Specifications
| Type | Description |
|---|---|
| Part Number | XL-3014UGC-01 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 3014 SMD LED, 3.0 x 1.4 x 0.8 mm |
| Outline Dimensions | 3.0 x 1.4 x 0.8 mm, L/W/H |
| Luminous Color | Green, transparent colloid |
| Moisture Sensitivity Level | MSL 3 |
| RoHS Compliance | Complied with RoHS Directive |
| Maximum Power Dissipation | 100 mW at Ta=25°C |
| Maximum Continuous Forward Current | 40 mA at Ta=25°C |
| Peak Forward Current | 100 mA, pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V at Ta=25°C |
| ESD Rating | 2000 V antistatic ability at Ta=25°C |
| Operating Temperature Range | -40 to +85 °C |
| Storage Temperature Range | -40 to +85 °C |
| Lead Soldering Temperature/Time | 260°C, <=6 s |
| Luminous Intensity / Flux | min 5 lm, max 8 lm at IF=40 mA, Ta=25°C |
| Dominant Wavelength | min 515 nm, max 530 nm at IF=40 mA, Ta=25°C |
| Peak Wavelength | typ 525 nm at IF=40 mA, Ta=25°C |
| Forward Voltage | min 2.8 V, max 3.4 V at IF=40 mA, Ta=25°C |
| Viewing Angle | typ 120°, 2θ1/2, IF=40 mA, Ta=25°C |
| Half Wave Width | typ 30 nm at IF=40 mA, Ta=25°C |
| Reverse Current | max 5 µA at VR=5 V, Ta=25°C |
| Brightness Bin H4 | 5 to 6 lm at IF=40 mA |
| Brightness Bin H5 | 6 to 8 lm at IF=40 mA |
| Voltage Bin N13-3 | 2.8 to 3.0 V at IF=40 mA |
| Voltage Bin N13-4 | 3.0 to 3.2 V at IF=40 mA |
| Voltage Bin N13-5 | 3.2 to 3.4 V at IF=40 mA |
| Wavelength Bin HG02 | 515 to 520 nm at IF=40 mA |
| Wavelength Bin HG03 | 520 to 525 nm at IF=40 mA |
| Wavelength Bin HG04 | 525 to 530 nm at IF=40 mA |
| Outline Dimension Tolerance | ±0.25 mm unless otherwise noted |
| Tape/Reel Dimensional Tolerance | ±0.1 mm for belt and disk dimensions |
| Recommended Hand Soldering Iron Power | <30 W for repair/rework |
| Hand Soldering Temperature | <300°C, each terminal once only, less than 3 s |
| Reflow Soldering Cycles | Maximum 2 times |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s |
| Alcohol Cleaning Condition | Under 30°C for 3 min or under 50°C for 30 s after soldering |
| Ultrasonic Cleaning Power | Max 300 W, pretest recommended before cleaning |
| Unopened Storage Condition | <=30°C, <60% RH, use within 1 year |
| Opened Storage Condition | <=30°C, <40% RH, solder within 168 hours / 7 days |
| Recommended Workshop Condition | <=30°C, <60% RH |
| Baking Condition | 60±5°C for 24 hours if moisture absorbent fades or LEDs exceed storage time |
| Datasheet Status | request_only |
Product Overview
XL-3014UGC-01 is a XINGLIGHT green transparent SMD LED built in a 3014 surface-mount package. The package outline is 3.0 x 1.4 x 0.8 mm with an outline dimension tolerance of ±0.25 mm unless otherwise noted.
Electrical ratings at Ta=25°C include 100 mW maximum power dissipation, 40 mA maximum continuous forward current, 100 mA peak forward current under pulsed conditions, 5 V maximum reverse voltage, and 2000 V ESD rating. Forward voltage is specified from 2.8 to 3.4 V at IF=40 mA, while reverse current is limited to 5 µA maximum at VR=5 V.
Optical characteristics at IF=40 mA include green emission with 515 to 530 nm dominant wavelength, 525 nm typical peak wavelength, 30 nm typical half wave width, and 120° typical viewing angle. The datasheet provides brightness, voltage, and wavelength bins for production selection.
Handling and assembly guidance includes MSL 3 moisture sensitivity, RoHS compliance, maximum two reflow cycles, hand soldering below 300°C for less than 3 s per terminal, and moisture-controlled storage after opening.
Key Features
- 3014 SMD package measuring 3.0 x 1.4 x 0.8 mm
- Green transparent colloid LED construction
- 515 to 530 nm dominant wavelength range
- 525 nm typical peak wavelength at 40 mA
- 5 to 8 lm luminous intensity/flux at 40 mA
- 2.8 to 3.4 V forward voltage at 40 mA
- 120° typical viewing angle
- MSL 3 moisture sensitivity level
- 2000 V ESD rating at Ta=25°C
- RoHS Directive compliance stated
Typical Applications
- Green status indicators
- Compact SMD indicator boards
- Backlighting using green emission
- Signal lighting assemblies
- Moisture-controlled SMT production
- Reflow-assembled LED modules
- Bin-selected wavelength assemblies
Procurement Notes
When requesting a quote for XL-3014UGC-01, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What package size does XL-3014UGC-01 use?
XL-3014UGC-01 uses a 3014 SMD LED package with outline dimensions of 3.0 x 1.4 x 0.8 mm. The datasheet states an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What are the main optical specifications at 40 mA?
At IF=40 mA and Ta=25°C, the LED has 515 to 530 nm dominant wavelength, 525 nm typical peak wavelength, 30 nm typical half wave width, and 120° typical viewing angle. Luminous intensity/flux is specified from 5 to 8 lm.
What electrical limits apply at Ta=25°C?
The absolute maximum ratings include 100 mW power dissipation, 40 mA continuous forward current, 100 mA peak forward current under specified pulse conditions, 5 V maximum reverse voltage, and 2000 V ESD rating.
How should opened packages be stored before soldering?
After opening the moisture-proof anti-static package, the datasheet specifies storage at <=30°C and <40% RH. The LEDs should be soldered within 168 hours, or 7 days, under those opened-package conditions.
What soldering limits are specified for repair or rework?
For hand soldering repair or rework, the recommended soldering iron power is below 30 W. The hand soldering temperature should be below 300°C, with each terminal soldered once only for less than 3 seconds.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 7, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.