Specifications
| Type | Description |
|---|---|
| Part Number | XL-2106SURUGC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SMD LED, 2.0 x 0.6 x 1.0 mm |
| Outline Dimensions | 2.0 x 0.6 x 1.0 mm |
| Luminous Color | High brightness red and green bi-color |
| Lens / Colloid | Transparent colloid |
| Moisture Sensitivity Level | MSL 3 |
| RoHS Compliance | Complies with RoHS directive |
| Packaging Standard | EIA standard packaging |
| Process Compatibility | Suitable for SMT automatic production |
| Soldering Process Compatibility | Suitable for reflow soldering process |
| Power Dissipation - Red | 55 mW |
| Power Dissipation - Green | 75 mW |
| Peak Forward Current - Red | 80 mA |
| Peak Forward Current - Green | 80 mA |
| Forward Working Current - Red | 30 mA |
| Forward Working Current - Green | 30 mA |
| Reverse Voltage - Red | 5 V |
| Reverse Voltage - Green | 5 V |
| ESD Rating | 2000 V |
| Operating Ambient Temperature | -40°C to +85°C |
| Storage Temperature | -40°C to +85°C |
| Reflow Soldering Condition | 260°C, 6 s |
| Manual Soldering Condition | 300°C, 3 s |
| Luminous Intensity - Red | 80 min, 180 max mcd |
| Luminous Intensity - Green | 600 min, 1000 max mcd |
| Dominant Wavelength - Red | 620 min, 630 max nm |
| Dominant Wavelength - Green | 520 min, 530 max nm |
| Peak Wavelength - Red | 625 nm typ |
| Peak Wavelength - Green | 525 nm typ |
| Spectral Half Width - Red | 20 nm typ |
| Spectral Half Width - Green | 30 nm typ |
| Forward Voltage - Red | 1.9 min, 2.3 max V |
| Forward Voltage - Green | 2.6 min, 3.2 max V |
| Viewing Angle | 120 deg typ |
| Reverse Current - Red | 5 µA max |
| Reverse Current - Green | 5 µA max |
| Brightness Bin D2 | 80 to 100 mcd |
| Brightness Bin D3 | 100 to 150 mcd |
| Brightness Bin D4 | 150 to 180 mcd |
| Brightness Bin E6 | 600 to 700 mcd |
| Brightness Bin E7 | 700 to 800 mcd |
| Brightness Bin E8 | 800 to 900 mcd |
| Brightness Bin E9 | 900 to 1000 mcd |
| Voltage Bin N11-4 | 1.9 to 2.1 V |
| Voltage Bin N11-5 | 2.1 to 2.3 V |
| Voltage Bin N13-2 | 2.6 to 2.8 V |
| Voltage Bin N13-3 | 2.8 to 3.0 V |
| Voltage Bin N13-4 | 3.0 to 3.2 V |
| Wavelength Bin HR02 | 620 to 625 nm |
| Wavelength Bin HR03 | 625 to 630 nm |
| Wavelength Bin HG03 | 520 to 525 nm |
| Wavelength Bin HG04 | 525 to 530 nm |
| Test Environment Temperature | 25±5°C |
| Moisture Proof Grade Reliability Test | 0/22 failed LEDs |
| Lead-Free Reflow Reliability Test | 0/22 failed LEDs |
| Thermal Cycling Reliability Test | 0/22 failed LEDs |
| Thermal Shock Reliability Test | 0/22 failed LEDs |
| High Temperature Storage Reliability Test | 0/22 failed LEDs |
| Low Temperature Storage Reliability Test | 0/22 failed LEDs |
| Normal Temperature Aging Reliability Test | 0/22 failed LEDs |
| Failure Criterion - Forward Voltage | > U.S.L x 1.1 |
| Failure Criterion - Light Intensity | < L.S.L x 0.7 |
| Failure Criterion - Reverse Current | > U.S.L x 2.0 |
| Failure Criterion - Welding Reliability | Solder paste covering pads less than 95% |
| General Dimension Tolerance | ±0.25 mm |
| Tape/Reel Dimension Tolerance | ±0.15 mm |
| Recommended Manual Soldering Iron Power | Less than 30 W |
| Recommended Manual Soldering Temperature | Under 300°C |
| Maximum Number of Reflow Cycles | 2 times |
| Recommended Maximum Reflow Temperature | 240±5°C for 6 s |
| Cleaning With Alcohol | Under 30°C for 3 min or under 50°C for 30 s |
| Ultrasonic Cleaning Power | 300 W max recommended |
| Unopened Storage Condition | ≤30°C, <60% RH, use within 1 year |
| Opened Storage Condition | ≤30°C, <40% RH, solder within 168 h / 7 days |
| Recommended Workshop Condition | ≤30°C, <60% RH |
| Baking Condition | 60±5°C for 24 h |
| Datasheet Status | request_only |
Product Overview
At IF=20 mA and Ta=25°C, the red channel is specified at 80 to 180 mcd with 620 to 630 nm dominant wavelength, while the green channel is specified at 600 to 1000 mcd with 520 to 530 nm dominant wavelength. Typical peak wavelengths are 625 nm for red and 525 nm for green, with a 120 degree typical viewing angle for both colors.
The LED is suitable for SMT automatic production and reflow soldering. Absolute ratings include 30 mA forward working current per color, 80 mA peak forward current per color under pulse conditions, 5 V reverse voltage, and 2000 V antistatic ability. The operating and storage temperature ranges are both -40°C to +85°C.
Assembly guidance includes a maximum of two reflow cycles, recommended maximum reflow temperature of 240±5°C for 6 s, and manual soldering under 300°C for less than 3 s per terminal. These parameters fit compact red/green indication, SMT display assemblies, and panel status indicator designs.
Key Features
- Red and green bi-color SMD LED output
- 2.0 x 0.6 x 1.0 mm outline dimensions
- Transparent colloid lens for red and green LED
- 120 degree typical viewing angle at IF=20 mA
- Red luminous intensity from 80 to 180 mcd
- Green luminous intensity from 600 to 1000 mcd
- MSL 3 moisture sensitivity level
- Suitable for SMT automatic production
- Suitable for reflow soldering process
- RoHS directive compliant process
Typical Applications
- Red and green status indicators
- Compact SMT display assemblies
- Panel indication circuits
- Two-color signal indicators
- Automated SMT production designs
- Reflow-soldered LED boards
Procurement Notes
When requesting a quote for XL-2106SURUGC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package size does XL-2106SURUGC use?
XL-2106SURUGC uses an SMD LED package with outline dimensions of 2.0 x 0.6 x 1.0 mm. The general dimension tolerance is specified as ±0.25 mm unless otherwise noted.
What are the red and green luminous intensity ratings?
At IF=20 mA and Ta=25°C, the red channel is specified from 80 to 180 mcd, while the green channel is specified from 600 to 1000 mcd.
What soldering limits apply to this LED?
The absolute maximum reflow soldering condition is 260°C for 6 s, while the recommended maximum reflow temperature is 240±5°C for 6 s. Manual soldering is recommended under 300°C for less than 3 s per terminal.
How should opened XL-2106SURUGC packages be stored?
After opening, the storage condition is ≤30°C and <40% RH, with soldering within 168 h or 7 days. The recommended workshop condition after opening is ≤30°C and <60% RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 6, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.