Specifications
| Type | Description |
|---|---|
| Part Number | XL-3227RGB-RF |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SMD LED, 3.2 x 2.7 x 0.8 mm |
| Outline Dimensions | 3.2 x 2.7 x 0.8 mm; L/W/H |
| Luminous Color | RGB; transparent colloid |
| Moisture Sensitivity Level | MSL 3; specified as 3 levels |
| RoHS Compliance | Complied with RoHS Directive; environmental protection process |
| Packaging Standard | EIA standard packaging; manufacturer statement |
| Compatible Assembly Process | SMT automatic production; suitable for SMT automatic production |
| Compatible Soldering Process | Reflow soldering; suitable for reflow soldering process |
| Power Dissipation Red | 50 mW; absolute maximum rating, Ta=25°C |
| Power Dissipation Green | 70 mW; absolute maximum rating, Ta=25°C |
| Power Dissipation Blue | 70 mW; absolute maximum rating, Ta=25°C |
| Peak Forward Current Red | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Peak Forward Current Green | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Peak Forward Current Blue | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Forward Working Current Red | 20 mA; absolute maximum rating, Ta=25°C |
| Forward Working Current Green | 20 mA; absolute maximum rating, Ta=25°C |
| Forward Working Current Blue | 20 mA; absolute maximum rating, Ta=25°C |
| Reverse Voltage Red | 5 V; absolute maximum rating, Ta=25°C |
| Reverse Voltage Green | 5 V; absolute maximum rating, Ta=25°C |
| Reverse Voltage Blue | 5 V; absolute maximum rating, Ta=25°C |
| ESD Rating | 2000 V; absolute maximum rating, Ta=25°C |
| Operating Ambient Temperature | -40 to +85 °C; absolute maximum rating |
| Storage Temperature | -40 to +85 °C; absolute maximum rating |
| Reflow Soldering Limit | 260°C, 6 s; absolute maximum welding condition |
| Manual Soldering Limit | 300°C, 3 s; absolute maximum welding condition |
| Luminous Intensity Red | Typ 120 mcd; IF=20 mA, Ta=25°C |
| Luminous Intensity Green | Typ 550 mcd; IF=20 mA, Ta=25°C |
| Luminous Intensity Blue | Typ 150 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength Red | Typ 622 nm; IF=20 mA, Ta=25°C |
| Dominant Wavelength Green | Typ 520 nm; IF=20 mA, Ta=25°C |
| Dominant Wavelength Blue | Typ 465 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength Red | Typ 625 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength Green | Typ 525 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength Blue | Typ 465 nm; IF=20 mA, Ta=25°C |
| Half Wave Width Red | Typ 20 nm; IF=20 mA, Ta=25°C |
| Half Wave Width Green | Typ 30 nm; IF=20 mA, Ta=25°C |
| Half Wave Width Blue | Typ 25 nm; IF=20 mA, Ta=25°C |
| Forward Voltage Red | Min 1.9 V, Max 2.3 V; IF=20 mA, Ta=25°C |
| Forward Voltage Green | Min 2.6 V, Max 3.4 V; IF=20 mA, Ta=25°C |
| Forward Voltage Blue | Min 2.6 V, Max 3.4 V; IF=20 mA, Ta=25°C |
| Viewing Angle | Typ 120 deg; 2θ1/2, R/G/B, IF=20 mA, Ta=25°C |
| Reverse Current Red | Max 1 uA; VR=5 V, Ta=25°C |
| Reverse Current Green | Max 1 uA; VR=5 V, Ta=25°C |
| Reverse Current Blue | Max 1 uA; VR=5 V, Ta=25°C |
| Brightness Bin D2 | 80-120 mcd; IF=20 mA |
| Brightness Bin D3 | 120-150 mcd; IF=20 mA |
| Brightness Bin D4 | 150-180 mcd; IF=20 mA |
| Brightness Bin D5 | 180-210 mcd; IF=20 mA |
| Brightness Bin D6 | 210-240 mcd; IF=20 mA |
| Brightness Bin E3 | 450-500 mcd; IF=20 mA |
| Brightness Bin E4 | 500-550 mcd; IF=20 mA |
| Brightness Bin E5 | 550-600 mcd; IF=20 mA |
| Brightness Bin E6 | 600-700 mcd; IF=20 mA |
| Brightness Bin E7 | 700-800 mcd; IF=20 mA |
| Brightness Tolerance | ±10%; brightness grading |
| Voltage Bin N11-4 | 1.9-2.1 V; IF=20 mA |
| Voltage Bin N11-5 | 2.1-2.3 V; IF=20 mA |
| Voltage Bin N13-2 | 2.6-2.8 V; IF=20 mA |
| Voltage Bin N13-3 | 2.8-3.0 V; IF=20 mA |
| Voltage Bin N11-8 | 2.7-2.9 V; IF=20 mA |
| Voltage Bin N11-9 | 2.9-3.1 V; IF=20 mA |
| Voltage Tolerance | ±0.1 V; voltage grading |
| Wavelength Bin HR02 | 620-625 nm; IF=20 mA |
