Specifications
| Type | Description |
|---|---|
| Part Number | XL-2106UBC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 2.1 x 0.55 x 1.0 mm SMD LED |
| Outline Dimensions | 2.1 x 0.55 x 1.0 mm; L/W/H |
| Luminous Color | High brightness blue; transparent/water-clear colloid |
| Moisture Sensitivity Level | MSL 3; moisture sensitivity level |
| RoHS Compliance | Complies with RoHS Directive; environmental protection products |
| Maximum Power Dissipation | 70 mW; Ta=25°C |
| Maximum Continuous Forward Current | 20 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD Rating | 2000 V; antistatic ability, Ta=25°C |
| Operating Temperature Range | -40 to +85°C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85°C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature/Time | 260°C <=6 s; absolute maximum rating |
| Luminous Intensity | 80 to 300 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 460 to 475 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 465 nm typ; IF=20 mA, Ta=25°C |
| Forward Voltage | 2.7 to 3.3 V; IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Half Wave Width | 25 nm typ; IF=20 mA, Ta=25°C |
| Reverse Current | <=5 µA; VR=5 V, Ta=25°C |
| Brightness Bin D2 | 80 to 120 mcd; IF=20 mA |
| Brightness Bin D3 | 120 to 150 mcd; IF=20 mA |
| Brightness Bin D4 | 150 to 180 mcd; IF=20 mA |
| Brightness Bin D5 | 180 to 210 mcd; IF=20 mA |
| Brightness Bin D6 | 210 to 240 mcd; IF=20 mA |
| Brightness Bin D7 | 240 to 270 mcd; IF=20 mA |
| Brightness Bin D8 | 270 to 300 mcd; IF=20 mA |
| Voltage Bin N11-8 | 2.7 to 2.9 V; IF=20 mA |
| Voltage Bin N11-9 | 2.9 to 3.1 V; IF=20 mA |
| Voltage Bin N12-1 | 3.1 to 3.3 V; IF=20 mA |
| Wavelength Bin HB04 | 460 to 465 nm; IF=20 mA |
| Wavelength Bin HB05 | 465 to 470 nm; IF=20 mA |
| Wavelength Bin HB06 | 470 to 475 nm; IF=20 mA |
| Test Environment Temperature | 25 ±5°C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature and High Humidity Storage | 240 hours ±2 hours; Ta=85±5°C, RH=90-95%, IR-reflow in-board 2 times |
| High Temperature Storage | 1000 hours; Ta=85±5°C |
| Low Temperature Storage | 1000 hours; Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR-reflow in-board 2 times; 100±5°C 20 min, -40±5°C 20 min |
| Anti-tin Test | 260±5°C for 10±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C for 10-15 s; ramp <=3°C/s from 183°C to peak; 125±25°C <=120 s; above 183°C for 60-150 s; cooling <=6°C/s |
| Lead-free Process Reflow Peak Temperature | 255°C +0/-5°C for 5-10 s; ramp <=3°C/s from 217°C to peak; 175±25°C <=180 s; above 217°C for 60-120 s; cooling <=6°C/s |
| Weldability Test | 235±5°C, immersion time 2±0.5 s; immersion speed 25±2.5 mm/s; tin loading rate >=95% pad area |
| Forward Voltage Failure Criterion | > U.S.L * 1.1; IF=20 mA |
| Light Intensity Failure Criterion | < L.S.L * 0.7; IF=20 mA |
| Reverse Current Failure Criterion | > U.S.L * 2.0; VR=5 V |
| Dimensional Tolerance | ±0.25 mm; unless otherwise noted |
| Hand Soldering Iron Power | <30 W; recommended only for repair/rework |
| Hand Soldering Temperature | <300°C; each terminal once, less than 3 s |
| Maximum Reflow Count | 2 times; reflow soldering should not be done more than twice |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s; product recommendation |
| Cleaning Solvent | Alcohol; recommended after soldering |
| Cleaning Conditions | <=30°C for 3 min or <=50°C for 30 s; alcohol cleaning after soldering |
| Ultrasonic Cleaning Power | <=300 W; pretest cleaning conditions to confirm no LED damage |
| Unopened Storage Conditions | <=30°C, <=60% RH, use within 1 year; before opening moisture-proof anti-electrostatic package |
| Opened Storage Conditions | <=30°C, <=40% RH, solder within 168 hours; after opening package |
| Recommended Workshop Conditions | <=30°C, <=60% RH; product operation/workshop condition |
| Baking Conditions | 60±5°C for 24 hours; if moisture absorbent material has faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
XL-2106UBC is a XINGLIGHT high brightness blue LED supplied in a 2.1 x 0.55 x 1.0 mm SMD LED package. The datasheet identifies the luminous color as high brightness blue with transparent/water-clear colloid, and the component is listed as RoHS compliant with moisture sensitivity level MSL 3.
At IF=20 mA and Ta=25°C, the LED provides 80 to 300 mcd luminous intensity, 460 to 475 nm dominant wavelength, 465 nm typical peak wavelength, 25 nm typical half wave width, 2.7 to 3.3 V forward voltage, and 120° typical viewing angle. Reverse current is specified at <=5 µA with VR=5 V.
Assembly limits include a maximum of two reflow soldering passes, recommended maximum welding temperature of 240±5°C for 6 s, and hand soldering below 300°C for less than 3 s per terminal using an iron below 30 W. Storage guidance includes unopened storage at <=30°C and <=60% RH for use within one year, and opened-package soldering within 168 hours at <=30°C and <=40% RH.
Key Features
- 2.1 x 0.55 x 1.0 mm SMD LED package
- High brightness blue transparent/water-clear colloid
- 80 to 300 mcd at IF=20 mA
- 460 to 475 nm dominant wavelength range
- 2.7 to 3.3 V forward voltage range
- 120° typical viewing angle at IF=20 mA
- 20 mA maximum continuous forward current
- MSL 3 moisture sensitivity classification
- RoHS Directive compliance stated by manufacturer
- Two reflow soldering passes maximum
Typical Applications
- Blue status indicators
- Compact SMD indicator panels
- PCB-mounted signal lighting
- Blue wavelength visual indication
- Low-profile electronic displays
- Equipment front-panel indicators
- Assembly requiring reflow soldering
Procurement Notes
When requesting a quote for XL-2106UBC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package size does the XL-2106UBC use?
The XL-2106UBC uses a 2.1 x 0.55 x 1.0 mm SMD LED package, with the outline dimensions specified as length, width, and height. The dimensional tolerance is ±0.25 mm unless otherwise noted.
What are the main optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 80 to 300 mcd luminous intensity, 460 to 475 nm dominant wavelength, 465 nm typical peak wavelength, 25 nm typical half wave width, and 120° typical viewing angle.
What forward voltage range is specified for this LED?
The forward voltage range is 2.7 to 3.3 V at IF=20 mA and Ta=25°C. The voltage bins are N11-8 at 2.7 to 2.9 V, N11-9 at 2.9 to 3.1 V, and N12-1 at 3.1 to 3.3 V.
What storage handling applies after opening the package?
After opening the package, the datasheet specifies storage at <=30°C and <=40% RH, with soldering within 168 hours. If storage time is exceeded or the moisture absorbent material has faded, baking is specified at 60±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.