XL-3227RGBC-WS2812B Addressable RGB LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-3227RGBC-WS2812B Addressable RGB LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-3227RGBC-WS2812B
Manufacturer
XINGLIGHT
Package
1209 SMD, 3.2 x 2.7 x 0.8 mm
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-3227RGBC-WS2812B from XINGLIGHT is an addressable RGB LED in a 1209 SMD package measuring 3.2 x 2.7 x 0.8 mm. It integrates an external single-line cascade constant-current IC inside the LED package and supports 800 Kbps data transmission with 24-bit GRB color data. Key parameters include 4.5-5.5 V normal VDD operation, 5 mA/channel preset constant current, 256-level grayscale control, 4.5 kHz typical output PWM frequency, and 120 degree typical viewing angle. It is suited for addressable RGB LED nodes, cascaded pixel arrays, and compact display lighting designs requiring defined timing and reflow assembly controls.

Specifications

TypeDescription
Part NumberXL-3227RGBC-WS2812B
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
Package / Case1209 SMD, 3.2 x 2.7 x 0.8 mm
Outline Dimensions3.2 x 2.7 x 0.8 mm; L/W/H
Luminous ColorRGB; transparent colloid
Environmental ComplianceRoHS compliant; environmental protection products complied with RoHS directive
Moisture Sensitivity LevelMSL 5
Integrated IC TypeExternal single-line cascade constant-current IC; integrated inside 1209 LED package
Data Transmission Frequency800 Kbps; screen refresh rate 30 fps, not less than 1024 points
Grayscale Resolution256 levels; PWM output port control
Port Scan Frequency1.5 kHz; output port PWM control
Preset Constant Current5 mA/channel; optimized preset constant-current mode
Constant Current Intra-chip Error<1.5%; high constant-current accuracy
Constant Current Inter-chip Error<3%; high constant-current accuracy
Normal Operating VDD Range4.5-5.5 V; built-in low-voltage reinforcement module, 100% functional
Supply Voltage Absolute Maximum3.5-5.5 V; Ta=25°C
Logic Input Voltage-0.5 to VDD+5.5 V; Ta=25°C absolute maximum rating
Output Port Withstand Voltage7 V; Ta=25°C absolute maximum rating
Operating Temperature-40 to +85 °C; absolute maximum rating
Storage Temperature-40 to +85 °C; absolute maximum rating
Reflow Soldering Temperature260 °C for 6 s; absolute maximum rating
ESD Sensitivity3000 V HBM; absolute maximum rating
Red Luminous Intensitytyp 90 mcd; Ta=25°C, IF=5 mA
Green Luminous Intensitytyp 380 mcd; Ta=25°C, IF=5 mA
Blue Luminous Intensitytyp 60 mcd; Ta=25°C, IF=5 mA
Red Dominant Wavelength620-630 nm; IF=5 mA, Ta=25°C
Green Dominant Wavelength520-530 nm; IF=5 mA, Ta=25°C
Blue Dominant Wavelength460-475 nm; IF=5 mA, Ta=25°C
Red Peak Wavelengthtyp 625 nm; Ta=25°C
Green Peak Wavelengthtyp 525 nm; Ta=25°C
Blue Peak Wavelengthtyp 470 nm; Ta=25°C
Half Intensity Viewing Angletyp 120 deg; 2θ1/2, Ta=25°C
Chip Power Supply Voltagemin 3.5 V, max 5.5 V; electrical parameters, Ta=25°C
Static Currenttyp 0.38 mA; VDD=5 V, IOUT off, Ta=25°C
Input High Threshold Voltagemin 2.3 V; DIN input high level, Ta=25°C
Input Low Threshold Voltagemax 1.5 V; DIN input low level, Ta=25°C
DOUT Output High Currenttyp 11 mA; DOUT output high, 10 ohm resistor to GND
DOUT Sink Currenttyp 13 mA; DOUT output low, supply current into DOUT
OUT RGB Output Currenttyp 5 mA; VDD=5 V, VDS=1 V
Output Current Variation vs VDStyp 0.5%; IOUT=5 mA, VDS=1.0-3.0 V
Output Current Variation vs VDDtyp 0.5%; IOUT=5 mA, VDD=4.5-5.5 V
Output Current Variation vs Temperaturetyp 5.0%; IOUT=5 mA, TA=-40°C to +85°C
Output PWM Frequencytyp 4.5 kHz; Iout=5 mA, OUT port through 200 ohm resistor to VDD, Ta=-40°C to +85°C
Signal Transmission Delay tPLHtyp 80 ns; DOUT load capacitance 30 pF, DIN to DOUT
Signal Transmission Delay tPHLtyp 80 ns; DOUT load capacitance 30 pF, DIN to DOUT
DOUT Conversion Time tTLHtyp 12 ns; DOUT load capacitance 30 pF
DOUT Conversion Time tTHLtyp 10 ns; DOUT load capacitance 30 pF
OUT RGB Rise Timetyp 500 ns; IOUTR/G/B=5 mA, OUTR/G/B port through 200 ohm resistor to VDD, load capacitance 30 pF
OUT RGB Fall Timetyp 500 ns; IOUTR/G/B=5 mA, OUTR/G/B port through 200 ohm resistor to VDD, load capacitance 30 pF
Data Structure24 bit; high-order bit first, GRB order
Color Data OrderGRB; 24-bit data structure, high order first
Input 0 Code High Level Timemin 0.2 us, typ 0.3 us, max 0.4 us; signal transmission definition
Input 1 Code High Level Timemin 0.7 us, typ 0.9 us, max 1.0 us; signal transmission definition
Input 0 Code Low Level Timemin 0.8 us, typ 0.9 us, max 20 us; signal transmission definition
Input 1 Code Low Level Timemin 0.2 us, typ 0.3 us, max 20 us; signal transmission definition
0/1 Code Cyclemin 1.2 us, max 20 us; signal transmission definition
Reset Code Low Level Time>200 us; signal transmission definition
Room Temperature Life Test1000 h, 22 samples, 0 failures; Ta=25°C ±5°C, IF=5 mA, JIS7021:B4
High Temperature Storage Test1000 h, 22 samples, 0 failures; Ta=85°C ±5°C, JIS7021:B10 / MIL-STD-202:210A / MIL-STD-750:2031
Low Temperature Storage Test1000 h, 22 samples, 0 failures; Ta=-35°C ±5°C, JIS7021:B12
High Temperature Humidity Test1000 h, 22 samples, 0 failures; Ta=85°C ±5°C, RH=85%, JIS7021:B11 / MIL-STD-202:103D
Cold/Heat Shock Test100 cycles, 22 samples, 0 failures; -10°C ±5°C to 100°C ±5°C, 30 min / 5 min / 5 min
Cold and Heat Cycle Test100 cycles, 22 samples, 0 failures; -35°C to 25°C to 85°C to -35°C, 30 min / 5 min / 30 min / 5 min
Reliability Criterion Forward Voltagemax initial data x 1.1; IF=5 mA
Reliability Criterion Reverse Currentmax 1 uA; VR=5 V
Reliability Criterion Luminous Intensitymin initial data x 0.7; IF=5 mA
Outline Dimension Tolerance±0.1 mm; unless otherwise noted
Tape and Reel Dimension Tolerance±0.25 mm; unless otherwise noted
Hand Soldering Iron Power<30 W; manual soldering for repair/rework only
Hand Soldering Temperature<300°C; each terminal less than 3 s, one time only
Maximum Reflow Count2 times; interval between second reflow soldering completed within 8 h
Recommended Maximum Soldering Temperature240 ±5°C for 6 s; product recommended maximum welding temperature
Cleaning With Alcohol30°C for 3 min or 50°C for 30 s; after soldering
Ultrasonic Cleaning Powermax 300 W; pretest required to confirm no LED damage
Unopened Shelf Life3 months; sealed moisture-proof anti-static bag with desiccant
Pre-opening Storage Condition≤30°C, ≤60% RH; before opening package
Post-opening Storage Condition≤30°C, ≤40% RH, use within 24 h; after opening package
Recommended Workshop Condition≤30°C, ≤60% RH; product operation environment
Baking Condition60 ±5°C for 24 h; if moisture absorbent faded or LEDs exceeded storage time
Signal Protection Resistor Range20 ohm to 2 kohm; series resistors R1/R2 at signal input/output
Recommended Signal Protection Resistorabout 500 ohm; typical suggested R1/R2 value
Datasheet Statusrequest_only

