XL-3014UYC-02 Yellow SMD LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-3014UYC-02 Yellow SMD LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-3014UYC-02
Manufacturer
XINGLIGHT
Package
SMD LED, 3.0 x 1.4 x 0.8 mm
Category
LED
Product Type
Yellow SMD LED

Quick Sourcing Note

XL-3014UYC-02 from XINGLIGHT is a yellow SMD LED in a 3.0 x 1.4 x 0.8 mm package. The device provides yellow light in a transparent/water colloid package and is specified for 600 to 1000 mcd luminous intensity at IF=60 mA and Ta=25°C. Key optical parameters include 585 to 595 nm dominant wavelength, 588 nm typical peak wavelength, 120° typical viewing angle, and 20 nm typical half wave width. Electrical ratings include 60 mA continuous forward current, 120 mA peak forward current, 1.8 to 2.4 V forward voltage, 5 V reverse voltage, and 200 mW maximum power dissipation.

Specifications

TypeDescription
Part NumberXL-3014UYC-02
ManufacturerXINGLIGHT
Product TypeYellow SMD LED
CategoryLED
Package / CaseSMD LED, 3.0 x 1.4 x 0.8 mm
Outline Dimensions3.0 x 1.4 x 0.8 mm; L/W/H
Luminous ColorYellow light; transparent/water colloid package
RoHS ComplianceComplies with RoHS Directive; environmental protection process
Moisture Sensitivity LevelMSL 3
Maximum Power Dissipation200 mW; Ta=25°C
Maximum Continuous Forward Current60 mA; Ta=25°C
Peak Forward Current120 mA; pulse width ≤0.1 ms, duty ≤1/10, Ta=25°C
Maximum Reverse Voltage5 V; Ta=25°C
ESD Withstand Voltage2000 V; antistatic ability, Ta=25°C
Operating Temperature Range-40 to +85 °C; Ta=25°C rating table
Storage Temperature Range-40 to +85 °C; Ta=25°C rating table
Lead Soldering Temperature/Time260°C, ≤6 s; absolute maximum rating
Luminous Intensity600 to 1000 mcd; IF=60 mA, Ta=25°C
Dominant Wavelength585 to 595 nm; IF=60 mA, Ta=25°C
Peak Wavelength588 nm typ; IF=60 mA, Ta=25°C
Forward Voltage1.8 to 2.4 V; IF=60 mA, Ta=25°C
Viewing Angle120° typ; 2θ1/2, IF=60 mA, Ta=25°C
Half Wave Width20 nm typ; IF=60 mA, Ta=25°C
Reverse Current≤5 µA; VR=5 V, Ta=25°C
Brightness Bin E6600 to 700 mcd; IF=60 mA
Brightness Bin E7700 to 800 mcd; IF=60 mA
Brightness Bin E8800 to 900 mcd; IF=60 mA
Brightness Bin E9900 to 1000 mcd; IF=60 mA
Voltage Bin N12-71.8 to 2.0 V; IF=60 mA
Voltage Bin N12-82.0 to 2.2 V; IF=60 mA
Voltage Bin N12-92.2 to 2.4 V; IF=60 mA
Dominant Wavelength Bin HY03585 to 587.5 nm; IF=60 mA
Dominant Wavelength Bin HY04587.5 to 590 nm; IF=60 mA
Dominant Wavelength Bin HY05590 to 592.5 nm; IF=60 mA
Dominant Wavelength Bin HY06592.5 to 595 nm; IF=60 mA
Test Environment Temperature25 ±5°C; unless otherwise indicated
Working Life Test1000 hours; continuous lighting at maximum rated current at room temperature; datasheet also states test at 20 mA
High Temperature High Humidity Storage Test240 hours ±2 hours; Ta=85 ±5°C, RH=90 to 95%, IR reflow in-board 2 times
High Temperature Storage Test1000 hours; Ta=85 ±5°C
Low Temperature Storage Test1000 hours; Ta=-40 ±5°C
Cold and Hot Cycle Test100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min
Hot and Cold Impact Test100 cycles; IR reflow in-board 2 times; 100 ±5°C for 20 min and -40 ±5°C for 20 min
Anti-Tin Test260 ±5°C for 10 ±1 s, 2 times; soldering temperature T.sol
Lead Process Reflow Peak Temperature235°C +5/-0°C; time at peak 10 to 15 s
Lead-Free Reflow Peak Temperature255°C +0/-5°C; time at peak 5 to 10 s
Solderability TestTin loading rate ≥95% pad area; T.sol=235 ±5°C, immersion speed 25 ±2.5 mm/s, immersion time 2 ±0.5 s
Dimension Tolerance±0.25 mm; unless otherwise noted
Carrier Tape Dimension Tolerance±0.1 mm; belt and disk dimensions
Hand Soldering Iron Power<30 W; recommended for repair/rework only
Hand Soldering Temperature<300°C; each terminal less than 3 s, one time only
Maximum Reflow Cycles2 times; reflow soldering
Recommended Maximum Welding Temperature240 ±5°C for 6 s; product recommendation
Cleaning ConditionAlcohol cleaning under 30°C for 3 min or under 50°C for 30 s; after soldering
Ultrasonic Cleaning Power≤300 W; pretest recommended before cleaning
Unopened Storage Condition≤30°C, <60% RH, use within 1 year; moisture-proof anti-electrostatic package with desiccant
Opened Storage Condition≤30°C, <40% RH, solder within 168 hours / 7 days; after opening package
Recommended Workshop Condition≤30°C, <60% RH; operation after opening package
Baking Condition60 ±5°C for 24 hours; if desiccant faded or LEDs exceeded storage time
Datasheet Statusrequest_only

