Specifications
| Type | Description |
|---|---|
| Part Number | XL-3014BGWC-02 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SMD LED, 3.0 x 1.4 x 0.8 mm |
| Outline Dimensions | 3.0 x 1.4 x 0.8 mm; L/W/H |
| Luminous Color | Ice blue light; light yellow colloid |
| Colloid Color | Light yellow colloid; ice blue luminous color |
| RoHS Compliance | Complied with RoHS Directive; environmental protection products |
| Moisture Sensitivity Level | MSL 3; moisture sensitivity level |
| SMT Compatibility | Suitable for SMT automatic production; surface mount assembly |
| Reflow Compatibility | Suitable for infrared reflow soldering process; infrared reflow soldering |
| Maximum Power Dissipation | 200 mW; Ta=25°C |
| Maximum Continuous Forward Current | 60 mA; Ta=25°C |
| Peak Forward Current | 120 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD Antistatic Ability | 2000 V; Ta=25°C |
| Operating Temperature Range | -40 to +85°C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85°C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature/Time | 260°C <=6 s; Ta=25°C absolute maximum rating table |
| Luminous Flux | 8-13 lm; IF=60 mA, Ta=25°C |
| Color Temperature | Not specified; IF=60 mA, Ta=25°C |
| Chromaticity Coordinate X | Typ 0.18; IF=60 mA, Ta=25°C |
| Chromaticity Coordinate Y | Typ 0.17; IF=60 mA, Ta=25°C |
| Forward Voltage | 2.8-3.4 V; IF=60 mA, Ta=25°C |
| Color Rendering Index | Typ 70; IF=60 mA, Ta=25°C |
| Viewing Angle | Typ 120 deg; IF=60 mA, Ta=25°C, 2θ1/2 |
| Reverse Current | Max 5 µA; VR=5 V, Ta=25°C |
| Brightness Bin H6 | 8-10 lm; IF=60 mA |
| Brightness Bin H7 | 10-13 lm; IF=60 mA |
| Voltage Bin N13-3 | 2.8-3.0 V; IF=60 mA |
| Voltage Bin N13-4 | 3.0-3.2 V; IF=60 mA |
| Voltage Bin N13-5 | 3.2-3.4 V; IF=60 mA |
| Chromaticity Bin 1 Point 1 | x=0.1771, y=0.1590; chromatic coordinate bin 1 |
| Chromaticity Bin 1 Point 2 | x=0.1736, y=0.1469; chromatic coordinate bin 1 |
| Chromaticity Bin 1 Point 3 | x=0.1763, y=0.1374; chromatic coordinate bin 1 |
| Chromaticity Bin 1 Point 4 | x=0.1797, y=0.1496; chromatic coordinate bin 1 |
| Chromaticity Bin 2 Point 1 | x=0.1805, y=0.1712; chromatic coordinate bin 2 |
| Chromaticity Bin 2 Point 2 | x=0.1771, y=0.1590; chromatic coordinate bin 2 |
| Chromaticity Bin 2 Point 3 | x=0.1797, y=0.1496; chromatic coordinate bin 2 |
| Chromaticity Bin 2 Point 4 | x=0.1832, y=0.1617; chromatic coordinate bin 2 |
| Test Environment Temperature | 25±5°C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; text also states test at 20 mA |
| High Temperature and High Humidity Test | 240 hours ±2 hours; Ta=85±5°C, RH=90-95%, high IR-reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours; Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR-reflow in-board 2 times; 100±5°C 20 min to -40±5°C 20 min |
| Anti-Tin Test | 260±5°C for 10±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C; keep at peak for 10-15 s; ramp max 3°C/s; cooling max 6°C/s |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C; keep at peak for 5-10 s; ramp max 3°C/s; cooling max 6°C/s |
| Solderability Test | 235±5°C, immersion time 2±0.5 s; immersion speed 25±2.5 mm/s, tin loading rate >=95% pad area |
| Outline Dimension Tolerance | ±0.25 mm; unless otherwise noted |
| Tape/Reel Dimension Tolerance | ±0.1 mm; belt and disk dimensions, dimensions in mm |
| Hand Soldering Iron Power | <30 W; manual soldering recommended only for repair/rework |
| Hand Soldering Temperature | <300°C; each terminal less than 3 s, one time only |
| Maximum Reflow Count | 2 times; reflow soldering should not be done more than twice |
| Recommended Maximum Soldering Temperature | 240±5°C for 6 s; product recommended maximum welding temperature |
| Cleaning Condition With Alcohol | <=30°C for 3 min or <=50°C for 30 s; after soldering |
| Ultrasonic Cleaning Power | <=300 W; pretest recommended before ultrasonic cleaning |
| Unopened Storage Condition | <=30°C, <=60% RH, use within 1 year; before opening moisture-proof anti-electrostatic package |
| Opened Storage Condition | <=30°C, <40% RH, solder within 168 hours / 7 days; after opening package |
| Recommended Workshop Condition | <=30°C, <60% RH; after opening package |
| Baking Condition | 60±5°C for 24 hours; if moisture absorbent has faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
Handling and assembly limits include a maximum of two reflow cycles, recommended maximum soldering temperature of 240±5°C for 6 s, hand soldering below 300°C with an iron below 30 W, and opened-package storage at <=30°C and <40% RH with soldering within 168 hours. These parameters support use in compact surface-mount assemblies requiring ice blue LED output.
Key Features
- Ice blue luminous color with light yellow colloid
- 3.0 x 1.4 x 0.8 mm SMD LED package
- 8-13 lm luminous flux at 60 mA
- 2.8-3.4 V forward voltage at 60 mA
- Typ 120 degree viewing angle at 60 mA
- RoHS compliant according to manufacturer datasheet
- MSL 3 moisture sensitivity level
- Suitable for SMT automatic production
- Suitable for infrared reflow soldering process
- Maximum continuous forward current of 60 mA
Typical Applications
- SMT automatic production assemblies
- Infrared reflow soldered boards
- Ice blue indicator lighting
- Compact SMD LED layouts
- Moisture-controlled LED assembly
- Repair or rework hand soldering
Procurement Notes
When requesting a quote for XL-3014BGWC-02, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What package size does XL-3014BGWC-02 use?
XL-3014BGWC-02 uses an SMD LED package with outline dimensions of 3.0 x 1.4 x 0.8 mm. The datasheet lists an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What are the main optical ratings at 60 mA?
At IF=60 mA and Ta=25°C, the datasheet specifies 8-13 lm luminous flux, typ x=0.18 and y=0.17 chromaticity coordinates, typ CRI 70, and typ 120 degree viewing angle.
What soldering limits are specified for this LED?
The datasheet lists a maximum of two reflow soldering cycles and a recommended maximum welding temperature of 240±5°C for 6 s. Manual soldering is recommended only for repair or rework with an iron below 30 W and temperature below 300°C.
How should opened packages be stored before soldering?
After opening the package, the storage condition is <=30°C and <40% RH, with soldering within 168 hours or 7 days. The recommended workshop condition after opening is <=30°C and <60% RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 7, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.