| Wavelength Bin HB04 | 460-465 nm; IF=20 mA |
| Wavelength Bin HB05 | 465-470 nm; IF=20 mA |
| Wavelength Bin HG03 | 520-525 nm; IF=20 mA |
| Wavelength Bin HG04 | 525-530 nm; IF=20 mA |
| Wavelength Bin HG05 | 530-535 nm; IF=20 mA |
| Wavelength Tolerance | ±1 nm; wavelength grading |
| Default Test Ambient Temperature | 25±5°C; unless otherwise indicated |
| Outline Dimension Tolerance | ±0.25 mm; unless otherwise noted |
| Belt and Reel Dimension Tolerance | ±0.15 mm; packaging dimensions |
| Recommended Hand Soldering Iron Power | <30 W; hand soldering for repair/rework |
| Hand Soldering Temperature | <300°C; each terminal once only, less than 3 s |
| Maximum Reflow Count | 2 times; reflow soldering |
| Recommended Maximum Soldering Temperature | 240±5°C for 6 s; product recommendation |
| Alcohol Cleaning Condition | Under 30°C for 3 minutes or under 50°C for 30 seconds; after soldering |
| Ultrasonic Cleaning Power | <=300 W; general maximum before pretest |
| Unopened Storage Condition | <=30°C, <60%RH, within 1 year; before opening package |
| Opened Storage Condition | <=30°C, <40%RH, solder within 168 hours; after opening package |
| Recommended Workshop Condition | <=30°C, <60%RH; operation after opening package |
| Baking Condition | 60±5°C for 24 hours; if desiccant faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
The XL-3227RGB-RF is a XINGLIGHT RGB SMD LED supplied in a 3.2 x 2.7 x 0.8 mm surface-mount package with transparent colloid. The package is specified for EIA standard packaging and is suitable for SMT automatic production, including reflow soldering.
At IF=20 mA and Ta=25°C, the device provides typical luminous intensity values of 120 mcd red, 550 mcd green, and 150 mcd blue. Typical dominant wavelengths are 622 nm red, 520 nm green, and 465 nm blue, with a typical viewing angle of 120 degrees for R/G/B operation.
Absolute maximum ratings include 20 mA forward working current per color, 80 mA peak forward current per color under pulsed conditions, and 5 V reverse voltage per color. The operating and storage temperature ranges are both -40 to +85°C. Handling and process data include MSL 3, a maximum reflow count of 2 times, recommended maximum soldering at 240±5°C for 6 seconds, and opened-package soldering within 168 hours at <=30°C and <40%RH.
Key Features
- RGB luminous color with transparent colloid
- 3.2 x 2.7 x 0.8 mm SMD outline
- Suitable for SMT automatic production
- Compatible with reflow soldering process
- MSL 3 moisture sensitivity level
- RoHS Directive compliant process
- Typical 120 degree R/G/B viewing angle
- 20 mA forward working current per color
- 5 V reverse voltage rating per color
- -40 to +85°C operating ambient range
Typical Applications
- RGB status indication
- Multicolor PCB indicators
- Compact surface-mount lighting
- Reflow-assembled LED boards
- SMT automatic production designs
Procurement Notes
When requesting a quote for XL-3227RGB-RF, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What package size is specified for XL-3227RGB-RF?
XL-3227RGB-RF is specified as an SMD LED with outline dimensions of 3.2 x 2.7 x 0.8 mm. The outline dimension tolerance is ±0.25 mm unless otherwise noted.
What are the typical RGB luminous intensity values?
At IF=20 mA and Ta=25°C, typical luminous intensity is 120 mcd for red, 550 mcd for green, and 150 mcd for blue according to the extracted datasheet values.
What soldering processes are listed for this LED?
The device is suitable for reflow soldering and SMT automatic production. The recommended maximum soldering temperature is 240±5°C for 6 seconds, and the maximum reflow count is 2 times.
How should opened packages be stored before soldering?
After opening the package, storage should be <=30°C and <40%RH, with soldering completed within 168 hours. The recommended workshop condition after opening is <=30°C and <60%RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.