XL-3014UYC-02FJ Yellow SMD LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-3014UYC-02FJ Yellow SMD LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-3014UYC-02FJ
Manufacturer
XINGLIGHT
Package
3014 SMD LED, 3.0 x 1.4 x 0.8 mm
Category
LED
Product Type
Yellow SMD LED

Quick Sourcing Note

XL-3014UYC-02FJ from XINGLIGHT is a yellow SMD LED in a 3014 package measuring 3.0 x 1.4 x 0.8 mm. It uses transparent water-colloid encapsulation and is specified for 1150 to 1800 mcd luminous intensity at IF=60 mA and Ta=25°C. Key optical and electrical parameters include 585 to 595 nm dominant wavelength, 590 nm typical peak wavelength, 1.8 to 2.4 V forward voltage, 120° typical viewing angle, and 20 nm typical half-wave width. The device is rated for 60 mA continuous forward current, 120 mA peak forward current under pulse limits, MSL 3 handling, and RoHS-compliant processing.

Specifications

TypeDescription
Part NumberXL-3014UYC-02FJ
ManufacturerXINGLIGHT
Product TypeYellow SMD LED
CategoryLED
Package / Case3014 SMD LED, 3.0 x 1.4 x 0.8 mm
Outline Dimensions3.0 x 1.4 x 0.8 mm; L/W/H
Luminous ColorYellow light; transparent/water colloid encapsulation
Colloid / Lens TypeWater colloid / transparent encapsulation; product characteristics
Moisture Sensitivity LevelMSL 3; moisture sensitivity level
RoHS ComplianceComplies with RoHS Directive; environmental protection process
Maximum Power Dissipation200 mW; Ta=25°C
Maximum Continuous Forward Current60 mA; Ta=25°C
Peak Forward Current120 mA; pulse width ≤0.1 ms, duty ≤1/10, Ta=25°C
Maximum Reverse Voltage5 V; Ta=25°C
ESD Withstand Voltage2000 V; antistatic ability, Ta=25°C
Operating Temperature Range-40 to +85 °C; Ta=25°C absolute maximum rating table
Storage Temperature Range-40 to +85 °C; Ta=25°C absolute maximum rating table
Lead Soldering Temperature / Time260°C, ≤6 s; absolute maximum rating
Luminous Intensity1150 to 1800 mcd; IF=60 mA, Ta=25°C
Dominant Wavelength585 to 595 nm; IF=60 mA, Ta=25°C
Peak Wavelength590 nm typ; IF=60 mA, Ta=25°C
Forward Voltage1.8 to 2.4 V; IF=60 mA, Ta=25°C
Viewing Angle120° typ; 2θ1/2, IF=60 mA, Ta=25°C
Half Wave Width20 nm typ; IF=60 mA, Ta=25°C
Reverse Current≤5 µA; VR=5 V, Ta=25°C
Brightness Bin F21150 to 1300 mcd; IF=60 mA
Brightness Bin F31300 to 1450 mcd; IF=60 mA
Brightness Bin F41450 to 1600 mcd; IF=60 mA
Brightness Bin F51600 to 1800 mcd; IF=60 mA
Voltage Bin N12-71.8 to 2.0 V; IF=60 mA
Voltage Bin N12-82.0 to 2.2 V; IF=60 mA
Voltage Bin N12-92.2 to 2.4 V; IF=60 mA
Wavelength Bin HY03585 to 587.5 nm; IF=60 mA
Wavelength Bin HY04587.5 to 590 nm; IF=60 mA
Wavelength Bin HY05590 to 592.5 nm; IF=60 mA
Wavelength Bin HY06592.5 to 595 nm; IF=60 mA
Standard Test Ambient Temperature25 ±5 °C; unless otherwise indicated
Working Life Test1000 hours; continuous lighting at maximum rated current at room temperature; text also states test at 20 mA
High Temperature High Humidity Storage Test240 hours ±2 hours; Ta=85 ±5°C, RH=90 to 95%, IR reflow in-board 2 times
High Temperature Storage Test1000 hours; Ta=85 ±5°C
Low Temperature Storage Test1000 hours; Ta=-40 ±5°C
Cold and Hot Cycle Test100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min
Hot and Cold Impact Test100 cycles; IR reflow in-board 2 times; 100 ±5°C for 20 min to -40 ±5°C for 20 min
Anti-tin Test260 ±5°C for 10 ±1 s, 2 times; soldering temperature T.sol
Lead Reflow Peak Temperature235°C +5/-0°C; lead process, keep at peak for 10 to 15 s
Lead-free Reflow Peak Temperature255°C +0/-5°C; lead-free process, keep at peak for 5 to 10 s
Recommended Maximum Welding Temperature240 ±5°C for 6 s; reflow soldering guidance
Maximum Reflow Count2 times; reflow soldering should not be done more than twice
Hand Soldering Iron Power<30 W; recommended for repair/rework only
Hand Soldering Temperature<300°C; each terminal less than 3 s, one time only
Alcohol Cleaning Condition≤30°C for 3 min or ≤50°C for 30 s; after soldering
Ultrasonic Cleaning Power≤300 W; pretest recommended before cleaning
Unopened Storage Condition≤30°C, <60% RH, use within 1 year; before opening moisture-proof anti-static package
Opened Storage Condition≤30°C, <40% RH, solder within 168 hours / 7 days; after opening package
Recommended Workshop Condition≤30°C, <60% RH; operation/workshop environment after opening
Baking Condition60 ±5°C for 24 hours; if moisture absorbent has faded or storage time exceeded
Datasheet Statusrequest_only

