Specifications
| Type | Description |
|---|---|
| Part Number | XL-3215UYC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 3.2 x 1.25 x 1.1 mm SMD package |
| Appearance Dimension | 3.2 x 1.25 x 1.1 mm; L/W/H |
| Luminous Color | High brightness yellow |
| Colloid / Lens | Transparent colloid |
| RoHS Compliance | Complies with RoHS directive |
| Moisture Sensitivity Level | MSL 3 |
| Mounting / Production Compatibility | Suitable for SMT automatic production |
| Soldering Process Compatibility | Suitable for reflow soldering process |
| Maximum Power Dissipation | 50 mW; Ta=25°C |
| Maximum Continuous Forward Current | 20 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD / Antistatic Ability | 2000 V; Ta=25°C |
| Operating Temperature Range | -40 to +85 °C |
| Storage Temperature Range | -40 to +85 °C |
| Lead Soldering Temperature / Time | 260°C <=6 s |
| Luminous Intensity | 50 to 180 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 585 to 595 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 590 nm typ; IF=20 mA, Ta=25°C |
| Forward Voltage | 1.7 to 2.3 V; IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; IF=20 mA, Ta=25°C; 2θ1/2 |
| Half Wave Width | 20 nm typ; IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA; VR=5 V, Ta=25°C |
| Brightness Bin D1 | 50 to 80 mcd; IF=20 mA; brightness error ±10% |
| Brightness Bin D2 | 80 to 120 mcd; IF=20 mA; brightness error ±10% |
| Brightness Bin D3 | 120 to 150 mcd; IF=20 mA; brightness error ±10% |
| Brightness Bin D4 | 150 to 180 mcd; IF=20 mA; brightness error ±10% |
| Voltage Bin N11-3 | 1.7 to 1.9 V; IF=20 mA; voltage error ±0.1 V |
| Voltage Bin N11-4 | 1.9 to 2.1 V; IF=20 mA; voltage error ±0.1 V |
| Voltage Bin N11-5 | 2.1 to 2.3 V; IF=20 mA; voltage error ±0.1 V |
| Wavelength Bin HY03 | 585 to 587.5 nm; IF=20 mA; wavelength error ±1 nm |
| Wavelength Bin HY04 | 587.5 to 590 nm; IF=20 mA; wavelength error ±1 nm |
| Wavelength Bin HY05 | 590 to 592.5 nm; IF=20 mA; wavelength error ±1 nm |
| Wavelength Bin HY06 | 592.5 to 595 nm; IF=20 mA; wavelength error ±1 nm |
| Default Test Environment Temperature | 25±5°C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature and High Humidity Storage Test | 240 hours ±2 hours; IR reflow in-board 2 times; Ta=85±5°C; RH=90 to 95% |
| High Temperature Storage Test | 1000 hours; Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100±5°C for 20 min; -40±5°C for 20 min |
| Anti-tin Test | 260±5°C, 10±1 s, 2 times; soldering temperature T.sol |
| Lead Reflow Peak Temperature | 235°C +5/-0°C; lead process; keep at peak for 10 to 15 s |
| Lead-free Reflow Peak Temperature | 255°C +0/-5°C; lead-free process; keep at peak for 5 to 10 s |
| Weldability Test Temperature | 235±5°C; immersion speed 25±2.5 mm/s; immersion time 2±0.5 s; tin loading rate >=95% pad area |
| Outline Dimension Tolerance | ±0.25 mm; unless otherwise noted |
| Hand Soldering Iron Power | <30 W; recommended only for repair/rework |
| Hand Soldering Temperature | <300°C; each terminal less than 3 s, one time only |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s; product recommendation |
| Maximum Reflow Cycles | 2 times; reflow soldering |
| Cleaning Condition | Alcohol cleaning under 30°C for 3 min or 50°C for 30 s; after soldering |
| Ultrasonic Cleaning Power | <=300 W; pretest cleaning conditions before use |
| Unopened Storage Condition | <=30°C, <=60% RH, use within 1 year; before opening package |
| Opened Storage Condition | <=30°C, <=40% RH, solder within 168 hours / 7 days; after opening package |
| Recommended Workshop Condition | <=30°C, <=60% RH; operation after package opening |
| Baking Condition | 60±5°C for 24 hours; if moisture absorbent has faded or LEDs exceeded storage time |
| Datasheet Status | request_only |
Product Overview
The XL-3215UYC is a XINGLIGHT high brightness yellow SMD LED built in a 3.2 x 1.25 x 1.1 mm L/W/H package. The device uses a transparent colloid lens and is documented as compliant with the RoHS directive. Its compact SMD format supports SMT automatic production and reflow soldering processes.
At IF=20 mA and Ta=25°C, the LED provides 50 to 180 mcd luminous intensity, a dominant wavelength range of 585 to 595 nm, and a typical peak wavelength of 590 nm. Electrical ratings include 1.7 to 2.3 V forward voltage, 20 mA maximum continuous forward current, 80 mA peak forward current under the specified pulse condition, and 5 V maximum reverse voltage.
Assembly and handling data include MSL 3 classification, 260°C soldering for up to 6 seconds, a maximum of two reflow cycles, and opened-package storage of up to 168 hours at <=30°C and <=40% RH. These facts support use in compact yellow indicator positions, SMT PCB assemblies, and reflow-processed visual signaling designs.
Key Features
- High brightness yellow luminous color
- 3.2 x 1.25 x 1.1 mm SMD package
- Transparent colloid lens construction
- Suitable for SMT automatic production
- Suitable for reflow soldering process
- MSL 3 moisture sensitivity classification
- 50 to 180 mcd at IF=20 mA
- 585 to 595 nm dominant wavelength
- 1.7 to 2.3 V forward voltage
- 120° typical viewing angle
Typical Applications
- Yellow visual indication
- SMT PCB indicator positions
- Reflow-assembled LED boards
- Compact status signal lamps
- Automated SMT production assemblies
- Moisture-controlled LED assembly workflows
Procurement Notes
When requesting a quote for XL-3215UYC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What package size does the XL-3215UYC use?
The XL-3215UYC uses a 3.2 x 1.25 x 1.1 mm SMD package. The datasheet lists this as the appearance dimension in length, width, and height.
What are the main optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the datasheet lists 50 to 180 mcd luminous intensity, 585 to 595 nm dominant wavelength, 590 nm typical peak wavelength, 120° typical viewing angle, and 20 nm typical half wave width.
What soldering and assembly processes are supported?
The device is suitable for SMT automatic production and reflow soldering. The datasheet lists a maximum of two reflow cycles, 260°C for <=6 s lead soldering, and product-recommended maximum welding temperature of 240±5°C for 6 s.
How should opened XL-3215UYC packages be stored?
After opening, the datasheet specifies storage at <=30°C and <=40% RH, with soldering within 168 hours or 7 days. The recommended workshop condition after package opening is <=30°C and <=60% RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.