Product Overview

The device is characterized at IF=60 mA and Ta=25°C with 600 to 1000 mcd luminous intensity, 585 to 595 nm dominant wavelength, 588 nm typical peak wavelength, and 120° typical viewing angle. Forward voltage is specified from 1.8 to 2.4 V, with reverse current limited to ≤5 µA at VR=5 V.

Absolute maximum ratings include 200 mW power dissipation, 60 mA continuous forward current, 120 mA peak forward current under pulse conditions, and 5 V maximum reverse voltage. Operating and storage temperature ranges are both -40 to +85°C.

Assembly guidance includes MSL 3 handling, a maximum of two reflow cycles, lead-free reflow peak temperature of 255°C +0/-5°C, and hand soldering below 300°C for less than 3 seconds per terminal. Storage guidance specifies unopened storage at ≤30°C and <60% RH within 1 year, and opened-package soldering within 168 hours / 7 days at ≤30°C and <40% RH.

Key Features

  • 3.0 x 1.4 x 0.8 mm SMD LED package
  • Yellow light in transparent/water colloid package
  • 600 to 1000 mcd luminous intensity at 60 mA
  • 585 to 595 nm dominant wavelength range
  • 1.8 to 2.4 V forward voltage at 60 mA
  • 120° typical viewing angle at 60 mA
  • 60 mA maximum continuous forward current
  • 120 mA peak forward current under pulse conditions
  • MSL 3 moisture sensitivity classification
  • RoHS Directive compliant environmental process
  • -40 to +85°C operating temperature range
  • Lead-free reflow peak temperature 255°C +0/-5°C

Typical Applications

  • Yellow status indication
  • SMD board-level indicators
  • Compact yellow signal lights
  • Wide-angle visual indication
  • RoHS-compliant LED assemblies
  • Reflow-soldered LED boards
  • Moisture-controlled SMT production

Procurement Notes

When requesting a quote for XL-3014UYC-02, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package size does XL-3014UYC-02 use?

XL-3014UYC-02 uses an SMD LED package with outline dimensions of 3.0 x 1.4 x 0.8 mm. The datasheet lists a general dimension tolerance of ±0.25 mm unless otherwise noted.

What color and wavelength are specified for this LED?

The device is specified as a yellow SMD LED. At IF=60 mA and Ta=25°C, its dominant wavelength is 585 to 595 nm, with a typical peak wavelength of 588 nm.

What current and voltage ratings apply to XL-3014UYC-02?

The maximum continuous forward current is 60 mA at Ta=25°C. Peak forward current is 120 mA for pulse width ≤0.1 ms and duty ≤1/10. Forward voltage is 1.8 to 2.4 V at IF=60 mA.

What handling and storage conditions are listed?

The LED is rated MSL 3. Unopened storage is specified at ≤30°C and <60% RH for use within 1 year. After opening, storage is ≤30°C and <40% RH, with soldering within 168 hours / 7 days.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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