Product Overview

XL-3014UYC-02FJ is a XINGLIGHT yellow SMD LED built in a compact 3014 surface-mount package with 3.0 x 1.4 x 0.8 mm outline dimensions. The LED uses transparent water-colloid encapsulation and emits yellow light with a dominant wavelength range of 585 to 595 nm at IF=60 mA and Ta=25°C.

At the standard test condition of IF=60 mA and Ta=25°C, the device is specified for 1150 to 1800 mcd luminous intensity, 1.8 to 2.4 V forward voltage, 590 nm typical peak wavelength, 120° typical viewing angle, and 20 nm typical half-wave width. Absolute maximum ratings include 200 mW power dissipation, 60 mA continuous forward current, 120 mA peak forward current, 5 V reverse voltage, and 2000 V ESD withstand voltage.

Assembly and handling guidance includes MSL 3 moisture sensitivity, up to two reflow cycles, lead-free reflow peak temperature of 255°C +0/-5°C, and opened-package soldering within 168 hours under ≤30°C and <40% RH storage conditions.

Key Features

  • 3014 SMD package, 3.0 x 1.4 x 0.8 mm
  • Yellow emission with transparent water-colloid encapsulation
  • 1150 to 1800 mcd luminous intensity at 60 mA
  • 585 to 595 nm dominant wavelength range
  • 1.8 to 2.4 V forward voltage at 60 mA
  • 120° typical viewing angle at 60 mA
  • 60 mA maximum continuous forward current
  • 120 mA peak forward current under pulse limits
  • MSL 3 moisture sensitivity classification
  • RoHS Directive compliant process

Typical Applications

  • Yellow indicator lighting
  • Surface-mount status displays
  • Compact panel indicators
  • Signal and marking LEDs
  • PCB-mounted yellow emitters
  • Wide-angle visual indication

Procurement Notes

When requesting a quote for XL-3014UYC-02FJ, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package size is used by XL-3014UYC-02FJ?

XL-3014UYC-02FJ uses a 3014 SMD LED package with outline dimensions of 3.0 x 1.4 x 0.8 mm, specified as length, width, and height in the extracted datasheet facts.

What optical output is specified for this yellow SMD LED?

At IF=60 mA and Ta=25°C, the LED is specified for 1150 to 1800 mcd luminous intensity, 585 to 595 nm dominant wavelength, 590 nm typical peak wavelength, and 120° typical viewing angle.

What current and voltage limits apply to XL-3014UYC-02FJ?

The maximum continuous forward current is 60 mA at Ta=25°C. Peak forward current is 120 mA with pulse width ≤0.1 ms and duty ≤1/10. Maximum reverse voltage is 5 V.

What soldering guidance is provided for this LED?

The datasheet facts specify 260°C for ≤6 s as a lead soldering limit, a recommended maximum welding temperature of 240 ±5°C for 6 s, and no more than two reflow soldering cycles.

How should opened packages be stored before soldering?

After opening, the LED should be stored at ≤30°C and <40% RH, with soldering completed within 168 hours or 7 days. Baking is specified as 60 ±5°C for 24 hours if required.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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