Specifications
| Type | Description |
|---|---|
| Part Number | XL-2106UGC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Component Type | LED |
| Package / Case | SMD LED, 2.1 x 0.55 x 1.0 mm |
| Outline Dimensions | 2.1 x 0.55 x 1.0 mm, L/W/H |
| Luminous Color | High brightness emerald green, transparent/water colloid |
| Lens / Colloid | Water colloid / transparent colloid |
| Moisture Sensitivity Level | MSL 3 |
| RoHS Compliance | Complies with RoHS Directive |
| Mounting / Assembly Compatibility | Suitable for SMT automatic production |
| Reflow Compatibility | Suitable for reflow soldering process |
| Maximum Power Dissipation | 70 mW, Ta=25°C |
| Maximum Continuous Forward Current | 20 mA, Ta=25°C |
| Peak Forward Current | 80 mA, pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V, Ta=25°C |
| ESD / Antistatic Ability | 2000 V, Ta=25°C |
| Operating Temperature Range | -40 to +85 °C |
| Storage Temperature Range | -40 to +85 °C |
| Lead Soldering Temperature / Time | 260°C <=6 s |
| Luminous Intensity | 600 to 1300 mcd, IF=20 mA, Ta=25°C |
| Dominant Wavelength | 515 to 530 nm, IF=20 mA, Ta=25°C |
| Peak Wavelength | 525 nm typ, IF=20 mA, Ta=25°C |
| Forward Voltage | 2.5 to 3.3 V, IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ, 2θ1/2, IF=20 mA, Ta=25°C |
| Half Wave Width | 30 nm typ, IF=20 mA, Ta=25°C |
| Reverse Current | <=5 µA, VR=5 V, Ta=25°C |
| Brightness Bin E6 | 600 to 700 mcd, IF=20 mA |
| Brightness Bin E7 | 700 to 800 mcd, IF=20 mA |
| Brightness Bin E8 | 800 to 900 mcd, IF=20 mA |
| Brightness Bin E9 | 900 to 1000 mcd, IF=20 mA |
| Brightness Bin F1 | 1000 to 1150 mcd, IF=20 mA |
| Brightness Bin F2 | 1150 to 1300 mcd, IF=20 mA |
| Voltage Bin N11-7 | 2.5 to 2.7 V, IF=20 mA |
| Voltage Bin N11-8 | 2.7 to 2.9 V, IF=20 mA |
| Voltage Bin N11-9 | 2.9 to 3.1 V, IF=20 mA |
| Voltage Bin N12-1 | 3.1 to 3.3 V, IF=20 mA |
| Dominant Wavelength Bin HG02 | 515 to 520 nm, IF=20 mA |
| Dominant Wavelength Bin HG03 | 520 to 525 nm, IF=20 mA |
| Dominant Wavelength Bin HG04 | 525 to 530 nm, IF=20 mA |
| Default Test Environment Temperature | 25 ±5 °C unless otherwise indicated |
| Outline Dimension Tolerance | ±0.25 mm unless otherwise noted |
| Hand Soldering Iron Power | <30 W recommended for repair/rework only |
| Hand Soldering Temperature | <300°C, each terminal once only, less than 3 s |
| Maximum Reflow Cycles | 2 times maximum |
| Recommended Maximum Welding Temperature | 240 ±5°C for 6 s |
| Cleaning Condition With Alcohol | <=30°C for 3 min or <=50°C for 30 s after soldering |
| Ultrasonic Cleaning Power | <=300 W generally recommended; pretest required |
| Unopened Storage Condition | <=30°C, <=60% RH, use within 1 year |
| Opened Storage Condition | <=30°C, <=40% RH, solder within 168 h / 7 days |
| Recommended Workshop Condition | <=30°C, <=60% RH |
| Baking Condition | 60 ±5°C for 24 h if desiccant/package failed or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
At IF=20 mA and Ta=25°C, the LED is specified for 600 to 1300 mcd luminous intensity, 515 to 530 nm dominant wavelength, 525 nm typical peak wavelength, 2.5 to 3.3 V forward voltage, 120° typical viewing angle, 30 nm typical half wave width, and reverse current of <=5 µA at VR=5 V. Absolute maximum ratings include 70 mW power dissipation, 20 mA continuous forward current, 80 mA peak forward current under the stated pulse condition, 5 V reverse voltage, and 2000 V ESD / antistatic ability.
The package is suitable for SMT automatic production and reflow soldering, with a maximum of two reflow cycles. Handling requirements include MSL 3 moisture sensitivity, unopened storage at <=30°C and <=60% RH for use within one year, and opened-package soldering within 168 h / 7 days at <=30°C and <=40% RH.
Key Features
- Emerald green SMD LED with transparent water colloid
- 2.1 x 0.55 x 1.0 mm outline dimensions
- 600 to 1300 mcd luminous intensity at 20 mA
- 515 to 530 nm dominant wavelength range
- 2.5 to 3.3 V forward voltage at 20 mA
- 120° typical viewing angle at 20 mA
- MSL 3 moisture sensitivity level
- Suitable for SMT automatic production
- Suitable for reflow soldering process
- RoHS Directive compliance stated
Typical Applications
- SMT automatic production
- Reflow soldering assemblies
- Emerald green light output
- Moisture-controlled LED production
- Repair or rework soldering
- Alcohol cleaning after soldering
Procurement Notes
When requesting a quote for XL-2106UGC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package size is specified for XL-2106UGC?
XL-2106UGC is specified as an SMD LED with 2.1 x 0.55 x 1.0 mm outline dimensions. The datasheet also states an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What are the optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, XL-2106UGC is specified for 600 to 1300 mcd luminous intensity, 515 to 530 nm dominant wavelength, 525 nm typical peak wavelength, 30 nm typical half wave width, and 120° typical viewing angle.
What soldering processes does XL-2106UGC support?
The datasheet states that XL-2106UGC is suitable for SMT automatic production and reflow soldering. It specifies two maximum reflow cycles, a recommended maximum welding temperature of 240 ±5°C for 6 s, and hand soldering only for repair or rework.
How should opened XL-2106UGC packages be stored?
After opening the package, the datasheet specifies storage at <=30°C and <=40% RH, with soldering within 168 hours or 7 days. The recommended workshop condition is <=30°C and <=60% RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.