Product Overview

XL-3227RGBC-WS2812B is a XINGLIGHT addressable RGB LED built in a 1209 SMD package with 3.2 x 2.7 x 0.8 mm outline dimensions and RGB emission through transparent colloid. The device includes a single-line cascade constant-current IC within the LED package, allowing 24-bit high-order-first GRB data transmission.

Key Features

  • 1209 SMD package, 3.2 x 2.7 x 0.8 mm
  • RGB luminous color with transparent colloid construction
  • Integrated single-line cascade constant-current IC
  • 800 Kbps data transmission frequency
  • 24-bit high-order-first GRB data structure
  • 256-level grayscale PWM output port control
  • 5 mA/channel preset constant-current mode
  • 4.5-5.5 V normal operating VDD range
  • Typical 4.5 kHz output PWM frequency
  • Typical 120 degree half-intensity viewing angle
  • MSL 5 moisture sensitivity classification
  • RoHS compliant per datasheet statement

Typical Applications

  • Addressable RGB LED pixels
  • Cascaded LED display nodes
  • Compact RGB indicator assemblies
  • GRB serial color-control designs
  • Reflow-assembled LED modules
  • Low-current RGB lighting boards

Procurement Notes

When requesting a quote for XL-3227RGBC-WS2812B, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package is used for XL-3227RGBC-WS2812B?

XL-3227RGBC-WS2812B uses a 1209 SMD package with 3.2 x 2.7 x 0.8 mm outline dimensions. The datasheet also lists an outline dimension tolerance of ±0.1 mm unless otherwise noted.

What data format does this addressable RGB LED use?

The device uses a 24-bit data structure with high-order bit first transmission. Color data order is GRB, and the extracted timing data defines separate high and low times for input 0 and input 1 codes.

What supply voltage range is specified for operation?

The normal operating VDD range is 4.5-5.5 V. Electrical parameters list chip power supply voltage from minimum 3.5 V to maximum 5.5 V at Ta=25°C.

What current is preset for each RGB channel?

The datasheet states an optimized preset constant-current mode of 5 mA per channel. OUT RGB output current is also listed as typical 5 mA at VDD=5 V and VDS=1 V.

What soldering limits are provided for assembly?

The absolute maximum reflow soldering temperature is 260°C for 6 seconds. The recommended maximum soldering temperature is 240 ±5°C for 6 seconds, and the maximum reflow count is two times.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 1, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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