape/Reel Dimension Tolerance | ±0.1 mm |
| Hand Soldering Iron Power | <30 W |
| Hand Soldering Temperature | <300°C |
| Maximum Reflow Count | 2 times |
| Recommended Maximum Welding Temperature | 240 ±5°C for 6 s |
| Post-Solder Cleaning | alcohol cleaning under 30°C for 3 min or under 50°C for 30 s |
| Ultrasonic Cleaning Power | <=300 W |
| Unopened Storage Condition | <=30°C, <60% RH, use within 1 year |
| Opened Storage Condition | <=30°C, <40% RH, solder within 168 hours / 7 days |
| Recommended Workshop Condition | <=30°C, <60% RH |
| Baking Condition | 60 ±5°C for 24 hours |
| Datasheet Status | request_only |
Product Overview
The XL-1606UBC is a XINGLIGHT high brightness blue SMD LED using a compact 1.7 x 0.6 x 1.1 mm outline. The datasheet identifies the luminous color as high brightness blue with transparent/water colloid construction, and specifies MSL 3 moisture sensitivity for handling control.
At IF=20 mA and Ta=25°C, the LED is specified for 80 to 300 mcd luminous intensity, 460 to 475 nm dominant wavelength, 465 nm typical peak wavelength, 2.7 to 3.3 V forward voltage, and 120° typical viewing angle. The half-wave width is 25 nm typical, and reverse current is limited to 5 µA maximum at VR=5 V.
Absolute maximum ratings include 70 mW power dissipation, 20 mA continuous forward current, 80 mA peak forward current under the stated pulse condition, 5 V reverse voltage, and 2000 V ESD withstand voltage. Operating and storage temperature ranges are both -40 to +85°C.
Assembly guidance covers 260°C lead soldering for up to 6 s, recommended reflow up to 240 ±5°C for 6 s, two maximum reflow cycles, and defined storage, baking, and cleaning limits for production handling.
Key Features
- 1.7 x 0.6 x 1.1 mm SMD LED package
- High brightness blue luminous color with transparent/water colloid construction
- 80 to 300 mcd luminous intensity at 20 mA
- 460 to 475 nm dominant wavelength range
- 2.7 to 3.3 V forward voltage at 20 mA
- 120° typical viewing angle at 20 mA
- 20 mA maximum continuous forward current rating
- 70 mW maximum power dissipation at 25°C
- MSL 3 moisture sensitivity level for handling
- Two maximum reflow soldering cycles specified
Typical Applications
- Blue status indicators
- Compact SMD indicator lighting
- Panel and keypad illumination
- Portable device indication
- Backlighting for small assemblies
- Equipment signal lamps
- Color-coded visual indication
Procurement Notes
When requesting a quote for XL-1606UBC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What package size does the XL-1606UBC use?
The XL-1606UBC is specified as an SMD LED with outline dimensions of 1.7 x 0.6 x 1.1 mm for length, width, and height.
What are the main optical specifications at 20 mA?
At IF=20 mA and Ta=25°C, the LED has 80 to 300 mcd luminous intensity, 460 to 475 nm dominant wavelength, 465 nm typical peak wavelength, and a 120° typical viewing angle.
What electrical ratings should be observed?
The datasheet lists 70 mW maximum power dissipation, 20 mA maximum continuous forward current, 80 mA peak forward current under the stated pulse condition, and 5 V maximum reverse voltage.
How should opened packages be handled before soldering?
After opening, the storage condition is <=30°C and <40% RH, with soldering within 168 hours or 7 days. Baking is specified at 60 ±5°C for 24 hours if moisture indication fades or storage time is exceeded.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 6, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.
